| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/22/2004 | DE10324919A1 Flachleiter Flat Head |
| 01/22/2004 | DE10228634A1 Oberflächenmontierbare Miniatur-Lumineszenz-und/oder Photo-Diode und Verfahren zu deren Herstellung A surface-mountable miniature luminescent and / or photo-diode and methods for their preparation |
| 01/22/2004 | DE10228385A1 Folienisolierter Flachleiter mit einem faltbaren Bereich Foil insulated flat conductor with a foldable area |
| 01/22/2004 | DE10228328A1 Elektronisches Bauelement mit einem Mehrlagensubstrat und Herstellungsverfahren An electronic device with a multi-layer substrate and manufacturing method |
| 01/21/2004 | EP1383365A1 Wiring board and soldering method therefor |
| 01/21/2004 | EP1383364A2 Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture |
| 01/21/2004 | EP1383363A2 Circuit board with directly mounted lamps |
| 01/21/2004 | EP1383362A2 Copper paste and wiring board using the same |
| 01/21/2004 | EP1383361A2 Copper paste, wiring board using the same, and production method of wiring board |
| 01/21/2004 | EP1383360A1 Injection moulded lead carrier and method of producing the same |
| 01/21/2004 | EP1382656A1 Heat-absorbing particle |
| 01/21/2004 | EP1382232A1 Protection of conductive connection by electrophoresis coating and structure formed thereof |
| 01/21/2004 | EP1382091A2 Connection housing for an electronic component |
| 01/21/2004 | EP1382048A2 Electrolytic capacitors and method for making them |
| 01/21/2004 | EP1381810A1 Flexible circuit board with led lighting |
| 01/21/2004 | EP1381579A1 Method for joining ceramic green bodies using a transfer tape and conversion of bonded green body into a ceramic body |
| 01/21/2004 | CN1470070A Electronic assembly comprising interposer with embedded capacitors and methods of manufacture |
| 01/21/2004 | CN1470069A Electronic assembly comprisnig substrate with embedded capacitors and methods of manufacture |
| 01/21/2004 | CN1469909A Curable composition, varnish, and layered product |
| 01/21/2004 | CN1469697A Method of fixing IC package onto circuit board |
| 01/21/2004 | CN1469696A Distributing base board, displaying device and method for producing distributing base board |
| 01/21/2004 | CN1469510A Connecting clamp of package board edge connector and connecting structure for package board edge connector |
| 01/21/2004 | CN1469460A Thin film bearing belt for assembling electronic parts |
| 01/21/2004 | CN1469444A Band composition and suppressing sintering method of low-temperature cobaking ceramic |
| 01/21/2004 | CN1469400A Inductor formed between two wiring layers |
| 01/21/2004 | CN1469353A Optical pickup equipment and disc equipment |
| 01/21/2004 | CN1469189A Camera |
| 01/21/2004 | CN1469186A Camera |
| 01/21/2004 | CN1468904A Heat convertible composition containing poly (arylidene ether), its producing process and products thereby |
| 01/21/2004 | CN1135912C Ceramic circuit base plate |
| 01/21/2004 | CN1135911C 柔性印制电路 Flexible printed circuit |
| 01/21/2004 | CN1135574C Composite magnetic material and its producing method and application |
| 01/21/2004 | CN1135533C Method for producing suspension device for magnetic head |
| 01/21/2004 | CN1135423C Liquid crystal device and electronic machine |
| 01/20/2004 | US6681375 Check system for wiring structure of printed circuit board |
| 01/20/2004 | US6681338 Method and system for reducing signal skew by switching between multiple signal routing layers |
| 01/20/2004 | US6681286 Control chipset having dual-definition pins for reducing circuit layout of memory slot |
| 01/20/2004 | US6681039 Fiducial mark search using sub-models |
| 01/20/2004 | US6680852 Color-coding technique for slot selection in bladed systems |
| 01/20/2004 | US6680759 Electrode structure of display panel and electrode forming method using dummy electrode |
| 01/20/2004 | US6680623 Information processing apparatus having a reduced signal distortion between a module and a memory |
| 01/20/2004 | US6680546 Electrical circuits |
| 01/20/2004 | US6680457 Reflowing of solder joints |
| 01/20/2004 | US6680441 Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device |
| 01/20/2004 | US6680218 Fabrication method for vertical electronic circuit package and system |
| 01/20/2004 | US6680123 Embedding resin |
| 01/20/2004 | US6678949 Process for forming a multi-level thin-film electronic packaging structure |
| 01/20/2004 | US6678948 Method for connecting electronic components to a substrate, and a method for checking such a connection |
| 01/20/2004 | US6678946 Method of manufacturing a circuit unit |
| 01/15/2004 | WO2004006637A1 Wiring pattern structure and method for forming bump |
| 01/15/2004 | WO2004006634A1 Ball grid array jumper |
| 01/15/2004 | WO2004006333A1 Multi electric device package |
| 01/15/2004 | WO2004006332A1 Modular board device and high frequency module and method for producing them |
| 01/15/2004 | WO2004006297A2 Low dielectric materials and methods of producing same |
| 01/15/2004 | WO2004006173A2 Method for the production of electrically-conducting connections on chipcards |
| 01/15/2004 | WO2004005413A1 Low sintering temperatures conductive nano-inks and a method for producing the same |
| 01/15/2004 | WO2003096777A3 Adapter for surface mount devices to through hole applications |
| 01/15/2004 | WO2003092045A3 Method for producing an electrical circuit |
| 01/15/2004 | WO2002095801A8 Improved connection assembly for integrated circuit sensors |
| 01/15/2004 | WO2002089319A3 Apparatus and method for tuning an inter-stage matching network of an integrated multistage amplifier |
| 01/15/2004 | US20040010638 Modular architecture for high bandwidth computers |
| 01/15/2004 | US20040010388 Method and apparatus for determining proper trace widths for printed circuit board of wireless test fixture |
| 01/15/2004 | US20040010113 Coonnecting integrated circuit chips; using pyromellitic dianhydride and phenylenediamine |
| 01/15/2004 | US20040009864 Comprising 15-35% barium, calcium, magnesium, lead, strontium oxides, 30-60% titanium oxide, 10-30% boron oxide, 1-7% phosphorus oxide, 0-3% lithium oxide and 2-16% rare earth oxides; for multilayer circuits |
| 01/15/2004 | US20040009727 Low loss dielectric material for printed circuit boards and integrated circuit chip packaging |
| 01/15/2004 | US20040009724 Method for identifying origin of and detecting defects in glass and quartz fiber products |
| 01/15/2004 | US20040009683 Method for connecting electronic device |
| 01/15/2004 | US20040009666 a die, an attached lead frame, and an encapsulating bow resistant plastic body |
| 01/15/2004 | US20040009333 Conductive paste and laminated ceramic electronic component |
| 01/15/2004 | US20040009291 Using halftone, layer of silver plasma is painted on surface of glass, glass is heated to fuse glass with silver plasma to form tempered glass circuit board which is then electroplated to prevent oxidation and circuit is attached |
| 01/15/2004 | US20040008982 Camera |
| 01/15/2004 | US20040008954 Packaging for optical transceiver module |
| 01/15/2004 | US20040008812 Ball grid array x-ray orientation mark |
| 01/15/2004 | US20040008531 Electronic device for supplying DC power and having noise filter mounted with excellent noise reduction |
| 01/15/2004 | US20040008498 IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC module |
| 01/15/2004 | US20040008495 Printed circuit board assembly |
| 01/15/2004 | US20040008492 Electronic component and the method of using it |
| 01/15/2004 | US20040008470 Mounting structure for two-terminal capacitor and three-terminal capacitor |
| 01/15/2004 | US20040008466 Multi-functional energy conditioner |
| 01/15/2004 | US20040008332 Exposure device |
| 01/15/2004 | US20040007770 Semiconductor-mounting substrate used to manufacture electronic packages, and production process for producing such semiconductor-mounting substrate |
| 01/15/2004 | US20040007768 Field programmable gate array assembly |
| 01/15/2004 | US20040007762 Method for fabricating adaptor for aligning and electrically coupling circuit devices having dissimilar connectivity patterns |
| 01/15/2004 | US20040007386 Structure of printed circuit board (PCB) |
| 01/15/2004 | US20040007384 Electronic device |
| 01/15/2004 | US20040007376 Integrated thermal vias |
| 01/15/2004 | US20040007313 Selectively roughening conductors for high frequency printed wiring boards |
| 01/15/2004 | DE20317098U1 Electrical connector module for IEEE and USB standards has printed circuit board with a number of different connectors provided |
| 01/15/2004 | DE20213767U1 Electrical equipment, has electronic control systems that have circuits on fixed circuit boards and also on flexible printed circuit strip |
| 01/15/2004 | DE10329650A1 Eine Schaltung bildendes Bauteil und Schaltungseinheit A circuit-forming component and circuit unit |
| 01/15/2004 | DE10318589A1 Leiterplattenanordnung Printed circuit board assembly |
| 01/15/2004 | DE10229902A1 Verfahren zur Herstellung von elektrisch leitfähigen Verbindungen auf Chipkarten A process for the production of electrically conductive connections on chip cards |
| 01/15/2004 | DE10228593A1 Elektronisches Bauteil mit einer Gehäusepackung Electronic device having a housing package |
| 01/15/2004 | DE10228373A1 Verfahren zur Herstellung einer elektrischen Verbindung zwischen Bauelementen einer Chipkarte A method for making an electrical connection between components of a smart card |
| 01/15/2004 | DE10227658A1 Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat A metal-ceramic substrate for electrical circuits -or- modules, method of making such a substrate and module substrate having such a |
| 01/15/2004 | DE10227310A1 Halbleiter-Schaltvorrichtung Semiconductor switching device |
| 01/14/2004 | EP1381259A1 Structure of printed circuit board (PCB) |
| 01/14/2004 | EP1381258A1 High-frequency module |
| 01/14/2004 | EP1381164A1 A system for the management of radio communications in a motor vehicle, including a plug-in electronic module for receiving and transmitting radio signals |
| 01/14/2004 | EP1381151A1 Piezoelectric oscillator and its manufacturing method |