| Patents for H05K 1 - Printed circuits (98,583) |
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| 03/11/2004 | DE10239512A1 Power/control application structure for direct current electric motor e.g. in motor vehicles, has first and second printed circuit boards with control/power electronic parts and an electrically insulated substrate to dissipate heat |
| 03/11/2004 | DE10217214B4 Kühlanordnung für eine Schaltungsanordnung Cooling arrangement for a circuit |
| 03/11/2004 | DE10059234B4 Elektrisch leitende Paste und Verfahren zur Bildung eines Schaltkreises Electrically conductive paste and process for forming a circuit |
| 03/10/2004 | EP1397031A2 Circuit board for mounting electronic parts |
| 03/10/2004 | EP1396050A2 Apparatus and methods to pre-stress anisotropic conductive elastomer meterials |
| 03/10/2004 | EP1395627A1 Polyimide composition having improved peel strength |
| 03/10/2004 | EP0800754B1 Compliant interface for a semiconductor chip |
| 03/10/2004 | CN2606513Y Improved waterproof structure for printing circuit board |
| 03/10/2004 | CN1481661A Element for electromagnetic shielding and method for mfg. thereof |
| 03/10/2004 | CN1481603A Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
| 03/10/2004 | CN1481548A Method/appts. for folding thin flexible |
| 03/10/2004 | CN1480961A Resistance wiring board and its mfg. method |
| 03/09/2004 | US6704919 Printed circuit board wiring structure checkup system |
| 03/09/2004 | US6704248 High density power module incorporating passive components distributed in a substrate |
| 03/09/2004 | US6704209 Aggregate of electronic components and mounting method thereof |
| 03/09/2004 | US6704208 Printed circuit board and manufacturing method thereof |
| 03/09/2004 | US6704207 Printed circuit board comprising one layer having device mounted on surface and second layer, in which one of interiorsurfaces includes recessed portion for securedly holding interstitial component with lead coupled through via |
| 03/09/2004 | US6704203 Power supply module |
| 03/09/2004 | US6704202 Power controller and compressor for refrigeration system |
| 03/09/2004 | US6704201 Power feed and heat dissipating device for power semiconductor devices |
| 03/09/2004 | US6703909 Covering sheet, triplate line using the sheet, signal bus for computer using the sheet and covering structure of electronic circuit using the sheet |
| 03/09/2004 | US6703907 Circuit technique for increasing effective inductance of differential transmission lines |
| 03/09/2004 | US6703814 Apparatus for providing regulated power to an integrated circuit |
| 03/09/2004 | US6703792 Module for mounting driver IC |
| 03/09/2004 | US6703706 Concurrent electrical signal wiring optimization for an electronic package |
| 03/09/2004 | US6703697 Having stand-off disposed on second substrate surface, sized to maintain distance between capacitor and another substrate and to allow electrical connection element to directly connect substrate surfaces when stand-off is mounted to other surface |
| 03/09/2004 | US6703567 Conductor track layer structure and prestage thereof |
| 03/09/2004 | US6703566 Bonding structure for a hard disk drive suspension using anisotropic conductive film |
| 03/09/2004 | US6703564 Printing wiring board |
| 03/09/2004 | US6703560 Stress resistant land grid array (LGA) module and method of forming the same |
| 03/09/2004 | US6703335 Dielectric ceramic composition suitable for achieving a high q-factor in a high-frequency range and a design method for newly developing such a dielectric ceramic composition. a dielectric ceramic composition is formed primarily from a |
| 03/09/2004 | US6703124 Epoxy resin composition and laminate using the same |
| 03/09/2004 | US6703114 Laminate structures, methods for production thereof and uses therefor |
| 03/09/2004 | US6702968 Printed circuit techniques for polyethylene surfaces |
| 03/09/2004 | US6702624 Electronic component in which an insert member is tightly held by a resin portion and prevented from deformation thereof |
| 03/09/2004 | US6702618 Modular jack having improved grounding plate |
| 03/09/2004 | US6702607 Wiring harness and manufacturing method of the same |
| 03/09/2004 | US6702595 Fuse clip for circuit boards |
| 03/09/2004 | US6702591 Current mode data bus incorporating integrated coupler circuitry |
| 03/09/2004 | US6702480 Opto-electronic chip package |
| 03/09/2004 | US6701614 Method for making a build-up package of a semiconductor |
| 03/09/2004 | US6701605 Conductive electrical element and antenna with ink additive technology |
| 03/04/2004 | WO2004019670A1 Circuit substrate management method, tag chip mounting method, and electronic circuit manufacturing system |
| 03/04/2004 | WO2004019668A1 Perforated substrate, method for manufacturing same and full wafer contact board |
| 03/04/2004 | WO2004019665A1 Method for producing electric conductive structures for use in high-frequency technology |
| 03/04/2004 | WO2004019664A1 Circuit board, electronic apparatus employing circuit board, and process for producing circuit board |
| 03/04/2004 | WO2004019663A2 The laminate structures and method for the electrical testing thereof |
| 03/04/2004 | WO2004019406A1 An electronic assembly having a more dense arrangement of contacts tha allows for routing of traces to the contacts |
| 03/04/2004 | WO2004019338A1 Disc drive apparatus having drive electronics top mounted on flexible printed circuit board |
| 03/04/2004 | WO2004019097A2 System comprising an electrically-active optical component which is connected to an electronic board, optoelectronic equipment and production method thereof |
| 03/04/2004 | WO2004018545A1 Novel polyimide copolymer and metal laminate comprising the same |
| 03/04/2004 | WO2003045073A3 Telecommunications patch panel |
| 03/04/2004 | US20040043644 Coaxial and linear power delivery devices |
| 03/04/2004 | US20040043327 Mixture of epoxy and phenolic resins, latent curing agents and photosensitive acid generator |
| 03/04/2004 | US20040043242 Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board |
| 03/04/2004 | US20040043232 Laminate and use thereof |
| 03/04/2004 | US20040043190 Laminated electronic component |
| 03/04/2004 | US20040042706 Optical communication device |
| 03/04/2004 | US20040042705 Embedded optical coupling in circuit boards |
| 03/04/2004 | US20040042180 Electronic circuit device including heat-generating element mounted on circuit board |
| 03/04/2004 | US20040042141 Integrated device providing overcurrent and overvoltage protection and common-mode filtering to data bus interface |
| 03/04/2004 | US20040041757 Light emitting diode display module with high heat-dispersion and the substrate thereof |
| 03/04/2004 | US20040041702 Solid-state warning light with environmental control |
| 03/04/2004 | US20040041646 Complex circuit board, nonreciprocal circuit device, resonator, filter, duplexer communications device, circuit module, complex circuit board manufacturing method, and nonreciprocal circuit device manufacturing method |
| 03/04/2004 | US20040041393 Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same |
| 03/04/2004 | US20040041309 Ceramic component and production method therefor |
| 03/04/2004 | US20040041277 Multilayer board and a semiconductor device |
| 03/04/2004 | US20040041270 Semiconductor package, method of production of same, and semiconductor device |
| 03/04/2004 | US20040041256 Semiconductor device |
| 03/04/2004 | US20040041243 Thin film circuit board device and its manufacturing method |
| 03/04/2004 | US20040041018 Card having coded data and visible information, for operating a device |
| 03/04/2004 | US20040041001 Printed circuit board having solder bridges for electronically connecting conducting pads and method of fabricating solder bridges |
| 03/04/2004 | US20040040744 Technique for reducing the number of layers in a multilayer circuit board |
| 03/04/2004 | US20040040743 Multilayer modules with flexible substrates |
| 03/04/2004 | US20040040741 Configurable microelectronic package using electrically conductive material |
| 03/04/2004 | US20040040740 Electric element built-in module and method for manufacturing the same |
| 03/04/2004 | US20040040739 Multilayer wiring board and method of manufacturing the same |
| 03/04/2004 | US20040040738 Multilayer wiring board |
| 03/04/2004 | US20040040327 Power module and air conditioner |
| 03/04/2004 | US20040040148 High speed; continuous rolls; sputtering metal; drilling apertures; plating mask; controlling thickness |
| 03/04/2004 | DE20315513U1 End cap for energy-saving electric lamp used in damp environment e.g. for aquarium, wet room, refrigerator, or food plant, with sealing of socket pins |
| 03/04/2004 | DE10331472A1 Miniaturized high voltage divider e.g. for oscilloscopes, has film layers of ceramic capacitive elements together with a thick film resistor |
| 03/04/2004 | DE10302280A1 Electrohydraulic brake pressure sensor for cars, has flexible wire connections between pressure sensor and electronic circuit board |
| 03/04/2004 | DE10238741A1 Planare optische Komponente und Kopplungsvorrichtung zur Kopplung von Licht zwischen einer planaren optischen Komponente und einem optischen Bauteil Planar optical component and coupling device for coupling light between a planar optical component and an optical component |
| 03/04/2004 | DE10234585A1 Optoelectronic surface mounted device component for receiving electromagnetic radiation, especially sunlight in a motor vehicle has angled supports on a carrier plate |
| 03/04/2004 | DE10041622B4 Siebdruckvorrichtung Screen printing apparatus |
| 03/04/2004 | DE10034309B4 Vorrichtung für die Reduktion von durch die thermische Ausdehnung in einem Substrat verursachten Grenzflächenspannungen A device for the reduction of the thermal expansion in a substrate caused interfacial tensions |
| 03/03/2004 | EP1395100A1 Process for treating and manufacturing of circuit boards and such a circuit board |
| 03/03/2004 | EP1395098A1 Electrical heating for vehicle |
| 03/03/2004 | EP1394857A2 Semiconductor device |
| 03/03/2004 | EP1394702A1 High-frequency electronic component and its designing method |
| 03/03/2004 | EP1394291A2 Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board |
| 03/03/2004 | EP1393894A1 Laminate for electronic material |
| 03/03/2004 | EP1393606A2 Polyimide adhesion enhancement to polyimide film |
| 03/03/2004 | EP1393605A2 Circuit board with at least one electronic component |
| 03/03/2004 | EP1393604A1 Printed circuit board comprising a contact sleeve that is mounted thereon |
| 03/03/2004 | EP1393603A1 Method and device for structuring printed circuit boards |
| 03/03/2004 | EP1393371A2 Electronic module and method for assembling same |
| 03/03/2004 | EP1393249A1 Product comprising product sub-parts connected to each other by a crimp connection |
| 03/03/2004 | EP1393248A1 Method for producing a contactless chip card using transfer paper |