| Patents for H05K 1 - Printed circuits (98,583) |
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| 04/08/2004 | US20040066642 Apparatus, method and system for interfacing electronic circuits |
| 04/08/2004 | US20040066641 Electronic equipment with stay for reinforcing circuit board within casing |
| 04/08/2004 | US20040066640 Expansion board apparatus and removing method |
| 04/08/2004 | US20040066637 Wiring substrate and method for manufacturing the same |
| 04/08/2004 | US20040066636 Clock routing in multiple channel modules and bus systems |
| 04/08/2004 | US20040066635 Film carrier tape for mounting electronic part and screen mask for solder resist coating |
| 04/08/2004 | US20040066634 Multilayer wiring board, manufacturing method therefor and test apparatus thereof |
| 04/08/2004 | US20040066633 Method for manufacturing printed wiring board |
| 04/08/2004 | US20040066631 Electronic apparatus |
| 04/08/2004 | US20040066617 Circuit board device and its manufacturing method |
| 04/08/2004 | US20040066615 Daughter board for a prototyping system |
| 04/08/2004 | US20040066602 Electronic control device and manufacturing method for the same |
| 04/08/2004 | US20040066589 Electronic device and interposer board |
| 04/08/2004 | US20040066478 Lamination of liquid crystal polymer dielectric films |
| 04/08/2004 | US20040066307 Light-emitting device array |
| 04/08/2004 | US20040066246 Apparatus for terminating transmission lines to reduce electromagnetic interference in an electronic system |
| 04/08/2004 | US20040065962 Integrated circuit chip module |
| 04/08/2004 | US20040065960 Electronic package with filled blinds vias |
| 04/08/2004 | US20040065738 Data distribution mechanism in the form of ink dots on cards |
| 04/08/2004 | US20040065718 Solder joint structure and method for soldering electronic components |
| 04/08/2004 | US20040065473 Warpage preventing substrate |
| 04/08/2004 | US20040065472 Cable arranging structure |
| 04/08/2004 | US20040065471 Electronic circuit board |
| 04/08/2004 | US20040065401 Method to produce pedestal features in constrained sintered substrates |
| 04/08/2004 | US20040064942 Apparatus and methods for interconnecting components to via-in-pad interconnects |
| 04/08/2004 | DE202004001683U1 Electronic circuit board uses inserts having contacts that provide a connection between surface conductor tracks |
| 04/08/2004 | DE10250919A1 Arrangement with integrated circuits with blocking capacitors and circuit boards has blocking capacitor(s) physically arranged between connection pins of housing and electrically connected to them |
| 04/08/2004 | CA2754630A1 Multilayer substrate |
| 04/08/2004 | CA2498370A1 Novel polyazoles, proton-conducting membrane and other shaped bodies comprising these and their use |
| 04/08/2004 | CA2498356A1 Multilayer substrate |
| 04/07/2004 | EP1406478A2 Electronic apparatus |
| 04/07/2004 | EP1406354A2 A communication connector that operates in multiple modes for handling multiple signal types |
| 04/07/2004 | EP1406303A1 Power module and air conditioner |
| 04/07/2004 | EP1406302A1 Semiconductor device and semiconductor module |
| 04/07/2004 | EP1406271A1 Resistor element, stress sensor and method for manufacturing them |
| 04/07/2004 | EP1405552A1 Method for manufacturing ceramic multilayer circuit board |
| 04/07/2004 | EP1405531A2 Splitter assembly with high density backplane board |
| 04/07/2004 | EP1405446A2 System and method for integrating optical layers in a pcb for inter-board communications |
| 04/07/2004 | EP1405278A2 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith |
| 04/07/2004 | EP1405116A1 Coupling to waveguides that are embedded in printed circuit boards |
| 04/07/2004 | EP1404447A1 Analysis device |
| 04/07/2004 | EP1198977B1 Electric load |
| 04/07/2004 | EP1121602B1 Improving multi-chip module testability using poled-polymer interlayer dielectrics |
| 04/07/2004 | CN2610606Y Serial ATA built-up circuit board |
| 04/07/2004 | CN2610605Y Plate of normalization circuit board |
| 04/07/2004 | CN1488169A Interposer for a semiconductor module, semiconductor produced using such an interposer and method for producing such an interposer |
| 04/07/2004 | CN1488152A Multi-layer and user-configurable micro-printed circuit board |
| 04/07/2004 | CN1487978A Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates |
| 04/07/2004 | CN1487784A Protection film coated on basic plate for multi-layer substrate formation use, apparatus and method for checking basic plates |
| 04/07/2004 | CN1487583A Semiconductor package and producing method thereof and semiconductor device |
| 04/07/2004 | CN1487582A Semiconductor packaging element and method for packaging semiconductor |
| 04/07/2004 | CN1487531A Conductive paste and method for producing solar battery, and solar bettery |
| 04/07/2004 | CN1487362A Impression mask photoetching |
| 04/07/2004 | CN1145206C Film carrier tape, semiconductor assembly, semiconductor device and producing method thereof, mounting base plate |
| 04/07/2004 | CN1145154C Optical detector with HF overlapping circuit |
| 04/06/2004 | US6717825 Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other |
| 04/06/2004 | US6717824 Printed wiring board unit, auxiliary substrate for hierarchical mounting, and electronic apparatus |
| 04/06/2004 | US6717823 Systems having modules with buffer chips |
| 04/06/2004 | US6717822 Lead-frame method and circuit module assembly including edge stiffener |
| 04/06/2004 | US6717821 Integrated circuit device/circuit board connection apparatus |
| 04/06/2004 | US6717820 Circuit board assembly |
| 04/06/2004 | US6717819 Solderable flexible adhesive interposer as for an electronic package, and method for making same |
| 04/06/2004 | US6717794 Composite multilayered ceramic board and manufacturing method thereof |
| 04/06/2004 | US6717793 Surface mount type condenser |
| 04/06/2004 | US6717494 Printed-circuit board, coaxial cable, and electronic device |
| 04/06/2004 | US6717485 Interference signal decoupling using a board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces |
| 04/06/2004 | US6717334 Electronic component and method for forming substrate electrode of the same |
| 04/06/2004 | US6717277 Electrical assembly with vertical multiple layer structure |
| 04/06/2004 | US6717275 Semiconductor module |
| 04/06/2004 | US6717262 Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times |
| 04/06/2004 | US6717250 Stacked semiconductor apparatus and electronic device including stacked semiconductor apparatus |
| 04/06/2004 | US6717249 Non-contact type IC card and process for manufacturing-same |
| 04/06/2004 | US6717241 Magnetic shielding for integrated circuits |
| 04/06/2004 | US6717071 Coaxial via hole and process of fabricating the same |
| 04/06/2004 | US6717070 Printed wiring board having via and method of manufacturing the same |
| 04/06/2004 | US6717069 Surface-mounting substrate and structure comprising substrate and part mounted on the substrate |
| 04/06/2004 | US6717068 Circuit board capable of preventing electrostatic breakdown and magnetic head using the same |
| 04/06/2004 | US6717065 Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board |
| 04/06/2004 | US6717064 Substrate piece and flexible substrate |
| 04/06/2004 | US6717063 Multi-layer circuit board with supporting layers of different materials |
| 04/06/2004 | US6717060 Circuit board consisting of at least two individual circuit board layers made of plastic |
| 04/06/2004 | US6716893 An acrylated epoxy oligomer; an isobornyl acrylate monomer; a photoinitiator; a magnetic powder; may be used to produce printed capacitors and inductors. |
| 04/06/2004 | US6716039 Board mounted electrical connector |
| 04/06/2004 | US6716036 Method of attaching circuitry to a modular jack connector using electrically conductive paste |
| 04/06/2004 | US6715204 Printed wiring board and method for producing the same |
| 04/06/2004 | US6715203 Substrate for power semiconductor modules with through-plating of solder and method for its production |
| 04/01/2004 | WO2004027866A2 Method for creating a link in an integrated metal substrate |
| 04/01/2004 | WO2004027792A1 Transformer and transformer unit having the same |
| 04/01/2004 | WO2004027787A1 Conductive composition for electrical connection of electronic device and electronic device |
| 04/01/2004 | WO2004027629A2 Modular server processing card system and method |
| 04/01/2004 | WO2004027136A1 Glass cloth and film substrate using it |
| 04/01/2004 | WO2004027115A1 Method and solution for treating fluorocarbon surfaces |
| 04/01/2004 | WO2004026790A1 Aluminum nitride sintered compact |
| 04/01/2004 | WO2004019663A3 The laminate structures and method for the electrical testing thereof |
| 04/01/2004 | WO2004003991A3 Electronic component with a housing packaging |
| 04/01/2004 | WO2003092121A3 Three dimensional, high speed back-panel interconnection system |
| 04/01/2004 | WO2003087590A3 Method of self-assembly and self-assembled structures |
| 04/01/2004 | WO2003073250B1 Electrical connector equipped with filter |
| 04/01/2004 | WO2003058326A3 Flip-chip mounted opto-electronic circuit |
| 04/01/2004 | WO2002091810A3 Printed circuit board |