| Patents for H05K 1 - Printed circuits (98,583) |
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| 04/15/2004 | US20040069397 Method and apparatus for determining processing size of bonding material |
| 04/15/2004 | US20040069112 Machine for punching out electronic circuitry parts, method for replacing tape supply reels, and method for producing electronic circuitry parts from tape |
| 04/15/2004 | US20040069020 Aqueous solution of a polycarboxy polymer, a polyol, and at least 30 wt. % of a suspended filler, especially a clay such as bentonite or kaolin |
| 04/15/2004 | US20040068869 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 04/15/2004 | US20040068868 Method of mounting camera module on wiring board |
| 04/15/2004 | US20040068867 Land-side mounting of components to an integrated circuit package |
| 04/15/2004 | DE4426843B4 Fluorpolymer-Verbundmaterial für ein elektrisches Substrat mit niedrigem Wärmekoeffizient der Dielektrizitätskonstante Fluoropolymer composite material for an electrical substrate with a low thermal coefficient of dielectric constant |
| 04/15/2004 | DE20319651U1 Kompaktes elektropneumatisches Mehrwegeventil mit einer flexiblen Leiterplatte The compact electro-pneumatic multiport valve with a flexible printed circuit board |
| 04/15/2004 | DE202004001236U1 Circuit board for data communication systems, provides data cable connection by having twisted pair tracks formed using both sides |
| 04/15/2004 | DE10333120A1 Aromatische flüssigkristalline Polyesterfolie und mit Metall laminierter Gegenstand Aromatic liquid crystalline polyester film and laminated with a metal object |
| 04/15/2004 | DE10296416T5 Verfahren und Vorrichtung zur Registrierungssteuerung in der Produktion durch Belichten Method and apparatus for registration control in production by exposure |
| 04/15/2004 | DE10296376T5 Kohlenstoffdioxidlaser-Bearbeitungsverfahren von Mehrschichtmaterial Carbon dioxide laser processing method of multi-layer material |
| 04/15/2004 | DE10246712A1 Electrical drive unit for adjusting moving parts in motor vehicle, has overheat protection component arranged in opening in circuit board |
| 04/15/2004 | DE10246577A1 Circuit board with metal housing, e.g. for motor vehicle control circuit, has spring member for making contact between circuit board or power semiconductor device and metal housing for heat removal |
| 04/15/2004 | DE10192788T5 Verfahren und Vorrichtung zur Kantenverbindung zwischen Elementen einer integrierten Schaltung Method and device for edge connection between elements of an integrated circuit |
| 04/15/2004 | DE10102848B4 Verfahren zum formschlüssigen und blasenfreien Verkleben von bestückten oder unbestückten gedruckten Schaltung mit planen Kühlkörpern unter Verwendung von Klebefolien Method for positive and bubble-free adhesion of assembled printed circuit bare or with planning heatsinks using adhesive films |
| 04/15/2004 | DE10064374B4 Steckverbinder zur Verbindung von Schaltkreisplatten Connector for connecting circuit boards |
| 04/15/2004 | CA2502937A1 Polyimide film and process for its production |
| 04/14/2004 | EP1408728A2 Printed circuit board with isolated metallic substrate comprising an integrated cooling system |
| 04/14/2004 | EP1408726A1 METHOD AND MATERIAL FOR MANUFACTURING CIRCUIT−FORMED SUBSTRATE |
| 04/14/2004 | EP1408725A1 Process for producing ceramic circuit boards |
| 04/14/2004 | EP1408724A1 Circuit formed substrate and method of manufacturing circuit formed substrate |
| 04/14/2004 | EP1408584A1 Twisted flat electrical terminal |
| 04/14/2004 | EP1408520A2 Co-fired ceramic capacitor and method for forming ceramic capacitors for use in printed wiring boards |
| 04/14/2004 | EP1408365A2 Circuit board and method of manufacturing the same |
| 04/14/2004 | EP1408364A1 Liquid crystal display device |
| 04/14/2004 | EP1408277A2 Lamps holder |
| 04/14/2004 | EP1407646A1 Optimizing selection of reference markings used in estimating the position of an imaging device |
| 04/14/2004 | EP1407642A2 Defferential connector footprint for a multi-layer circuit board |
| 04/14/2004 | EP1407490A2 Single package containing multiple integrated circuit devices |
| 04/14/2004 | EP1407477A2 Improved connection assembly for integrated circuit sensors |
| 04/14/2004 | EP1407463A2 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes |
| 04/14/2004 | EP1407062A1 Composite foil and its manufacturing process |
| 04/14/2004 | EP1406977A1 Selective deposition of circuit-protective polymers |
| 04/14/2004 | EP0935912B1 Pcmcia card with metal cover, connector, frame with cross beam and exposed ground plate disposed on connector |
| 04/14/2004 | EP0853321B1 Multilayer ceramic part using a conductor paste |
| 04/14/2004 | CN1489884A High frequency circuit block member, its manufacturing method, high refrequency module device and its manufaturing method |
| 04/14/2004 | CN1489883A Copper foil with insulation layer and its manufactuing method and printed wiring board using the copper foil with insulation layer |
| 04/14/2004 | CN1489432A Radiating structure for electronic circuit device capalbe of efficiently radiating heat for heating element |
| 04/14/2004 | CN1489430A Large-wire conductive plate for interconnection of circuit capable of superposing |
| 04/14/2004 | CN1489429A Method for manufacturing circuit board and communication device |
| 04/14/2004 | CN1489206A 集成电路芯片组件 IC chip assembly |
| 04/14/2004 | CN1489201A 半导体器件 Semiconductor devices |
| 04/14/2004 | CN1489106A IC module and manufacturing method thereof, and wireless information storage medium comprising said IC module |
| 04/14/2004 | CN1146030C Semiconductor device and manufacturling method thereof, semiconductor module, circuit board and electrnic equipment |
| 04/14/2004 | CN1145979C Circuit protection device |
| 04/14/2004 | CN1145677C Resin composition of phosphous-confained compound, containing epoxy grouping and its use |
| 04/13/2004 | US6721860 Method for bus capacitance reduction |
| 04/13/2004 | US6721195 Reversed memory module socket and motherboard incorporating same |
| 04/13/2004 | US6721189 Memory module |
| 04/13/2004 | US6721188 Power supply for low profile equipment housing |
| 04/13/2004 | US6721187 Multi-layered high density connections |
| 04/13/2004 | US6721186 Electronic signal adapter module of flash memory card |
| 04/13/2004 | US6721185 Memory module having balanced data I/O contacts pads |
| 04/13/2004 | US6721182 Circuit card module including mezzanine card heat sink and related methods |
| 04/13/2004 | US6721161 Sole structure for electrostatic dissipative footwear and method of making same |
| 04/13/2004 | US6721156 Primary/secondary wireless protector |
| 04/13/2004 | US6721153 Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board |
| 04/13/2004 | US6721083 Electrophoretic displays using nanoparticles |
| 04/13/2004 | US6720843 Filter switching circuit having a shorter distance of connection for a higher frequency passband |
| 04/13/2004 | US6720784 Device for testing electronic devices |
| 04/13/2004 | US6720690 Vibration motor holding apparatus and portable electronic equipment having the same |
| 04/13/2004 | US6720665 Enhanced pad design for substrate |
| 04/13/2004 | US6720652 Apparatus providing redundancy for fabricating highly reliable memory modules |
| 04/13/2004 | US6720651 Semiconductor plastic package and process for the production thereof |
| 04/13/2004 | US6720501 PC board having clustered blind vias |
| 04/13/2004 | US6720500 Plug-in type electronic control unit, structure of connection of wiring board with plug member, unit of connection of electronic part with wiring board, and process for mounting electronic part |
| 04/13/2004 | US6720208 Semiconductor device |
| 04/13/2004 | US6720205 Electronic device and method of manufacturing the same, and electronic instrument |
| 04/13/2004 | US6720127 Printed circuit substrate with controlled placement covercoat layer |
| 04/13/2004 | US6720120 Technique for providing the fine lines are applied to an electron-source substrate and an image forming apparatus. |
| 04/13/2004 | US6720080 Finish comprising at least one cationic amino-functional alkoxysilane coupling agent and a weak acid for complexing with the amine function of above agent thereby providing a latent reactivity with epoxy resin during lamination |
| 04/13/2004 | US6720077 Resin composition, and use and method for preparing the same |
| 04/13/2004 | US6719574 Angled electrical connector |
| 04/13/2004 | US6719570 Card-type portable device |
| 04/13/2004 | US6719568 Electric circuit unit |
| 04/13/2004 | US6719187 Method of connecting circuit boards |
| 04/13/2004 | US6719185 Substrate with top-flattened solder bumps and method for manufacturing the same |
| 04/13/2004 | US6718631 Process for producing a flexible wiring board |
| 04/13/2004 | US6718629 Method and apparatus for mounting components onto a substrate of an electrical assembly |
| 04/08/2004 | WO2004030427A1 Flexible circuit with electrostatic damage limiting feature |
| 04/08/2004 | WO2004030148A1 Rfid tag and process for producing the same |
| 04/08/2004 | WO2004030135A2 Proton-conducting membrane and use thereof verwendung |
| 04/08/2004 | WO2004030001A1 Hf-reactor |
| 04/08/2004 | WO2004029994A2 Multilayer substrate |
| 04/08/2004 | WO2004029153A1 Thermosetting magnetic slurry and use thereof |
| 04/08/2004 | WO2004029127A1 Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 04/08/2004 | WO2004028816A1 Method and device for positioning electronic components |
| 04/08/2004 | WO2004019097A3 System comprising an electrically-active optical component which is connected to an electronic board, optoelectronic equipment and production method thereof |
| 04/08/2004 | WO2003100827A3 Organic semiconductor device and method |
| 04/08/2004 | WO2003096414A3 Power supply component assembly on a printed circuit and method for obtaining same |
| 04/08/2004 | WO2003085738A3 Power module comprising two substrates and method for producing the same |
| 04/08/2004 | WO2003067711B1 High speed differential signal edge card connector circuit board layouts |
| 04/08/2004 | WO2003058369A3 Voltage regulator with voltage droop compensation |
| 04/08/2004 | WO2003006396B1 Bonding method and product |
| 04/08/2004 | US20040067693 Communications connector that operates in multiple modes for handling multiple signal types |
| 04/08/2004 | US20040067666 Configuration, plug-in mount and contact element for fixing and contacting switching assemblies on a substrate |
| 04/08/2004 | US20040067349 Laminate and process for producing the same |
| 04/08/2004 | US20040067348 Thin films containing microprojections; acoustic absorption; fineness apertures |
| 04/08/2004 | US20040067030 High-density fiber-optic module with multi-fold flexible circuit |