Patents for H05K 1 - Printed circuits (98,583)
02/2004
02/26/2004US20040036818 Folder type multi display device
02/26/2004US20040036551 High-frequency module substrate device
02/26/2004US20040036466 On-circuit board continuity tester
02/26/2004US20040036176 Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
02/26/2004US20040036165 Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set
02/26/2004US20040036164 Semiconductor device and its manufacturing method
02/26/2004US20040036152 Integrated circuit package employing flip-chip technology and method of assembly
02/26/2004US20040036068 Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registration
02/26/2004US20040035933 Long range optical reader
02/26/2004US20040035840 Component installation, removal, and replacement apparatus and method
02/26/2004US20040035693 Method for removing voids in a ceramic substrate
02/26/2004US20040035604 Circuit board and method of manufacturing same
02/26/2004US20040035520 Multilayer flexible wiring circuit board and its manufacturing method
02/26/2004US20040035306 Solder paste printing apparatus and printing method
02/26/2004US20040035245 Plastic control plate of a hydraulic gearbox control device in a motor vehicle
02/26/2004US20040034996 Fabricating fence configured for placement on surface of interposer, including receptacle configured to receive semiconductor device to align conductive elements protruding therefrom with corresponding contact pads, consolidating
02/26/2004US20040034995 Method of producing electronic unit of radio system automatically, electronic unit of radio system and electronic component used for its production
02/26/2004DE20317307U1 Printed circuit board (PCB) assembly for electric equipment has a circuit and components partly fitted on the PCB's components side and linked with each other and the PCB on the opposite solder side
02/26/2004DE20315828U1 Printed-board assembly for making up a T5/T8/T12 power-saving lamp has a magnetic choke device with a T5 fluorescent long-field lamp
02/26/2004DE10325023A1 Optoelektronisches Packungssubstrat sowie dessen Herstellungsverfahren The optoelectronic packaging substrate and its manufacturing method
02/26/2004DE10303766A1 Elektronische Vorrichtung, bei der eine Schalttafel und ein elektrischer Stecker durch eine flexible gedruckte Verdrahtungstafel elektrisch verbunden sind Electronic apparatus in which a control panel and an electrical connector are electrically connected through a flexible printed wiring board
02/26/2004DE10218451B4 Gedruckter Widerstand Printed resistance
02/26/2004DE10212495B4 Verfahren zum Herstellen eines Metall-Keramik-Substrats, vorzugsweise eines Kupfer-Keramik-Substrats A method of manufacturing a metal-ceramic substrate, preferably a copper-ceramic substrate,
02/25/2004EP1392093A1 Method for manufacturing ceramic multilayered board
02/25/2004EP1392092A1 COPPER PLATED CIRCUIT LAYER−CARRYING COPPER CLAD LAMINATED SHEET AND METHOD OF PRODUCING PRINTED WIRING BOARD USING THE COPPER PLATED CIRCUIT LAYER−CARRYING COPPER CLAD LAMINATED SHEET
02/25/2004EP1392090A2 Flexible printed circuit board connection mechanism
02/25/2004EP1392089A1 Printed circuit board with self align bonding pads thereon
02/25/2004EP1390313A1 Reinforcing glass yarns with low dielectric constants
02/25/2004EP1390219A2 Electric heating system for a motor vehicle
02/25/2004CN1478373A Electrical component, arrangement for said component and method for producing said arrangement
02/25/2004CN1478312A Process for securing microwave module to support
02/25/2004CN1478285A Electroconductive metal paste
02/25/2004CN1477922A Alloy plating liquid for modular printed circuit board surface treatment
02/25/2004CN1477921A Apparatus for fixed thread reel to printed circuit board using in transformer
02/25/2004CN1477917A Soft circuit board capable of providing for identification
02/25/2004CN1477702A Semiconductor mounting substrate for making electronic package and its production process
02/25/2004CN1139861C Printed circuit board involved in integrated cable connector power-supply system
02/24/2004US6697420 Symbol-based signaling for an electromagnetically-coupled bus system
02/24/2004US6697261 Multileveled printed circuit board unit including substrate interposed between stacked bumps
02/24/2004US6697259 Circuit board of protective circuit for storage battery, protective circuit for storage battery, and storage battery pack
02/24/2004US6697258 Moisture-resistant enclosure for electronic circuitry
02/24/2004US6697228 Low stiffness pitch adjustable suspension
02/24/2004US6697215 Index signal output device and floppy disk drive
02/24/2004US6697130 Flexible led backlighting circuit
02/24/2004US6696910 Planar inductors and method of manufacturing thereof
02/24/2004US6696909 Circuit module and method for mounting the same
02/24/2004US6696906 Low dielectric loss signal line having a conductive trace supported by filaments
02/24/2004US6696769 Mode switch assembly of automobile having impact/load absorbing apparatus
02/24/2004US6696757 Contact structure for reliable metallic interconnection
02/24/2004US6696648 Method for dispensing adhesive on a circuit-board carrier member and circuit-board provided thereby
02/24/2004US6696643 Electronic apparatus
02/24/2004US6696529 Photosensitive resin composition, porous resin, circuit board, and wireless suspension board
02/24/2004US6696155 Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances
02/24/2004US6696139 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board and manufacturing method of double-sided wiring board
02/24/2004US6696133 Wiring boards and processes for manufacturing wiring boards
02/24/2004US6695633 Printed circuit board and connector assembly
02/24/2004US6694614 Laser processing method and equipment for printed circuit board
02/24/2004US6694613 Method for producing a printed-circuit board having projection electrodes
02/24/2004US6694583 Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate
02/19/2004WO2004016063A1 Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board
02/19/2004WO2004016056A1 Printed circuit board and electronic elements for mounting in printed circuit board and method for mounting electronic elements in printed circuit board
02/19/2004WO2004016055A1 An electronic product, a body and a method of manufacturing
02/19/2004WO2004016054A1 Wiring substrate and wiring substrate connection structure
02/19/2004WO2004015775A1 Stacking substrate for at least one ic and system comprising such a substrate
02/19/2004WO2004015770A1 Multi-layer circuit carrier and production thereof
02/19/2004WO2004015765A1 Multilayer printed wiring board
02/19/2004WO2004015597A1 System and method for modifying electronic design data
02/19/2004WO2004015441A2 Radio frequency identificaton device and method
02/19/2004WO2004015011A1 Heat-resistant film and metal laminate thereof
02/19/2004WO2004014647A1 Method for producing a ceramic substrate
02/19/2004WO2004014479A2 Insulated implantable electrical circuit
02/19/2004WO2003073250A3 Electrical connector equipped with filter
02/19/2004WO2003065469A3 Power module
02/19/2004WO2003065449A3 Power semiconductor, and method for producing the same
02/19/2004WO2002075869A3 An improved patch panel
02/19/2004WO2002069053A3 Method and apparatus for registration control in production by imaging
02/19/2004WO2002058145A3 Layered dielectric nanoporous materials and methods of producing same
02/19/2004US20040034489 High frequency module board device
02/19/2004US20040034154 Epoxide-type formaldehyde free insulation binder
02/19/2004US20040034129 Heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring
02/19/2004US20040033747 Aqueous formaldehyde-free composition and fiberglass insulation including the same
02/19/2004US20040033746 Poly-p-phenileneterephthalamide fibers bonded with each other by a binder of thermosetting resin and a second binder of one selected from fiber chops, fiber pulps and fibrids of thermoplastic resin having softening point of => 200 degreee
02/19/2004US20040033724 Housing part for an electrical adjusting drive
02/19/2004US20040033706 Device and method using a flexible circuit secured for reliably inter-connecting components therein in the presence of vibration events
02/19/2004US20040033446 Pre-bonding and main-bonding by use of an adhesive tape; improved flatness and precise alignment without causing chemical or thermal damage
02/19/2004US20040033016 Planar optical component, and a coupling device for coupling light between a planar optical component and an optical assembly
02/19/2004US20040033006 Polished polyimide substrate
02/19/2004US20040032745 LED alley/take-down light
02/19/2004US20040032723 Smartuniversal flash media card adapters
02/19/2004US20040032706 High-frequency switch module
02/19/2004US20040032562 Method and apparatus for adjusting contrast during assembly of liquid crystal displays and similar devices
02/19/2004US20040032465 Slotted substrate and method of making
02/19/2004US20040032313 Simplified transformer design for a switching power supply
02/19/2004US20040032304 Energy conditioning circuit assembly
02/19/2004US20040032028 Laminated multilayer package
02/19/2004US20040032019 Semiconductor device
02/19/2004US20040032018 Method and device for forming module electronic component and module electronic component
02/19/2004US20040031972 Stacked packages
02/19/2004US20040031870 Magnetic tape cassette
02/19/2004US20040031869 Magnetic tape cassette