| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/01/2004 | CN1525579A Light-emitting diode light source unit |
| 09/01/2004 | CN1525559A Wiring substrate |
| 09/01/2004 | CN1525558A Heatsink arrangement for semiconductor device |
| 09/01/2004 | CN1525556A Wiring substrate |
| 09/01/2004 | CN1525502A Method of trimming reactance element |
| 09/01/2004 | CN1525492A Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
| 09/01/2004 | CN1525347A Signal transmitting device suited to fast signal transmission |
| 09/01/2004 | CN1524826A Oxide ceramic material, ceramic substrate employing the same, ceramic laminate device, and power amplifier module |
| 09/01/2004 | CN1165209C Method for manufacturing multilayer integrated substrate and multilayer ceramic element |
| 09/01/2004 | CN1165032C Display device using COF |
| 08/31/2004 | US6785447 Single and multilayer waveguides and fabrication process |
| 08/31/2004 | US6785147 Circuit module |
| 08/31/2004 | US6785144 High density stackable and flexible substrate-based devices and systems and methods of fabricating |
| 08/31/2004 | US6785008 Board for measuring offset of component mounting apparatus, and method for measuring offset of component mounting apparatus |
| 08/31/2004 | US6784780 Coupling adjusting structure for double-tuned circuit |
| 08/31/2004 | US6784765 Multilayer ceramic device |
| 08/31/2004 | US6784677 Closed-grid bus architecture for wafer interconnect structure |
| 08/31/2004 | US6784598 Electronic component and method for forming substrate electrode of the same |
| 08/31/2004 | US6784556 Design of interconnection pads with separated probing and wire bonding regions |
| 08/31/2004 | US6784543 Projection-like connection terminals |
| 08/31/2004 | US6784531 Power distribution plane layout for VLSI packages |
| 08/31/2004 | US6784530 Circuit component built-in module with embedded semiconductor chip and method of manufacturing |
| 08/31/2004 | US6784529 Package- stacked structure, having increased memory capacity without increasing a mounting area |
| 08/31/2004 | US6784527 Electronic card formed of a double-sided printed circuit board with static electricity prevention circuit |
| 08/31/2004 | US6784526 Integrated circuit device module |
| 08/31/2004 | US6784521 Directional coupler |
| 08/31/2004 | US6784458 Random partitionable dot matrix LED display |
| 08/31/2004 | US6784377 Method and structure for repairing or modifying surface connections on circuit boards |
| 08/31/2004 | US6784374 Printed wiring board and manufacturing method therefor |
| 08/31/2004 | US6784373 Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same |
| 08/31/2004 | US6784369 Connection structure of coaxial cable |
| 08/31/2004 | US6784366 Thermal dissipation package for an electrical surface mount component |
| 08/31/2004 | US6784275 Active energy ray-curable polyimide resin composition |
| 08/31/2004 | US6784221 Epoxy acrylate of aromatic biphenol-advanced epoxy resin reacted with anhydride |
| 08/31/2004 | US6783920 Photosensitive glass variable laser exposure patterning method |
| 08/31/2004 | US6783841 Low signal loss bonding ply for multilayer circuit boards |
| 08/31/2004 | US6783840 Resist ink composition |
| 08/31/2004 | US6783688 Method and apparatus for structuring printed circuit boards |
| 08/31/2004 | US6783620 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
| 08/31/2004 | US6783372 Apparatus for connecting semiconductor modules |
| 08/31/2004 | US6783371 Solder-down printed circuit board connection structure |
| 08/31/2004 | US6783258 Illuminated message sign with angled light emitting device array |
| 08/31/2004 | US6783077 Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card |
| 08/31/2004 | US6783076 Memory card, and receptacle for same |
| 08/31/2004 | US6782616 Connection arrangements for electrical devices |
| 08/31/2004 | US6782615 Method of surface-mounting electronic components |
| 08/31/2004 | US6782613 Interposer structures having formed thereon a plurality of conductive pillars or recesses that are adapted to make electrical contact with the leads of an integrated circuit package |
| 08/31/2004 | US6782612 Manufacturing process of IC module |
| 08/31/2004 | US6782611 Method of assembling a multi-chip device |
| 08/31/2004 | CA2127006C Hot pluggable motherboard bus connector method |
| 08/26/2004 | WO2004073371A1 An electronics box having internal circuit cards interconnected to external connectors without using a motherboard |
| 08/26/2004 | WO2004073369A1 Multilayer printed wiring board and process for producing the same |
| 08/26/2004 | WO2004073368A1 High frequency multilayer printed wiring board |
| 08/26/2004 | WO2004073367A1 Device and method for damping cavity resonance in a multi-layer carrier module |
| 08/26/2004 | WO2004073063A1 Electronic device and semiconductor device |
| 08/26/2004 | WO2004073038A2 Ultra broadband capacitor assembly |
| 08/26/2004 | WO2004072993A1 Electronic parts board and method of producing the same |
| 08/26/2004 | WO2004071982A1 Lead-free glass, composition for electronic circuit substrate and electronic circuit substrate |
| 08/26/2004 | WO2004006297B1 Low dielectric materials and methods of producing same |
| 08/26/2004 | WO2003096362A3 High energy density capacitors |
| 08/26/2004 | WO2003073814A3 Laminated socket contacts |
| 08/26/2004 | US20040168142 Method and system for designing an integrated circuit with reduced noise |
| 08/26/2004 | US20040168071 Apparatus for validating the presence of an authorized accessory |
| 08/26/2004 | US20040167378 Imaging device assembly for electronic stereoscopic endoscope system |
| 08/26/2004 | US20040167288 Fatty acid containing fiberglass binder |
| 08/26/2004 | US20040167273 Water repellant fiberglass binder |
| 08/26/2004 | US20040167242 Electronic overcoating; screen printing; mixture of acrylated resin, unsaturated compound, photoinitiator and magnetism powder |
| 08/26/2004 | US20040167007 Use of zeolites in preparing low temperature ceramics |
| 08/26/2004 | US20040166709 High current, high mechanical strength connectors for insulated metal substrate circuit boards |
| 08/26/2004 | US20040166617 Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times |
| 08/26/2004 | US20040166332 higher modulus retention at elevated temperatures than the silicone resin alone, having other mechanical properties similar to the organic resin composite, but exhibiting much enhanced thermal resistance and reduced flammability |
| 08/26/2004 | US20040166324 using a halogen-free flame-retardant thermosetting resin composition excellent in moldability and solder heat resistance, and a laminate and a metal-foil-clad laminate |
| 08/26/2004 | US20040166305 thermosetting composition comprising a polybutadiene or polyisoprene resin; particulate fluoropolymer |
| 08/26/2004 | US20040166297 Porous insulating film and its laminates |
| 08/26/2004 | US20040165406 Method and apparatus for I/O resonance compensation |
| 08/26/2004 | US20040165368 EMC/ESD mitigation module |
| 08/26/2004 | US20040165365 Circuit assembly and electronic device incorporating such an assembly |
| 08/26/2004 | US20040165361 Module component and method of manufacturing the same |
| 08/26/2004 | US20040165138 Drive IC and display device having the same |
| 08/26/2004 | US20040165137 Liquid crystal module |
| 08/26/2004 | US20040164923 Transformers or inductors ("transductors") and antennas manufactured from conductive loaded resin-based materials |
| 08/26/2004 | US20040164835 High density inductor and method for producing same |
| 08/26/2004 | US20040164730 Method for forming permanent magnet targets for position sensors |
| 08/26/2004 | US20040164728 Inductive sensor and rotary encoder provided with an inductive sensor |
| 08/26/2004 | US20040164431 substrate having a first side configured to receive a semiconductor chip and a second side having conductive pads arranged in an array of rows and columns, wherein at least one edge of said array is not fully populated with pads. |
| 08/26/2004 | US20040164429 Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film |
| 08/26/2004 | US20040164427 Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations |
| 08/26/2004 | US20040164424 Flexibility enhanced integrated circuit carrier |
| 08/26/2004 | US20040164405 Heatsink arrangement for semiconductor device |
| 08/26/2004 | US20040164396 Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrument |
| 08/26/2004 | US20040164337 Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device |
| 08/26/2004 | US20040163964 Electroplating conductive material within opening of dielectric layer; commoning layer is used to form multiple, vertically aligned conductive openings in multilayered laminate interposer for coupling a chip to printed circuit board |
| 08/26/2004 | US20040163848 Printed wiring board and printed wiring board manufacturing method |
| 08/26/2004 | US20040163846 Printed circuit board employing lossy power distribution network to reduce power plane resonances |
| 08/26/2004 | US20040163845 Waterproof structure of printed circuit board |
| 08/26/2004 | US20040163844 Flexible wiring board, an intermediate product of a flexible wiring board, and a multi-layer flexible wiring board |
| 08/26/2004 | US20040163842 Flexible printed wiring board for chip-on-film |
| 08/26/2004 | US20040163841 Connecting method for structure with implantable electrodes |
| 08/26/2004 | US20040163633 Electrical interface assembly for reducing ohmic losses in an ignition system |
| 08/26/2004 | US20040163617 Underhood electronic integration |