| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 02/17/2005 | US20050035816 Printed circuit board for a three-phase power device having embedded directional impedance control channels |
| 02/17/2005 | US20050035685 Acoustic wave touch detecting apparatus |
| 02/17/2005 | US20050035450 Ball grid array package having testing capability after mounting |
| 02/17/2005 | US20050035445 Power semiconductor module with deflection-resistant base plate |
| 02/17/2005 | US20050035443 Device for connecting the terminal pins of a package for an optical transmitting and/or receiving device to a printed circuit board and conductor arrangement for such a device |
| 02/17/2005 | US20050035347 Probe card assembly |
| 02/17/2005 | US20050035304 System and method for attenuating the effect of ambient light on an optical sensor |
| 02/17/2005 | US20050035184 Method of soldering semiconductor part and mounted structure of semiconductor part |
| 02/17/2005 | US20050034893 Circuit board design |
| 02/17/2005 | US20050034885 Three demensional dynamicaly shielded high-q beol metallization |
| 02/17/2005 | US20050034560 Silver, copper alloy overcoated with acid; smooth surface |
| 02/17/2005 | DE4343509B4 Leitfähiges Element und seine Verwendung Conductive element and its use |
| 02/17/2005 | DE202004018149U1 Adapter plate or board for surface mount device (SMD), requires use of production panel of specified maximum thickness |
| 02/17/2005 | DE202004018068U1 Module base or socket for EIB-universal interface esp. for electric installation, has circuit boards fitted out with pluggable pin contacts and with circuit board connection terminals |
| 02/17/2005 | DE202004016713U1 Transmitting and receiving module for optical apparatus, has circuit board with copper sheet on rear side to remove heat from transmitting diode |
| 02/17/2005 | DE10333806A1 Printed circuit board e.g. for mobile telephone components comprising screen for at least one component against electromagnetic radiation |
| 02/17/2005 | DE10333439A1 Verfahren zur Herstellung eines aus mehreren Verdrahtungsebenen bestehenden Hybrid-Produktes Process for the preparation of a multi-wiring planes hybrid product |
| 02/17/2005 | DE10331574A1 Leistungshalbleitermodul The power semiconductor module |
| 02/17/2005 | DE102004032903A1 Leitfähiges Pulver und Verfahren zur Herstellung desselben Conductive powder and process for producing same |
| 02/17/2005 | DE10160508B4 Anordnung zur Detektion von optischen Signalen mindestens eines optischen Kanals eines planaren optischen Schaltkreises und/oder zur Einkopplung optischer Signale in mindestens einen optischen Kanal eines planaren optischen Schaltkreises Arrangement for detection of optical signals at least one optical channel of a planar optical circuit and / or for coupling optical signals in at least one optical channel of a planar optical circuit |
| 02/16/2005 | EP1507169A1 Photosensitive thick-film paste materials for forming light-transmitting electromagnetic shields, light-transmitting electromagnetic shields formed using the same, and method of manufacture thereof |
| 02/16/2005 | EP1506701A1 Improved structure of stacked vias in multiple layer electronic device carriers |
| 02/16/2005 | EP1506595A1 Rf system concept for vehicular radar having several beams |
| 02/16/2005 | EP1506575A2 Power supply component assembly on a printed circuit and method for obtaining same |
| 02/16/2005 | EP1506568A2 Direct-connect signaling system |
| 02/16/2005 | EP1506555A2 High energy density capacitors |
| 02/16/2005 | EP1410403A4 Low temperature method and compositions for producing electrical conductors |
| 02/16/2005 | EP1384282A4 Multi-layer flat plate antenna with low-cost material and high-conductivity additive processing |
| 02/16/2005 | EP1218115B1 Ultrasonic linear or curvilinear transducer and connection technique therefore |
| 02/16/2005 | EP1147070B1 Electrically conductive ceramic layers |
| 02/16/2005 | EP1138719B1 Polyimide/polyarylate resin compositions and moldings thereof |
| 02/16/2005 | CN2679968Y Small optical transceiving modular printed circuit board |
| 02/16/2005 | CN1582415A Photosensitive ceramics composition and method for making multi-layer substrate using it |
| 02/16/2005 | CN1582414A Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern |
| 02/16/2005 | CN1582092A Method for forming wire-layout pattern and method for making semiconductor device and photoelectronic device |
| 02/16/2005 | CN1582090A Method for making circuit substrate |
| 02/16/2005 | CN1582087A Electronic circuit unit |
| 02/16/2005 | CN1582086A 电子线路单元 Electronic circuit unit |
| 02/16/2005 | CN1582085A Positioning reinforcing board, soft circuit film havng same and its connector module |
| 02/16/2005 | CN1581589A Terminal and portable apparatus using same |
| 02/16/2005 | CN1581476A Void-free metal interconnection steucture and method of forming the same |
| 02/16/2005 | CN1581472A Wire-layingout plate and its making method, semiconductor device and its making method |
| 02/16/2005 | CN1581453A Semiconductor and its making method |
| 02/16/2005 | CN1581368A Dielectric ceramic composition and ceramic electronic component employing the same |
| 02/16/2005 | CN1581346A Optical head activator and driving method |
| 02/16/2005 | CN1580950A Pattern production system, exposure system, and exposure method |
| 02/16/2005 | CN1580889A Display panel having noise shielding structure |
| 02/16/2005 | CN1580128A Halogen-free Yesin composition |
| 02/16/2005 | CN1580127A Halogen-free resin composition |
| 02/16/2005 | CN1579772A Ink-jet head |
| 02/16/2005 | CN1579754A Method for preparing flexible copper-cladded plate |
| 02/16/2005 | CN1190118C Multilayer printed wiring board manufacturing method |
| 02/16/2005 | CN1190117C Method of producing ceramic multilayer substrate |
| 02/16/2005 | CN1190114C Substrate structure |
| 02/16/2005 | CN1190113C Ceramic laminated device |
| 02/16/2005 | CN1189983C HF signal conversion apparatus |
| 02/16/2005 | CN1189982C Connecting plug and method for manufacturing the same |
| 02/16/2005 | CN1189929C Electronic element mounting body and its producing method and electronic apparatus using it |
| 02/16/2005 | CN1189897C Surface mounting type coil unit |
| 02/16/2005 | CN1189893C Conductive pasty material, method for controlling its viscosity and electronic component using same |
| 02/16/2005 | CN1189660C Power controller and compressor for refrigeration system |
| 02/15/2005 | US6856715 Apparatus comprising electronic and/or optoelectronic circuitry and method for realizing said circuitry |
| 02/15/2005 | US6856506 Tablet computing device with three-dimensional docking support |
| 02/15/2005 | US6856499 MEMS variable inductor and capacitor |
| 02/15/2005 | US6856482 Disk drive apparatus and method of mounting same |
| 02/15/2005 | US6856362 Structure of liquid crystal display device for easy assembly and disassembly |
| 02/15/2005 | US6856210 High-frequency multilayer circuit substrate |
| 02/15/2005 | US6856209 EMI suppression method for powertrain control modules |
| 02/15/2005 | US6856157 Method and device for testing electronic devices |
| 02/15/2005 | US6856151 Conductive polymer contact system and test method for semiconductor components |
| 02/15/2005 | US6856017 Device having resin package and method of producing the same |
| 02/15/2005 | US6856008 Laminated multilayer package |
| 02/15/2005 | US6855953 Electronic circuit assembly having high contrast fiducial |
| 02/15/2005 | US6855893 Wiring board, semiconductor device, electronic device, and circuit board for electronic parts |
| 02/15/2005 | US6855892 Insulation sheet, multi-layer wiring substrate and production processes thereof |
| 02/15/2005 | US6855891 Card edge connector, method of manufacturing same, electronic card and electronic equipment |
| 02/15/2005 | US6855758 Hydrolysis-resistant, transparent, biaxially oriented film made from a crystallizable thermoplastic, and process for its production |
| 02/15/2005 | US6855738 Grafting brominated epoxy resins with carbonic esters, then curing to form low dielectric nanostructure composites |
| 02/15/2005 | US6855626 Wiring substrate having position information |
| 02/15/2005 | US6855625 Conductor pattern film; filling aperture with conductive paste; lamination electrode by pressing, heating thermoplastic resin |
| 02/15/2005 | US6855422 Multi-component fibers having enhanced reversible thermal properties and methods of manufacturing thereof |
| 02/15/2005 | US6855399 Copper paste and wiring board using the same |
| 02/15/2005 | US6855378 Printing of electronic circuits and components |
| 02/15/2005 | US6855367 Method of producing electronic parts, and member for production thereof |
| 02/15/2005 | US6855222 Method for manufacturing laminated multilayer electronic components |
| 02/15/2005 | US6855009 Card-edge connector containing latch mechanism |
| 02/15/2005 | US6854980 Probe card |
| 02/15/2005 | US6854979 Laminated socket contacts |
| 02/15/2005 | US6854853 Method for wave soldering of surface mounted light emitting diodes |
| 02/15/2005 | US6854418 Intensive machine for performing a plurality of processes in fabrication of multilayer substrate |
| 02/15/2005 | CA2325148C Bus bar heat sink |
| 02/10/2005 | WO2005013657A1 Electronic device cooler |
| 02/10/2005 | WO2005013653A1 Printed-wiring board and method of producing the same |
| 02/10/2005 | WO2005013476A2 Radio frequency communication between devices via a power plane on a circuit board |
| 02/10/2005 | WO2005013453A1 Device for the protection of electronic modules against short circuits in a multivoltage on-board electrical wiring system |
| 02/10/2005 | WO2005013436A1 Electrical connector |
| 02/10/2005 | WO2005013412A1 Parallel flat plate line-type element and circuit substrate |
| 02/10/2005 | WO2005013366A1 Heatsinking electronic devices |
| 02/10/2005 | WO2005013363A2 Circuit arrangement placed on a substrate and method for producing the same |
| 02/10/2005 | WO2005012445A2 Conducting inks |