Patents for H05K 1 - Printed circuits (98,583)
07/2009
07/30/2009US20090188700 Electrode substrate having conductive layers with different properties made of conductive materials with different properties formed on transparent base material
07/30/2009US20090188699 Printed circuit board
07/30/2009DE19743737B4 Verfahren zur Bildung einer Drahtbondelektrode auf einer Dickschichtleiterplatte A method for forming a wire bonding electrode on a thick layer printed circuit board
07/30/2009DE102008008897B3 Schaltung mit integrierter Abschirmung und Hörhilfe Circuit with integrated screening and hearing aid
07/30/2009DE102008006647A1 Foil connector for use with connections of e.g. heater, has solder fixed to solder pad by using screen printing and provided for fixing and electrical connection to connections of glass pane, and soldering paste or wire soldered on solder
07/30/2009DE102008006495A1 Circuit carrier i.e. standard flame retardant four printed circuit board, for air-conditioning system of motor vehicle, has copper thick film increasing current feed properties and applied on copper thin film by thermal spraying of metal
07/30/2009DE102008006390A1 Verfahren zur Verklebung von flexiblen Leiterplatten mit Polymermaterialien zur partiellen oder vollständigen Versteifung A process for bonding flexible printed circuit boards with polymeric materials for partial or complete stiffening
07/30/2009DE102008005747A1 Power electronics module for use with radiator box of vehicle in automotive engineering, has plates connected among each other and sink connected with layers, where one layer comprises component based on low-temperature connection process
07/30/2009DE102008005587A1 Electrically and/or thermally conducting structure i.e. conducting path, manufacturing method for radio-frequency identification transponder, involves applying electrically and/or thermally conducting material on plastic substrate
07/30/2009DE10058660B4 Kraftfahrzeugleuchte Vehicle light
07/29/2009EP2083609A2 Optical communication device and method of manufacturing the same
07/29/2009EP2083470A1 Electronic component with surface installation with precisely positioned electric connection
07/29/2009EP2083296A2 Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby
07/29/2009EP2083295A2 Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby
07/29/2009EP2083294A2 Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby
07/29/2009EP2083019A1 Photocurable/thermosetting resin composition, cured product and printed wiring board
07/29/2009EP2082451A1 Integrated television antenna for a portable communication device
07/29/2009EP2081977A2 Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
07/29/2009EP1943888B1 A component adapted for being mounted on a substrate and a method of mounting a surface mounted device
07/29/2009EP1617655B1 Imaging device and mobile terminal using this imaging device
07/29/2009EP1614326B1 High frequency heating apparatus
07/29/2009EP1599282B1 Use of dispersions in the manufacture of a multi-layer ceramic capacitor
07/29/2009EP1567302A4 Laser trimming of resistors
07/29/2009CN201282595Y 电路板结构 Circuit board structure
07/29/2009CN201282594Y Flexible circuit board
07/29/2009CN101496456A Card connector dampening assembly
07/29/2009CN101496455A Flexible printed board, electronic equipment with the same mounted thereon, and method for folding up the same
07/29/2009CN101494952A Device compatible with PCI Express Mini Card standard
07/29/2009CN101494951A Printed circuit board
07/29/2009CN101494950A Wiring board with through hole or non through hole and method of manufacturing the same
07/29/2009CN101494949A High-frequency copper foil covered substrate, semi-solidification piece thereof and method for reducing signal loss of the copper foil covered substrate
07/29/2009CN101494948A Circuit board and its design method
07/29/2009CN101494211A Semiconductor device and circuit board
07/29/2009CN100521883C Method of manufacturing multilayer printed wiring board
07/29/2009CN100521882C Method of manufacturing multilayer printed wiring board
07/29/2009CN100521879C Method for making layers and wiring board made thereby
07/29/2009CN100521876C Method for processing a thin film substrate
07/29/2009CN100521870C Circuit board mounting panel and apparatus
07/29/2009CN100521869C Nanoparticle filled underfill
07/29/2009CN100521868C Multilayer printed wiring board and method of producing multilayer printed wiring board
07/29/2009CN100521867C Printed circuit board including embedded capacitors and method of manufacturing the same
07/29/2009CN100521866C Flexible copper-coated laminated board and mfg. method
07/29/2009CN100521865C High frequency signal transmission line having reduced noise
07/29/2009CN100521864C Anisotropic conducting film and circuitboard using film
07/29/2009CN100521470C Surface mounted power supply circuit apparatus and method for manufacturing the same
07/29/2009CN100521366C Inverted coplanar waveguide coupler with integrated microstrip connection ports
07/29/2009CN100521262C Light emitting assembly
07/29/2009CN100521199C Heat dissipation electronic devices and forming method thereof
07/29/2009CN100521167C Method for producing mixed integrated circuit apparatus
07/29/2009CN100521001C Multilayer ceramic electronic component and mounting structure and method for the same
07/29/2009CN100519630C Active energy line cured resin, optical solidified and thermosetting resin composition containing the resin and condensate thereof
07/29/2009CN100519623C Fluorinated aromatic polymer and use thereof
07/28/2009US7567153 Compact bandpass filter for double conversion tuner
07/28/2009US7567028 Organic electroluminescent device having supporting plate and method of fabricating the same
07/28/2009US7566960 Interposing structure
07/28/2009US7566834 Wiring board and semiconductor package using the same
07/28/2009US7566833 Wired circuit board and production method thereof
07/28/2009US7566592 Method and process of manufacturing robust high temperature solder joints
07/28/2009US7566501 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same
07/28/2009US7565738 Method for manufacturing circuit device
07/28/2009CA2550486C Printed board connector for differential signal transmission
07/23/2009WO2009091460A2 Circuit board having an electrodeposited coating on a conductive core within a via and method of making same
07/23/2009WO2009091005A1 Composite material for electrical/electronic component, electrical/electronic component, and method for producing composite material for electrical/electronic component
07/23/2009WO2009090915A1 Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for manufacturing light-emitting device
07/23/2009WO2009090717A1 Circuit board and method for mounting electronic component on printed board
07/23/2009WO2009089709A1 Printed circuit board, manufacturing method and radio-frequency apparatus thereof
07/23/2009WO2009068827A3 Device for protecting the pins of an electronic component
07/23/2009US20090186493 Multi-position mixed-contact connector with separable modular rj-45 coupler
07/23/2009US20090185357 Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
07/23/2009US20090185126 Metal line, method of forming the same, and a display using the same
07/23/2009US20090185096 Printed circuit board, method of mounting surface mounted devices on the printed circuit board and liquid crystal display including the printed circuit board
07/23/2009US20090185014 Printing cartridge for a printer
07/23/2009US20090184728 Contact device and method for producing the same
07/23/2009US20090184420 Post bump and method of forming the same
07/23/2009US20090184418 Wiring substrate, tape package having the same, and display device having the same
07/23/2009US20090184413 Insulative wiring board, semiconductor package using the same, and method for producing the insulative wiring board
07/23/2009US20090184090 Thin-film assembly and method for producing said assembly
07/23/2009US20090183911 Wiring board and method of manufacturing the same
07/23/2009US20090183910 Wiring board and method of manufacturing the same
07/23/2009US20090183909 Coreless substrate
07/23/2009US20090183908 Method for Manufacturing Conductive Contact Holder, and Conductive Contact Holder
07/23/2009US20090183907 Wired circuit board
07/23/2009US20090183906 Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same
07/23/2009US20090183905 Circuit board configuration
07/23/2009US20090183904 Printed wiring board and method for producing the same
07/23/2009US20090183903 Printed circuit board
07/23/2009US20090183902 Multilayer film for wiring and wiring circuit
07/23/2009US20090183901 Wiring Boards and Processes for Manufacturing the Same
07/23/2009US20090183900 Anti-static Spacer for High Temperature Curing Process of Flexible Printed Circuit Board
07/23/2009US20090183899 Printed wiring board
07/23/2009DE10297047B4 Lötfreie Leiterplatten-Baugruppe Solderless PCB assembly
07/23/2009DE102008004643A1 Multilayer printed circuit board has ground layer forming layer and has pulse or signal transmission lying in another layer spaced from former layer, where unit has ground island, which lies in third layer spaced from another layer
07/23/2009DE102008004621A1 Perforated multilayer printed circuit board for e.g. sensor in electrical/electronic circuit in punching technology, has metallic punching strips by which surface side is electrically insulated, where strips are connected to each other
07/23/2009DE102005047106B4 Leistungshalbleitermodul und Verfahren zur Herstellung The power semiconductor module and process for preparing
07/23/2009DE102004022176B4 Verfahren zur Herstellung von passiven Bauelementen auf einem Substrat A process for the production of passive components on a substrate
07/23/2009CA2711649A1 Circuit board having an electrodeposited coating on a conductive core within a via and method of making same
07/22/2009EP2081419A2 Printed circuit board and method of manufacturing printed circuit board
07/22/2009EP2081418A2 Method for making three-dimensional liquid crystal polymer multilayer circuit boards
07/22/2009EP2081416A2 Voltage supply module and backlight assembly having the same
07/22/2009EP2081222A1 Circuit connection structure