Patents for H05K 1 - Printed circuits (98,583)
06/2009
06/11/2009US20090145644 Printed wiring board, air conditioner, and method of soldering printed wiring board
06/11/2009US20090145643 Printed wiring board with a built-in resistive element
06/11/2009US20090145642 Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power module
06/11/2009US20090145641 Combining discrete electronic elements with printed electronic circuits
06/11/2009US20090145640 Conductive pattern formation ink, method of forming conductive pattern, conductive pattern and wiring substrate
06/11/2009US20090145639 Conductive pattern forming ink, conductive pattern, and wiring substrate
06/11/2009US20090145638 Conductive pattern formation ink, conductive pattern and wiring substrate
06/11/2009US20090145635 Wiring substrate, manufacturing method of the same, and electronic component device
06/11/2009US20090145634 Flexible printed circuitboard with reinforcement structure
06/11/2009US20090145633 Direct attach interconnect for connecting package and printed circuit board
06/11/2009US20090145632 Flexible printed circuit and method for manufacturing the same
06/11/2009US20090145631 Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter
06/11/2009US20090145630 Printed wiring board and method for manufacturing printed wiring board
06/11/2009US20090145629 Micromachine and Method for Manufacturing the Same
06/10/2009EP2068607A1 Seal structure
06/10/2009EP2068603A2 Large electronic component dampening fixation
06/10/2009EP2068419A2 Protection circuit module for a rechargeable battery
06/10/2009EP2068391A2 Device with crossed strip lines
06/10/2009EP2068360A2 Improved methods of mid-frequency decoupling and device providing an improved mid-frequency decoupling
06/10/2009EP2068228A2 Data processing system
06/10/2009EP2067550A1 Silver microparticle powder and method for production thereof
06/10/2009EP2067390A2 Method for producing an arrangement of optoelectronic components, and arrangement of optoelectronic components
06/10/2009EP1861651B1 Flat illuminating device
06/10/2009DE10356367B4 Verfahren zur Herstellung eines Bauelements und Bauelement A method for producing a component and component
06/10/2009DE10301682B4 Temperaturbelastbarer Shunt-Widerstand und Verfahren zur Herstellung eines solchen Shunt-Widerstandes Temperature-duty shunt resistor and method for producing such a shunt resistor
06/10/2009DE102008021347A1 Adapter for e.g. amplifier, of hearing aid, has recess adapted to positions of components on surface of electrical component, and contacts arranged on upper side and electrically connected with contacts on lower side
06/10/2009DE102008004470A1 Elektrische Schaltungsanordnung mit konzentrierten Elementen in Mehrlagensubstraten Electrical circuit with lumped elements in multi-layer substrates
06/10/2009DE102007059133A1 Substrat für ein LED-Submount und LED-Submount Substrate for an LED submount and LED submount
06/10/2009CN201256486Y Bond pad construction for hardware piece
06/10/2009CN201256485Y Circuit board having abrasion resistant welding disc
06/10/2009CN201256484Y Stamp type metalized semi-pore circuit board
06/10/2009CN201256483Y Covering film, flexible printed circuit board and pressing stack for printed circuit board manufacturing
06/10/2009CN201256482Y Shielding and grounding construction for flexible circuit board
06/10/2009CN201256481Y PCB board having contraposition pores
06/10/2009CN101455131A Circuit board device, wiring board connecting method, and circuit board module device
06/10/2009CN101455130A Wiring board
06/10/2009CN101455129A Shielded via
06/10/2009CN101455128A Electrical connector with segmented housing
06/10/2009CN101453831A Circuit board module
06/10/2009CN101453830A Portable electronic device and circuit transferring method
06/10/2009CN101453829A Method and device for providing substitute electric power supply graphic card
06/10/2009CN101453828A Electromagnetic bandgap structure and printed circuit board
06/10/2009CN101453827A Printed circuit board and manufacturing method thereof
06/10/2009CN101453826A Stacking construction of printed circuit board
06/10/2009CN101453825A Low loss multilayered circuit board
06/10/2009CN100499969C Module with built-in circuit component and method for producing the same
06/10/2009CN100499963C Wiring board provided with a resistor and process for manufacturing the same
06/10/2009CN100499962C Flexible printed circuit board and liquid crystal display having the same
06/10/2009CN100499961C Printed wiring board connection structure
06/10/2009CN100499960C Print substrate with tab terminal, electronic equipment and method of manufacture the same
06/10/2009CN100499959C Impregnated resin substrate
06/10/2009CN100497485C Resin composition and preimpregnated product for laminate and metal-clad laminate
06/10/2009CN100497484C Composite dielectric material and substrate
06/10/2009CN100497433C Radially multi-branched polymer and porous film using the same
06/09/2009US7545947 Hearing aid using printed circuit board
06/09/2009US7545652 Printed circuit board and differential signaling structure
06/09/2009US7545651 Memory module with a predetermined arrangement of pins
06/09/2009US7545649 Double sided flexible printed circuit board
06/09/2009US7545049 Electronic parts packaging structure
06/09/2009US7545044 Semiconductor device and radiation detector employing it
06/09/2009US7544899 Printed circuit board
06/09/2009US7544898 Multilayer wiring board, touch panel and manufacturing method of the same
06/09/2009US7544897 Connecting substrate, connecting structure. connection method and electronic apparatus
06/09/2009US7544629 20 to 39% of SiO2, from 5 to 35% of B2O3, from 2 to 15% of Al2O3, from 1 to 25% of CaO+SrO, from 5 to 25% of BaO, from 0 to 35% of ZnO, and from 0 to 10% of TiO2+ZrO2+SnO2, provided that B2O3+ZnO is from 15 to 45%, free of alkali metal oxides or contains such oxides less than 1%; low temperature firing
06/09/2009US7544263 Method of forming folded-stack packaged device using vertical progression folding tool
06/09/2009US7544064 Cyclindrical impedance matching connector standoff with optional common mode ferrite
06/09/2009US7543375 Process for filling via hole in a substrate
06/04/2009WO2009069987A2 Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit board
06/04/2009WO2009069807A1 Optical device, sealing board and method for manufacturing optical device
06/04/2009WO2009069791A1 Wiring substrate, mounting structure, and method for manufacturing the wiring substrate
06/04/2009WO2009069783A1 Circuit member connecting adhesive and semiconductor device
06/04/2009WO2009069560A1 Electronic circuit board, and method and structure for shielding electronic circuit board
06/04/2009WO2009068867A1 Junction box
06/04/2009WO2009068827A2 Device for protecting the pins of an electronic component
06/04/2009WO2009067996A2 Chip assembly, connecting assembly, led and method for producing a chip assembly
06/04/2009WO2009067985A1 Assembly comprising a light-emitting module and a flexible conductor
06/04/2009WO2009051679A3 Process for placing, securing and interconnecting electronic components
06/04/2009WO2009038950A3 Flexible circuit board, manufacturing method thereof, and electronic device using the same
06/04/2009US20090143657 Low-noise optical probes for reducing ambient noise
06/04/2009US20090142966 Plug for connection strips and method for the production thereof
06/04/2009US20090142477 Portable electronic device and transferring method of circuit element thereof
06/04/2009US20090141505 White heat-hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device
06/04/2009US20090141504 White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device
06/04/2009US20090141464 Wiring board and electronic component device
06/04/2009US20090141438 Circuit component, electrode connection structure and display device including the same
06/04/2009US20090141401 Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit
06/04/2009US20090141230 Clay Thin Film Substrate, Clay Thin Film Substrate with Electrode, and Display Device Using the Same
06/04/2009US20090141088 Inkjet Printhead Integrated Circuit
06/04/2009US20090139761 Multilayer printed wiring board and manufacturing method thereof
06/04/2009US20090139759 Laminated ceramic electronic component and manufacturing method therefor
06/04/2009US20090139757 Multilayer chip capacitor and circuit board device including the same
06/04/2009US20090139756 Fabricating process of circuit board with embedded passive component
06/04/2009US20090139755 Surface mounted semiconductor device and method for manufacturing same
06/04/2009US20090139754 Thermosetting Conductive Paste and Multilayer Ceramic Part Having an External Electrode Formed Using the Same
06/04/2009US20090139753 Copper Clad Laminate for Chip on Film
06/04/2009US20090139752 Electronic device and method for producing electronic device
06/04/2009US20090139751 Wiring substrate and manufacturing method thereof
06/04/2009US20090139750 Printed wiring board and printed circuit board unit and electronic apparatus
06/04/2009US20090139749 Method For The Preparation Of A Flexible Transducer Unit, The Flexible Transducer Unit So Prepared And An Array Containing Such Flexible Transducer Units
06/04/2009US20090139748 Wiring substrate