Patents for H05K 1 - Printed circuits (98,583) |
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08/26/2009 | CN100532918C Circular lighting device and its manufacturing method |
08/26/2009 | CN100532105C Flexible printhead circuit |
08/26/2009 | CN100532087C Layer structure, its making method and its application |
08/26/2009 | CN100532059C Method and device for forming modularized electronic component and modularized electronic component |
08/25/2009 | US7580326 Optical pickup actuator preventing short circuit by minimizing unwanted contact between components |
08/25/2009 | US7580269 Apparatus for supplying power to a semiconductor device using a capacitor DC shunt |
08/25/2009 | US7580075 Optical device and production method thereof |
08/25/2009 | US7579693 Mounting structure of ball grid array |
08/25/2009 | US7579554 Heat sink arrangement for electrical apparatus |
08/25/2009 | US7579553 Front-and-back electrically conductive substrate |
08/25/2009 | US7579552 Tab tape for tape carrier package |
08/25/2009 | US7579392 Low-viscosity epoxy resin; a phenolic chain extender; catalyst that promotes self-curing reactions between epoxy groups; an inhibitor that inhibits the activity of the the activity of the catalyst under "B-staging" conditions |
08/25/2009 | US7579288 Method of manufacturing a microelectronic component utilizing a tool comprising an ESD dissipative ceramic |
08/25/2009 | US7579269 Microelectronic spring contact elements |
08/25/2009 | US7579251 Aerosol deposition process |
08/25/2009 | US7579074 A gold-coated or -impregnated substrate; aqueous gold colloid solution of a phase transfer agent, 4-dimethylaminopyridine and stabilizer, sodium 2-mercaptoethanesulfonic acid; environmentally friendly; storage stability; gloss; heat resistance; antiagglomerants; ink jet printing; catalysts; circuits |
08/25/2009 | US7579069 Multilayer; joining layers with different thermal expansion |
08/25/2009 | US7578681 Electronic device including printed circuit board and electronic element mounted on the printed circuit board |
08/20/2009 | WO2009102721A2 System and method for integrated waveguide packaging |
08/20/2009 | WO2009102108A1 Printed circuit board |
08/20/2009 | WO2009079182A3 High temperature composite tape and method for manufacturing the same |
08/20/2009 | WO2009069987A3 Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit board |
08/20/2009 | WO2009046468A3 Method and device for positioning and aligning an object relatively to or with a substrate and use thereof |
08/20/2009 | US20090210604 Memory Module Having Signal Lines Configured for Sequential Arrival of Signals at Synchronous Memory Devices |
08/20/2009 | US20090209120 Connector |
08/20/2009 | US20090209119 Connector |
08/20/2009 | US20090207576 Slotted magnetic material for integrated circuit inductors |
08/20/2009 | US20090207575 Oc2 oriented connections 2 |
08/20/2009 | US20090207574 Electronic package structure |
08/20/2009 | US20090207368 Module with fpc and manufacturing method for the same |
08/20/2009 | US20090207336 Flexible printed circuit board and display device having the same |
08/20/2009 | US20090206710 Connecting support for holding motor electronics |
08/20/2009 | US20090206678 Circuit having a micro crush capacitor |
08/20/2009 | US20090206494 Wiring over substrate, semiconductor device, and methods for manufacturing thereof |
08/20/2009 | US20090206471 Electronic parts packaging structure and method of manufacturing the same |
08/20/2009 | US20090206463 Semiconductor device, method of manufacturing the same, and electronic equipment using the same |
08/20/2009 | US20090205862 Printed circuit board and manufacturing method thereof |
08/20/2009 | US20090205860 Wiring substrate, manufacturing method thereof and semiconductor package |
08/20/2009 | US20090205859 Method of manufacturing printed wiring board with built-in electronic component |
08/20/2009 | US20090205858 Circuit carrier |
08/20/2009 | US20090205857 Printed wiring board and method for producing the same |
08/20/2009 | US20090205856 A dihydroxydiphenyl(cyclo)alkane-initiated polyphenylene ether oligomer endcapped with epichlorohydrin reacted with (meth)acrylic acid or cyanic acid; laminates, prepregs, printed circuits; low dielectric constant, a low dielectric loss tangent and high toughness |
08/20/2009 | US20090205855 Stiffener sheet and flexible printed circuit board using the same |
08/20/2009 | US20090205854 Printed circuit board for a package and manufacturing method thereof |
08/20/2009 | US20090205853 Method for applying a metal on a substrate |
08/20/2009 | US20090205852 Circuit board and manufacturing method thereof |
08/20/2009 | US20090205851 Electronic circuit device and method for fabricating the same |
08/20/2009 | DE10220924B4 Sensorschaltungsmodul und elektronische Vorrichtung unter Verwendung desselben The same sensor circuit module and electronic device using |
08/20/2009 | DE102005008491B4 Leistungs-Halbleitervorrichtung und Verfahren zu ihrer Herstellung Power semiconductor device and process for their preparation |
08/19/2009 | EP2091311A1 Wiring board and its manufacturing method |
08/19/2009 | EP2091308A2 Switching with integrated shielding and hearing aid |
08/19/2009 | EP2091307A1 Circuit board connection structure and circuit board |
08/19/2009 | EP2090911A1 Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby |
08/19/2009 | EP2090144A1 Flipped micro-strip filter |
08/19/2009 | EP2089100A2 Flexible circuit electrode array |
08/19/2009 | EP1297431B1 Multiple channel modules and bus systems |
08/19/2009 | CN201294677Y Threading structure for printing plate electrical wire |
08/19/2009 | CN101513144A Printed wiring board |
08/19/2009 | CN101513138A Circuit device and manufacturing method thereof, and connection element |
08/19/2009 | CN101512840A Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape |
08/19/2009 | CN101511934A Resin composition, prepreg and laminate |
08/19/2009 | CN101511900A Epoxy resin composition for printed circuit board, resin composition Chinese varnish, preforming material, metal-coating lamination body, printed circuit board and multi-layer printed circuit board |
08/19/2009 | CN101511153A Electronics casing with a circuit board and method for producing an electronics casing |
08/19/2009 | CN101511147A Physical design for four-layer soft and hard combined board |
08/19/2009 | CN101510920A Filling-in type line filter |
08/19/2009 | CN101510515A Circuit board, manufacturing method thereof and chip packaging structure |
08/19/2009 | CN100531543C Grounding device for reducing electromagnetic interference |
08/19/2009 | CN100531529C Printed circuit board with embedded capacitors therein and manufacturing process thereof |
08/19/2009 | CN100531528C 多层印刷配线板 Multilayer printed wiring board |
08/19/2009 | CN100531525C Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus |
08/19/2009 | CN100531523C Nano spraying circuit board producing method and equipment and material configuration |
08/19/2009 | CN100531520C Bank structure, method of forming bank structure, device, electro-optical device and electronic apparatus |
08/19/2009 | CN100531516C Printing circuit board |
08/19/2009 | CN100531515C Printing circuit board with modified power zone block |
08/19/2009 | CN100531514C Short-proof printed circuit board structure |
08/19/2009 | CN100531513C Connection structure of printed wiring board |
08/19/2009 | CN100531512C Resin-impregnated substrate |
08/19/2009 | CN100531511C Printed circuit board with improved differential via |
08/19/2009 | CN100531510C Pliable printed circuit |
08/19/2009 | CN100531509C 电路装置 Circuit means |
08/19/2009 | CN100531477C Transparent window with non-transparent contact surface for a soldering bonding |
08/19/2009 | CN100530816C Directivity coupler |
08/19/2009 | CN100530815C Transmission line apparatus |
08/19/2009 | CN100530685C Low-inductance gated thyristor and its power semiconductor assembly |
08/19/2009 | CN100530625C Wiring substrate of a semiconductor component comprising external contact pads for external contacts and method for producing the same |
08/19/2009 | CN100530455C Electronic transformer/inductor devices and methods for making same |
08/19/2009 | CN100529871C Production method of flexible electronic device |
08/19/2009 | CN100529825C Automatic microdistance regulation type mobile phone camera module group assembling process |
08/19/2009 | CN100529814C Optical wiring substrate and optical and electric combined substrate |
08/19/2009 | CN100528927C Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
08/18/2009 | US7577967 Flexible printed circuit for optical disk drive |
08/18/2009 | US7577789 Upgradable memory system with reconfigurable interconnect |
08/18/2009 | US7576992 Flexible printed circuit and display device utilizing the same |
08/18/2009 | US7576991 Electrical equipment for junction and method of manufacturing the same |
08/18/2009 | US7576990 Thin hard drive with 2-piece-casing and ground pin standoff to reduce ESD damage to stacked PCBA's |
08/18/2009 | US7576288 Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards |
08/18/2009 | US7576287 Lot traceable printed circuit board |
08/18/2009 | US7575778 Method of applying a polymer thick-film resistive paste for making polymer thick-film resistor having improved tolerances |
08/18/2009 | US7574793 Process of forming a laminate ceramic circuit board |
08/13/2009 | WO2009100296A1 Communications connector with improved contacts |