Patents for H05K 1 - Printed circuits (98,583)
08/2009
08/26/2009CN100532918C Circular lighting device and its manufacturing method
08/26/2009CN100532105C Flexible printhead circuit
08/26/2009CN100532087C Layer structure, its making method and its application
08/26/2009CN100532059C Method and device for forming modularized electronic component and modularized electronic component
08/25/2009US7580326 Optical pickup actuator preventing short circuit by minimizing unwanted contact between components
08/25/2009US7580269 Apparatus for supplying power to a semiconductor device using a capacitor DC shunt
08/25/2009US7580075 Optical device and production method thereof
08/25/2009US7579693 Mounting structure of ball grid array
08/25/2009US7579554 Heat sink arrangement for electrical apparatus
08/25/2009US7579553 Front-and-back electrically conductive substrate
08/25/2009US7579552 Tab tape for tape carrier package
08/25/2009US7579392 Low-viscosity epoxy resin; a phenolic chain extender; catalyst that promotes self-curing reactions between epoxy groups; an inhibitor that inhibits the activity of the the activity of the catalyst under "B-staging" conditions
08/25/2009US7579288 Method of manufacturing a microelectronic component utilizing a tool comprising an ESD dissipative ceramic
08/25/2009US7579269 Microelectronic spring contact elements
08/25/2009US7579251 Aerosol deposition process
08/25/2009US7579074 A gold-coated or -impregnated substrate; aqueous gold colloid solution of a phase transfer agent, 4-dimethylaminopyridine and stabilizer, sodium 2-mercaptoethanesulfonic acid; environmentally friendly; storage stability; gloss; heat resistance; antiagglomerants; ink jet printing; catalysts; circuits
08/25/2009US7579069 Multilayer; joining layers with different thermal expansion
08/25/2009US7578681 Electronic device including printed circuit board and electronic element mounted on the printed circuit board
08/20/2009WO2009102721A2 System and method for integrated waveguide packaging
08/20/2009WO2009102108A1 Printed circuit board
08/20/2009WO2009079182A3 High temperature composite tape and method for manufacturing the same
08/20/2009WO2009069987A3 Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit board
08/20/2009WO2009046468A3 Method and device for positioning and aligning an object relatively to or with a substrate and use thereof
08/20/2009US20090210604 Memory Module Having Signal Lines Configured for Sequential Arrival of Signals at Synchronous Memory Devices
08/20/2009US20090209120 Connector
08/20/2009US20090209119 Connector
08/20/2009US20090207576 Slotted magnetic material for integrated circuit inductors
08/20/2009US20090207575 Oc2 oriented connections 2
08/20/2009US20090207574 Electronic package structure
08/20/2009US20090207368 Module with fpc and manufacturing method for the same
08/20/2009US20090207336 Flexible printed circuit board and display device having the same
08/20/2009US20090206710 Connecting support for holding motor electronics
08/20/2009US20090206678 Circuit having a micro crush capacitor
08/20/2009US20090206494 Wiring over substrate, semiconductor device, and methods for manufacturing thereof
08/20/2009US20090206471 Electronic parts packaging structure and method of manufacturing the same
08/20/2009US20090206463 Semiconductor device, method of manufacturing the same, and electronic equipment using the same
08/20/2009US20090205862 Printed circuit board and manufacturing method thereof
08/20/2009US20090205860 Wiring substrate, manufacturing method thereof and semiconductor package
08/20/2009US20090205859 Method of manufacturing printed wiring board with built-in electronic component
08/20/2009US20090205858 Circuit carrier
08/20/2009US20090205857 Printed wiring board and method for producing the same
08/20/2009US20090205856 A dihydroxydiphenyl(cyclo)alkane-initiated polyphenylene ether oligomer endcapped with epichlorohydrin reacted with (meth)acrylic acid or cyanic acid; laminates, prepregs, printed circuits; low dielectric constant, a low dielectric loss tangent and high toughness
08/20/2009US20090205855 Stiffener sheet and flexible printed circuit board using the same
08/20/2009US20090205854 Printed circuit board for a package and manufacturing method thereof
08/20/2009US20090205853 Method for applying a metal on a substrate
08/20/2009US20090205852 Circuit board and manufacturing method thereof
08/20/2009US20090205851 Electronic circuit device and method for fabricating the same
08/20/2009DE10220924B4 Sensorschaltungsmodul und elektronische Vorrichtung unter Verwendung desselben The same sensor circuit module and electronic device using
08/20/2009DE102005008491B4 Leistungs-Halbleitervorrichtung und Verfahren zu ihrer Herstellung Power semiconductor device and process for their preparation
08/19/2009EP2091311A1 Wiring board and its manufacturing method
08/19/2009EP2091308A2 Switching with integrated shielding and hearing aid
08/19/2009EP2091307A1 Circuit board connection structure and circuit board
08/19/2009EP2090911A1 Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby
08/19/2009EP2090144A1 Flipped micro-strip filter
08/19/2009EP2089100A2 Flexible circuit electrode array
08/19/2009EP1297431B1 Multiple channel modules and bus systems
08/19/2009CN201294677Y Threading structure for printing plate electrical wire
08/19/2009CN101513144A Printed wiring board
08/19/2009CN101513138A Circuit device and manufacturing method thereof, and connection element
08/19/2009CN101512840A Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape
08/19/2009CN101511934A Resin composition, prepreg and laminate
08/19/2009CN101511900A Epoxy resin composition for printed circuit board, resin composition Chinese varnish, preforming material, metal-coating lamination body, printed circuit board and multi-layer printed circuit board
08/19/2009CN101511153A Electronics casing with a circuit board and method for producing an electronics casing
08/19/2009CN101511147A Physical design for four-layer soft and hard combined board
08/19/2009CN101510920A Filling-in type line filter
08/19/2009CN101510515A Circuit board, manufacturing method thereof and chip packaging structure
08/19/2009CN100531543C Grounding device for reducing electromagnetic interference
08/19/2009CN100531529C Printed circuit board with embedded capacitors therein and manufacturing process thereof
08/19/2009CN100531528C 多层印刷配线板 Multilayer printed wiring board
08/19/2009CN100531525C Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus
08/19/2009CN100531523C Nano spraying circuit board producing method and equipment and material configuration
08/19/2009CN100531520C Bank structure, method of forming bank structure, device, electro-optical device and electronic apparatus
08/19/2009CN100531516C Printing circuit board
08/19/2009CN100531515C Printing circuit board with modified power zone block
08/19/2009CN100531514C Short-proof printed circuit board structure
08/19/2009CN100531513C Connection structure of printed wiring board
08/19/2009CN100531512C Resin-impregnated substrate
08/19/2009CN100531511C Printed circuit board with improved differential via
08/19/2009CN100531510C Pliable printed circuit
08/19/2009CN100531509C 电路装置 Circuit means
08/19/2009CN100531477C Transparent window with non-transparent contact surface for a soldering bonding
08/19/2009CN100530816C Directivity coupler
08/19/2009CN100530815C Transmission line apparatus
08/19/2009CN100530685C Low-inductance gated thyristor and its power semiconductor assembly
08/19/2009CN100530625C Wiring substrate of a semiconductor component comprising external contact pads for external contacts and method for producing the same
08/19/2009CN100530455C Electronic transformer/inductor devices and methods for making same
08/19/2009CN100529871C Production method of flexible electronic device
08/19/2009CN100529825C Automatic microdistance regulation type mobile phone camera module group assembling process
08/19/2009CN100529814C Optical wiring substrate and optical and electric combined substrate
08/19/2009CN100528927C Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same
08/18/2009US7577967 Flexible printed circuit for optical disk drive
08/18/2009US7577789 Upgradable memory system with reconfigurable interconnect
08/18/2009US7576992 Flexible printed circuit and display device utilizing the same
08/18/2009US7576991 Electrical equipment for junction and method of manufacturing the same
08/18/2009US7576990 Thin hard drive with 2-piece-casing and ground pin standoff to reduce ESD damage to stacked PCBA's
08/18/2009US7576288 Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards
08/18/2009US7576287 Lot traceable printed circuit board
08/18/2009US7575778 Method of applying a polymer thick-film resistive paste for making polymer thick-film resistor having improved tolerances
08/18/2009US7574793 Process of forming a laminate ceramic circuit board
08/13/2009WO2009100296A1 Communications connector with improved contacts