| Patents for H05K 1 - Printed circuits (98,583) |
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| 06/18/2009 | US20090155632 Protection circuit assembly and battery pack having the same |
| 06/18/2009 | US20090154752 Condenser microphone |
| 06/18/2009 | US20090154176 Electronic component and method for manufacturing same |
| 06/18/2009 | US20090154132 Printed wiring board and method for manufacturing printed wiring board |
| 06/18/2009 | US20090154131 Conductive connecting pin and package substrate |
| 06/18/2009 | US20090154130 Micro-sensor and manufacturing method thereof |
| 06/18/2009 | US20090154127 PCB Embedded Electronic Elements Structure And Method Thereof |
| 06/18/2009 | US20090154124 Microwave chip supporting structure |
| 06/18/2009 | US20090154123 Systems and Methods for Providing a Grounded Card in an Information Handling System |
| 06/18/2009 | US20090154122 Mechanical component-containing board and method of manufacturing same |
| 06/18/2009 | US20090153765 Wiring substrate and display device including the same |
| 06/18/2009 | US20090153163 Circuit board having bypass pad |
| 06/18/2009 | US20090153001 Driving Circuit Board Assembly for Motor |
| 06/18/2009 | US20090151997 Circuit board |
| 06/18/2009 | US20090151996 Product having through-hole and laser processing method |
| 06/18/2009 | US20090151995 Package for semiconductor device and method of manufacturing the same |
| 06/18/2009 | US20090151994 Wired circuit board |
| 06/18/2009 | US20090151992 Formation and integration of passive structures using silicon and package substrate |
| 06/18/2009 | US20090151991 Mounting structure, electrooptic device, and electronic apparatus |
| 06/18/2009 | US20090151990 Multilayer wiring board and method of making the same |
| 06/18/2009 | US20090151989 Insulating layer for rigid printed circuit boards |
| 06/18/2009 | US20090151988 Flexible printed circuit board and method of manufacturing the same |
| 06/18/2009 | US20090151987 Composition for producing printed circuit board and printed circuit board using the same |
| 06/18/2009 | US20090151986 Method of manufacturing wiring board, wiring board, and semiconductor device |
| 06/18/2009 | US20090151985 Method of dicing a circuit board sheet and package circuit board |
| 06/18/2009 | US20090151984 Composite resin molded article, laminate, multi-layer circuit board, and electronic device |
| 06/18/2009 | US20090151158 Technique for laminating multiple substrates |
| 06/18/2009 | DE19706983B4 Oberflächenanbringungseinheit und Wandleranordnungen unter Verwendung der Oberflächenanbringungseinheit Surface mounting unit and transducer assemblies using the surface mounting unit |
| 06/18/2009 | DE19521712B4 Vorrichtung zum Erfassen einer physikalischen Größe A device for detecting a physical quantity |
| 06/18/2009 | DE102008058749A1 Verfahren zur Herstellung einer Leiterplattenbaugruppe für eine Steuereinheit A method of manufacturing a circuit board assembly for a control unit |
| 06/18/2009 | DE102007060429A1 Electronic module i.e. controller, for e.g. engine of motor vehicle, has contact plug for contacting circuits formed on circuit carriers, where contact plug includes two different sets of contact pins with different lengths |
| 06/17/2009 | EP2071907A1 Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board |
| 06/17/2009 | EP2071906A1 Method of producing a device including at least two distinct components interconnected by interconnection wires and device obtained |
| 06/17/2009 | EP2070961A1 Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board |
| 06/17/2009 | EP2070400A1 Distortion-tolerant processing |
| 06/17/2009 | EP2070399A2 Printed substrate through which very strong currents can pass and corresponding production method |
| 06/17/2009 | EP2070116A1 Modular backlighting device |
| 06/17/2009 | EP2069842A1 Illumination devices and methods for making the same |
| 06/17/2009 | EP2069429A2 Nano and meso shell-core control of physical properties and performance of electrically insulating composites |
| 06/17/2009 | EP1606982B1 Method for electrically and mechanically connecting two printed boards |
| 06/17/2009 | EP1382232B1 Protection of conductive connection by electrophoresis coating and structure formed therewith |
| 06/17/2009 | EP1119287B1 Emg electrode apparatus and positioning system |
| 06/17/2009 | CN201260271Y Circuit board with slot type capacitor hole structure |
| 06/17/2009 | CN201260270Y Epoxy glass cloth based single surface copper foil coated plate |
| 06/17/2009 | CN201260269Y Printed circuit board |
| 06/17/2009 | CN101461293A Circuit carrier |
| 06/17/2009 | CN101461292A Electronic module and procedure for at least the partial scrapping of the electronic module |
| 06/17/2009 | CN101460009A Mounting structure, electrooptic device, and electronic apparatus |
| 06/17/2009 | CN101460008A Circuit board having improved support cloth construction and support cloth construction thereof |
| 06/17/2009 | CN101460007A Circuit board |
| 06/17/2009 | CN101460006A Signal shunt and signal transmission equipment |
| 06/17/2009 | CN101460005A Combined experiment board for electronic circuit |
| 06/17/2009 | CN100502631C Semiconductor device, noise reduction method, and shield cover |
| 06/17/2009 | CN100502621C Connection structure of inner conductor and multilayer substrate |
| 06/17/2009 | CN100502619C Printed circuit board having three-dimensional spiral inductor and method of fabricating same |
| 06/17/2009 | CN100502618C Circuit board module and its forming method |
| 06/17/2009 | CN100502617C Power amplification circuit board, and grounding method |
| 06/17/2009 | CN100502616C Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same |
| 06/17/2009 | CN100502615C Welding pad disposed on the circuitry |
| 06/17/2009 | CN100502614C Printed circuit board structure for high-speed signal |
| 06/17/2009 | CN100501983C 半导体芯片封装 The semiconductor chip package |
| 06/17/2009 | CN100501960C Lead solder indicator and method |
| 06/17/2009 | CN100500770C Spherical coated magnesium oxide powder and method for production thereof, and resin composition comprising the powder |
| 06/16/2009 | USRE40749 Cable assembly with equalizer board |
| 06/16/2009 | US7548432 Embedded capacitor structure |
| 06/16/2009 | US7548431 Optically connectable circuit board with optical component(s) mounted thereon |
| 06/16/2009 | US7547975 Module with embedded semiconductor IC and method of fabricating the module |
| 06/16/2009 | US7547974 Wiring substrate with improvement in tensile strength of traces |
| 06/16/2009 | US7547850 Semiconductor device assemblies with compliant spring contact structures |
| 06/16/2009 | US7547849 Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto |
| 06/16/2009 | US7547745 Epoxy resin hardener of anhydride copolymer and anhydride-elastomer copolymer |
| 06/16/2009 | US7547479 Tin-coated printed circuit boards with low tendency to whisker formation |
| 06/16/2009 | US7546675 Method and system for manufacturing a wireless communication device |
| 06/16/2009 | CA2284978C Conductive paste |
| 06/11/2009 | WO2009073670A1 Bendable circuit structure for led mounting and interconnection |
| 06/11/2009 | WO2009072182A1 Circuit board and electronic device |
| 06/11/2009 | WO2009071489A1 Retaining device and safety cap arrangement having brittle cover element |
| 06/11/2009 | WO2009071387A1 Printed circuit board comprising contact pins connected thereto |
| 06/11/2009 | WO2009071142A2 Electrical circuit arrangement and filter having concentrated elements comprising said electrical circuit arrangement in multi-layer substrates |
| 06/11/2009 | WO2009055539A3 Asymmetric dielectric films |
| 06/11/2009 | WO2009053255A3 Interconnect device having high component density |
| 06/11/2009 | WO2008126078A3 System and method for generating a finite elements model of a pcb |
| 06/11/2009 | WO2008116106A8 Circuit card assembly including individually testable layers |
| 06/11/2009 | WO2007092113A3 Interconnected printed circuit boards |
| 06/11/2009 | WO2003024164A3 Clip for replaceable surface mounted devices |
| 06/11/2009 | WO2002078781A3 Method and apparatus for providing hermetic electrical feedthrough |
| 06/11/2009 | US20090149049 Electrical Connector |
| 06/11/2009 | US20090148106 Line-side out-of-band electrical interface for optoelectronic modules |
| 06/11/2009 | US20090147492 Data processing system |
| 06/11/2009 | US20090147491 Receiving apparatus and board installation member |
| 06/11/2009 | US20090146286 Direct attach interconnect for connecting package and printed circuit board |
| 06/11/2009 | US20090145766 Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
| 06/11/2009 | US20090145653 Substrate pad structure |
| 06/11/2009 | US20090145651 Multilayer wiring board and method for producing the same |
| 06/11/2009 | US20090145650 Screen mask, method for printing conductive bonding material, mounting method of mounting devices, and mounting substrate |
| 06/11/2009 | US20090145649 Multi-layered wiring substrate, method for producing the same, and semiconductor device |
| 06/11/2009 | US20090145648 Multilayer wiring board, manufacturing method thereof, and semiconductor device |
| 06/11/2009 | US20090145647 Surface mount device |
| 06/11/2009 | US20090145646 Electromagnetic bandgap structure and printed circuit board |
| 06/11/2009 | US20090145645 Interconnection element with posts formed by plating |