| Patents for H05K 1 - Printed circuits (98,583) |
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| 07/14/2009 | US7561438 Electronic device incorporating a multilayered capacitor formed on a printed circuit board |
| 07/14/2009 | US7561434 Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon |
| 07/14/2009 | US7561433 Apparatus and method for a clip device for coupling a heat sink plate system with a burn-in board system |
| 07/14/2009 | US7561432 Memory card reader apparatus |
| 07/14/2009 | US7560819 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 07/14/2009 | US7560650 Substrate structure and method for manufacturing the same |
| 07/14/2009 | US7560518 A dihydroxydiphenyl(cyclo)alkane-initiated polyphenylene ether oligomer endcapped with epichlorohydrin reacted with (meth)acrylic acid or cyanic acid; laminates, prepregs, printed circuits; low dielectric constant, a low dielectric loss tangent and high toughness |
| 07/14/2009 | US7560005 Fluoropolymer laminates and a process for manufacture thereof |
| 07/14/2009 | US7559140 Method for mounting multishaft servo amplifier module |
| 07/14/2009 | US7559138 Method for replacing defective PCB from PCB panel |
| 07/14/2009 | US7559131 Method of making a radio frequency identification (RFID) tag |
| 07/14/2009 | CA2405991C Transparent substrate provided with electroconductive strips |
| 07/09/2009 | WO2009086146A2 Plated dielectric frame with integrated connector |
| 07/09/2009 | WO2009084958A1 Stacked foil sheet device |
| 07/09/2009 | WO2009084533A1 Copper foil with resin and process for producing copper foil with resin |
| 07/09/2009 | WO2009084412A1 Method for manufacturing double layer copper clad laminated board, and double layer copper clad laminated board |
| 07/09/2009 | WO2009083890A1 Apparatus and method for chip-scale package with capacitors as bumps |
| 07/09/2009 | WO2009083505A1 Method for producing an electrical conductor by applying at least one paste, in particular thick-film paste |
| 07/09/2009 | WO2009083021A1 Circuit configuration for eliminating emc interference |
| 07/09/2009 | WO2009040283A3 Electronic component and method for integrating a communication unit |
| 07/09/2009 | US20090176384 Connecting Structure Of Circuit Board, Connecting Part of Circuit Board and Electronic Device |
| 07/09/2009 | US20090176080 Stiffener and strengthened flexible printed circuit board having the same |
| 07/09/2009 | US20090175019 Circuit-board module and manufacturing method |
| 07/09/2009 | US20090175017 Circuit board and manufacturing method thereof |
| 07/09/2009 | US20090175016 Clip for attaching panels |
| 07/09/2009 | US20090175015 Printed board unit and fixing parts thereof |
| 07/09/2009 | US20090175013 System of components in an electronic device |
| 07/09/2009 | US20090175012 Press fit passive component |
| 07/09/2009 | US20090175011 Package substrate with built-in capacitor and manufacturing method thereof |
| 07/09/2009 | US20090175010 Method of repair of electronic device and repair system |
| 07/09/2009 | US20090175007 Electronic Plug-In Module for Accommodation in a Module Rack |
| 07/09/2009 | US20090174502 Printed board and filter using the same |
| 07/09/2009 | US20090174072 Semiconductor system having bga package with radially ball-depopulated substrate zones and board with radial via zones |
| 07/09/2009 | US20090174060 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 07/09/2009 | US20090173532 Wiring board having a non-through hole with a vent hole |
| 07/09/2009 | US20090173531 Printed circuit board and manufacturing method thereof |
| 07/09/2009 | US20090173529 Circuit structure and fabrication method thereof |
| 07/09/2009 | US20090173528 Circuit board ready to slot |
| 07/09/2009 | US20090173527 Method for Integrating Functional Nanostructures Into Microelectric and Nanoelectric circuits |
| 07/09/2009 | US20090173526 Electrical Component with a Sensor Element, Method for the Encapsulation of a Sensor Element, and Method for Production of a Plate Arrangement |
| 07/09/2009 | US20090173525 Printed wiring board and printed substrate unit |
| 07/09/2009 | US20090173524 Dual density printed circuit board isolation planes and method of manufacture thereof |
| 07/09/2009 | US20090173523 Multilayer build-up wiring board |
| 07/09/2009 | US20090173522 Interposer and method for manufacturing interposer |
| 07/09/2009 | US20090173521 Wired circuit board |
| 07/09/2009 | US20090173520 Reduction of jitter in a semiconductor device by controlling printed ciucuit board and package substrate stackup |
| 07/09/2009 | DE19609118B4 Widerstandspaste, Glasüberzugsspaste und ein diese verwendendes keramisches Schaltungssubstrat Resistor paste this Glasüberzugsspaste and a ceramic-use circuit substrate |
| 07/09/2009 | DE112007000628T5 Layout mit versetztem Segment für differentielle Signalbahnen zum Begegnen des Bündelgeflechteffekts Layout with offset segment for differential signal paths to Meet the bundle braid effect |
| 07/09/2009 | DE10334531B4 Speichermodul und Speichersystem, geeignet für einen Hochgeschwindigkeitsbetrieb Memory module and storage system suitable for a high speed operation |
| 07/09/2009 | DE102008060797A1 Verbesserte Isolierschicht für steife Leiterplatten Improved insulation of rigid printed circuit boards |
| 07/09/2009 | DE102006052620B4 Schaltungsanordnung mit einem Leistungsmodul, das mit einer Leiterplatte kombiniert ist. Circuit arrangement having a power module that is combined with a circuit board. |
| 07/08/2009 | EP2077703A1 Printed circuit board and method of manufacturing printed circuit board |
| 07/08/2009 | EP2077702A2 Wiring board and manufacturing method thereof and wiring board assembly |
| 07/08/2009 | EP2077701A2 Flexible film and display device comprising the same |
| 07/08/2009 | EP2076414A1 Connecting support for holding motor electronics |
| 07/08/2009 | EP2076386A2 Low dielectric glass fiber |
| 07/08/2009 | EP1969908B1 Electric device comprising a lubricated joint point and method for lubricating said type of joint point |
| 07/08/2009 | EP1336329B1 Printed circuit board assembly and method of producing it |
| 07/08/2009 | CN201270625Y Printed circuit board and adhering structure for heat radiation fin |
| 07/08/2009 | CN201270624Y Installation construction for PCB heat radiation sheet |
| 07/08/2009 | CN201270623Y Circuit board module having formed polygon circuit |
| 07/08/2009 | CN201270622Y 一种线路板 A circuit board |
| 07/08/2009 | CN201270621Y PCB chip position heat radiation seat |
| 07/08/2009 | CN201270620Y Special shaped planar element placement board contruction |
| 07/08/2009 | CN201270619Y PCB board with micro reflection construction |
| 07/08/2009 | CN201270618Y Flexible circuit board |
| 07/08/2009 | CN101480112A Noise suppressing wiring member and printed wiring board |
| 07/08/2009 | CN101479740A Combined multi-frequency electromagnetic and optical communication system |
| 07/08/2009 | CN101478859A Printed circuit board manufacturing method, display module and assembling method thereof |
| 07/08/2009 | CN101478858A Circuit board construction, manufacturing method and liquid crystal display |
| 07/08/2009 | CN100512607C Method for manufacture of laminated ceramic substrate and multilayer ceramic substrate |
| 07/08/2009 | CN100512606C Multilayer ceramic substrate and method for manufacture thereof |
| 07/08/2009 | CN100512604C Circuit board, multi-layer wiring board, method for making circuit board, and method for making multi-layer wiring board |
| 07/08/2009 | CN100512603C Method for manufacturing double-sided printed glass board |
| 07/08/2009 | CN100512599C Board for printed wiring and printed wiring board |
| 07/08/2009 | CN100512597C Method for manufacturing circuit board |
| 07/08/2009 | CN100512596C Electronic circuit device and method for manufacturing |
| 07/08/2009 | CN100512595C Copper foil for printed-circuit board |
| 07/08/2009 | CN100512594C Preferential ground and via exit structures for printed circuit boards |
| 07/08/2009 | CN100512593C High frequency printed circuit board via VIA |
| 07/08/2009 | CN100512029C Hinge assembly for multi-configuration portable electronic device |
| 07/08/2009 | CN100511509C Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same |
| 07/08/2009 | CN100511502C Inductor, transformer and manufacturing method thereof |
| 07/08/2009 | CN100511490C Conductive materials with electrical stability for use in electronics devices |
| 07/08/2009 | CN100511034C Shielding box |
| 07/08/2009 | CN100509354C Film and magnetic-recording medium using the same |
| 07/07/2009 | US7558073 Multifunctional peripheral device |
| 07/07/2009 | US7558059 Circuit board and electronic apparatus |
| 07/07/2009 | US7557450 Wiring substrate and electronic parts packaging structure |
| 07/07/2009 | US7557445 Multilayer substrate and the manufacturing method thereof |
| 07/07/2009 | US7557304 Printed circuit board having closed vias |
| 07/07/2009 | US7557303 Electronic component connection support structures including air as a dielectric |
| 07/07/2009 | US7556884 Battery pack and thermostat used therefor |
| 07/07/2009 | US7556850 Wiring circuit board |
| 07/07/2009 | US7556747 Electrically conductive pastes |
| 07/07/2009 | US7556719 Comprising conductor layer, insulating layer located adjacent to conductor layer, and terminal portion formed by conductor layer exposed by opening insulating layer, forming thin metal film on surface of insulating layer and surface, the removing; prevents electrostatic damage |
| 07/07/2009 | US7555834 Method of manufacturing an interconnection device |
| 07/02/2009 | WO2009082314A1 A waveguide transition arrangement |
| 07/02/2009 | WO2009082005A1 Surface reactive support body, wiring board that uses same, and fabrication method therefor |
| 07/02/2009 | WO2009081889A1 Copper foil for printed wiring board |