| Patents for H05K 1 - Printed circuits (98,583) |
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| 08/06/2009 | DE102009005691A1 Elektrisch leitfähige Schicht, Laminat, welches diese verwendet und Herstellungsverfahren dafür Electrically conductive layer, laminate, which uses them and processes for its preparation |
| 08/06/2009 | DE102009003381A1 Elektronische Vorrichtung und Verfahren zur Herstellung der elektronischen Vorrichtung Electronic device and method of manufacturing the electronic device |
| 08/06/2009 | DE10027870B4 Laminierter Kondensator und Montageanordnung Laminated capacitor and mounting arrangement |
| 08/05/2009 | EP2086300A1 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 08/05/2009 | EP2086299A1 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 08/05/2009 | EP2086297A2 Printed circuit board and method of manufacturing the same |
| 08/05/2009 | EP2086296A2 Printed circuit board and method of manufacturing the same |
| 08/05/2009 | EP2086295A2 Printed circuit board and method of manufacturing the same |
| 08/05/2009 | EP2086294A2 Printed circuit board, backlight unit having the printed circuit board, and liquid crystal display device having said printed circuit board |
| 08/05/2009 | EP2086293A1 Printed circuit board |
| 08/05/2009 | EP2084949A1 Circuit board with regional flexibility |
| 08/05/2009 | EP2084324A1 Flexible printed conductive fabric and method for fabricating the same |
| 08/05/2009 | EP2022133A4 Module, filter, and antenna technology for millimeter waves multi-gigabits wireless systems |
| 08/05/2009 | EP2006909A9 Heat dissipating wiring board and method for manufacturing same |
| 08/05/2009 | EP1671524A4 Electrical circuit apparatus and method for assembling same |
| 08/05/2009 | EP1509479B1 Ltcc tape composition |
| 08/05/2009 | EP1047554B1 Porcelain enamel composition for electronic applications |
| 08/05/2009 | CN201286195Y Support column for supporting double layered circuit board |
| 08/05/2009 | CN201286194Y Flexible multi-layer printed circuit board |
| 08/05/2009 | CN201286193Y Needle dot type FPC board clamp |
| 08/05/2009 | CN201285648Y Improved structure for display |
| 08/05/2009 | CN201284949Y Paster rainbow pipe |
| 08/05/2009 | CN201284948Y Paster soft strip lamp |
| 08/05/2009 | CN201283685Y Polyimide compound film structure |
| 08/05/2009 | CN101502189A 3d electronic circuit device |
| 08/05/2009 | CN101502188A Circuit connection material, circuit member connecting structure and method of connecting circuit member |
| 08/05/2009 | CN101502187A Circuit board having configurable ground link and with coplanar circuit and group traces |
| 08/05/2009 | CN101502186A Printed circuit board with vibration-generating electronic component |
| 08/05/2009 | CN101501151A Adhesive composition and connection structure for circuit member |
| 08/05/2009 | CN101500373A Printed circuit board, backlight unit and liquid crystal display device |
| 08/05/2009 | CN101500372A Electronic appliance and heat radiation substrate |
| 08/05/2009 | CN101500371A Circuit board and its producing method |
| 08/05/2009 | CN101499785A High frequency module provided with power amplifier |
| 08/05/2009 | CN101499454A Printed circuit board and method of manufacturing the same |
| 08/05/2009 | CN101499453A Printed circuit board and method of manufacturing the same |
| 08/05/2009 | CN101499451A Printed circuit board, semiconductor package, card apparatus, and system |
| 08/05/2009 | CN101498960A Method for manufacturing computer with good electromagnetic compatibility |
| 08/05/2009 | CN100525599C Module heat dissipating structure and control device using the same |
| 08/05/2009 | CN100525591C Manufacturing method of laminated substrate, and semiconductor device for module and manufacturing apparatus |
| 08/05/2009 | CN100525590C Process for manufacturing a wiring substrate |
| 08/05/2009 | CN100525589C A manufacturing method of formation of circuit board electricity connection end |
| 08/05/2009 | CN100525583C Transmission line with a transforming impedance and solder lands |
| 08/05/2009 | CN100525582C Method of forming circuit pattern on printed circuit board |
| 08/05/2009 | CN100525581C Method for manufacturing the lamination porcelain base board |
| 08/05/2009 | CN100525580C Component-embedded substrate and method of manufacturing the same |
| 08/05/2009 | CN100525579C Circuit board and method for producing the same |
| 08/05/2009 | CN100525578C Method for increasing a routing density for a circuit board and such a circuit board |
| 08/05/2009 | CN100525324C Wiring structure and wiring method for foldable portable equipment |
| 08/05/2009 | CN100525265C Transmission line conductor arrangement |
| 08/05/2009 | CN100525100C High frequency module and communication device |
| 08/05/2009 | CN100524951C Connection member and mount assembly and production method of the same |
| 08/05/2009 | CN100524747C Mounting structure in integrated circuit module |
| 08/05/2009 | CN100524729C Semiconductor package security features using thermochromatic inks and three-dimensional identification coding |
| 08/05/2009 | CN100524724C Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same |
| 08/05/2009 | CN100524718C Structure and making method of the base plate integrating the embedded parts |
| 08/05/2009 | CN100524674C Circuit connection method |
| 08/05/2009 | CN100523998C Optical appts. and image generator |
| 08/05/2009 | CN100523964C Display device using printed circuit board as substrate of display panel |
| 08/05/2009 | CN100523955C Backlight device |
| 08/05/2009 | CN100523898C LSI package provided with interface module and method of mounting the same |
| 08/05/2009 | CN100523370C Heat-resistant synthetic fiber sheet |
| 08/05/2009 | CN100522881C Dielectric ceramic composition and laminated ceramic device using the same |
| 08/05/2009 | CN100522611C Screen printing device mask overlap mounting method, and screen printing device |
| 08/04/2009 | US7570494 Structure of flexible printed circuit board |
| 08/04/2009 | US7570492 Apparatus for venting an electronic control module |
| 08/04/2009 | US7570491 Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
| 08/04/2009 | US7569920 Electronic component having at least one vertical semiconductor power transistor |
| 08/04/2009 | US7569282 blackened surface with a uniform hue, no uneven color, free from shedding of powder, superior in electromagnetic shielding ability, high in transmittance, for a plasma display panel; 1st and 2nd layer of of Cu, a Cu-Co alloy, a Co- Ni alloy and a Cu-Co-Ni alloy, 3rd layer of Co, Ni, In or alloy |
| 08/04/2009 | US7569271 Polyimide based compositions comprising doped polyaniline and methods and compositions relating thereto |
| 08/04/2009 | US7569250 Method, system, and apparatus for protective coating a flexible circuit |
| 08/04/2009 | US7569177 Method of producing ceramic multilayer substrates, and green composite laminate |
| 08/04/2009 | US7569162 electrically conductive passte including Cu powder, a glass frit, and acrylic resin vehicle, wherein an inorganic component such as alumina, which is not sintered at a sintering temperature capable of sintering the ceramic layer in the firing step, disposed on particle surfaces of the metal powder |
| 08/04/2009 | US7568922 Printed wiring board having a solder pad and a method for manufacturing the same |
| 08/04/2009 | US7568791 Nozzle arrangement with a top wall portion having etchant holes therein |
| 08/04/2009 | CA2511148C Spark gap apparatus and method for electrostatic discharge protection |
| 07/30/2009 | WO2009093415A1 Mounting structure |
| 07/30/2009 | WO2009093414A1 Multilayer packaging structure |
| 07/30/2009 | WO2009093412A1 High-strength, high-elasticity modulus sheet-like article |
| 07/30/2009 | WO2009093335A1 Heat capacity control material and method of part mounting |
| 07/30/2009 | WO2009092851A1 Method for arranging cooling for a component and a cooling element |
| 07/30/2009 | WO2009092822A1 Human machine interface in automotive applications |
| 07/30/2009 | WO2009074385A3 Direct current drive with extension for terminals and processing power |
| 07/30/2009 | WO2009026975A3 Carrier foil |
| 07/30/2009 | US20090192573 Coupling element |
| 07/30/2009 | US20090191701 Microelectronic devices and methods for forming interconnects in microelectronic devices |
| 07/30/2009 | US20090191377 printed circuit board (PCB) supporting woven fabric and a PCB having the same; PCB includes a supporting woven fabric, a filling resin body enveloping the supporting woven fabric and at least one signal trace arranged on the surface of the filling resin body |
| 07/30/2009 | US20090190790 Speaker device and television set |
| 07/30/2009 | US20090190319 Three-dimensional module |
| 07/30/2009 | US20090189628 Reworkable bonding pad layout and debug method thereof |
| 07/30/2009 | US20090189269 Electronic Circuit Package |
| 07/30/2009 | US20090188711 Ground straddling in pth pinfield for improved impedance |
| 07/30/2009 | US20090188710 System and method for forming filled vias and plated through holes |
| 07/30/2009 | US20090188709 Electrical device |
| 07/30/2009 | US20090188708 Printed wiring board and method for producing the same |
| 07/30/2009 | US20090188707 Method and Apparatus for Manufacture of Via Disk |
| 07/30/2009 | US20090188706 Interconnection element for electric circuits |
| 07/30/2009 | US20090188705 Construction of Reliable Stacked Via in Electronic Substrates - Vertical Stiffness Control Method |
| 07/30/2009 | US20090188703 Multilayer wiring board and method of manufacturing the same |
| 07/30/2009 | US20090188702 Flexible printed wiring board and electronic apparatus |
| 07/30/2009 | US20090188701 Inorganic powder, resin composition filled with the powder and use thereof |