H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
10/2009
10/21/2009	CN100553410C Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board and metal sheet for producing wiring board
10/21/2009	CN100553407C Printed circuit board comprising a holding device for retaining wired electronic components, method for the production of such a printed circuit board, and use thereof in a soldering furnace
10/21/2009	CN100553403C Electronic parts mounting structure
10/21/2009	CN100553402C Printed circuit board for mounting a quad flat package IC
10/21/2009	CN100553401C Conductive unit of display device and organic electric excited luminous display device therewith
10/21/2009	CN100553038C A method to build robust mechanical structures on substrate surfaces
10/21/2009	CN100552947C Electronic circuit device of power control system
10/21/2009	CN100552936C Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon
10/21/2009	CN100552934C Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same
10/21/2009	CN100552931C Chip encapsulation structure
10/21/2009	CN100552929C Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus and wiring substrate
10/21/2009	CN100552542C Patterning layers comprised of spin-on ceramic films
10/21/2009	CN100551687C Super-thin copper foil with carrier, its manufacture method and printed wiring base plate
10/20/2009	US7606048 Integrated circuit stacking system
10/20/2009	US7606047 Module with embedded electronic components
10/20/2009	US7606046 Semiconductor device and method for mitigating electrostatic discharge (ESD)
10/20/2009	US7606042 High capacity thin module system and method
10/20/2009	US7606041 Apparatus and method for battery pack circuit board crack prevention
10/20/2009	US7605101 Laminate, ceramic substrate and method for making the ceramic substrate
10/20/2009	US7604833 Circuit elements formed on a ceramic substrate surface and conductive balls are used as electronic part terminals; using rubber buffers having a concave part to house the balls to protect them when stress is applied tothe substrate to open surface division grooves to divide the substrate; chip resistor
10/15/2009	WO2009126366A2 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
10/15/2009	WO2009125104A2 Lighting module, in particular a backlighting module
10/15/2009	WO2009102721A3 System and method for integrated waveguide packaging
10/15/2009	WO2009099707A8 Printed electronics
10/15/2009	US20090258515 Connector
10/15/2009	US20090257212 Semiconductor device
10/15/2009	US20090257208 Compact packaging for power amplifier module
10/15/2009	US20090257184 Dram module with solid state disk
10/15/2009	US20090257102 Image processing apparatus having card reader for applying effects stored on a card to a stored image
10/15/2009	US20090256991 Flexible Display Apparatus
10/15/2009	US20090256989 Liquid crystal display module and an assembly method therefor
10/15/2009	US20090256283 Thermoplastic resin composition, material for substrate and film for substrate
10/15/2009	US20090255723 Printed circuit board with ground grid
10/15/2009	US20090255721 Circuit board assembly
10/15/2009	US20090255720 Ground-plane slotted type signal transmission circuit board
10/15/2009	US20090255719 Wiring board and ceramic chip to be embedded
10/15/2009	US20090255718 Printed circuit board
10/15/2009	US20090255717 Suspension Board with Circuit and Production Method Thereof
10/15/2009	US20090255716 Heat resistant substrate incorporated circuit wiring board
10/15/2009	US20090255715 Controlling Impedance and Thickness Variations for Multilayer Electronic Structures
10/15/2009	US20090255714 Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board
10/15/2009	US20090255713 Controlling Impedance and Thickness Variations for Multilayer Electronic Structures
10/15/2009	DE102009001698A1 Verbindermodul für Anwendungen mit höherer Belastung Connector module for applications with higher load
10/14/2009	EP2109349A1 Printed circuit board with a conductive connection
10/14/2009	EP2109141A1 Printed circuit board with a conductive connection
10/14/2009	EP2109124A1 Capacitor material, method for manufacturing the capacitor material, capacitor containing the capacitor material, wiring board and electronic device
10/14/2009	EP2109092A2 Ribbon cable with illumination means
10/14/2009	EP2108183A1 Surface covering element, assembly of surface covering elements and method for producing a surface covering element
10/14/2009	EP1821586B1 Printed board and printed board manufacturing method
10/14/2009	EP1354502B1 High frequency printed circuit board via
10/14/2009	CN201328216Y 电路板结构 Circuit board structure
10/14/2009	CN201328173Y Circuit board of microphone
10/14/2009	CN201327864Y Output matching microstrip circuit for radio-frequency power amplifier
10/14/2009	CN201327634Y Baseplate capable of uniformly distributing arithmetic voltages on surface and high visible range resistance-type touch screen
10/14/2009	CN101558019A Low dielectric glass and fiber glass for electronic applications
10/14/2009	CN101557679A Flexible printing patch panel, input module and portable device
10/14/2009	CN101557678A Wired circuit board
10/14/2009	CN101557677A Printed circuit board
10/14/2009	CN101557676A Printed circuit board
10/14/2009	CN101557675A Printed circuit board and wiring method thereof
10/14/2009	CN101557674A High density circuit board and manufacturing method thereof
10/14/2009	CN101557063A Connector module for reinforcement application
10/14/2009	CN101556950A Stack structure of encapsulated wafer
10/14/2009	CN101556379A Combination structure
10/14/2009	CN100551213C Multi-layered wiring board, fabricating method, electronic device and electronic instrument
10/14/2009	CN100551210C Multilayer wiring board
10/14/2009	CN100551209C Copper foil for printed circuit board with taking environmental conservation into consideration
10/14/2009	CN100551208C Manufacturing method of ceramic substrate and electronic component modular using such substrate
10/14/2009	CN100551204C Printed circuit board including embedded capacitor and method of fabricating same
10/14/2009	CN100551203C Base board bar and micro shooting module using this bar
10/14/2009	CN100551202C Composite dielectric composition and signal-matching embedded capacitor prepared using the same
10/14/2009	CN100551201C Flexible printing circuit board
10/14/2009	CN100550377C Single package containing multiple integrated circuit devices
10/14/2009	CN100550234C Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor
10/14/2009	CN100549825C Photosensitive resin composition comprising a halogen-free colorant
10/14/2009	CN100549783C Light source module, light source apparatus and liquid crystal display
10/14/2009	CN100549674C A gas detecting arrangement
10/14/2009	CN100549092C Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
10/14/2009	CN100549072C Polyimide film
10/13/2009	US7603645 Calibration method of insulating washer in circuit board
10/13/2009	US7602614 Electronic module and method for the production thereof
10/13/2009	US7602613 Thin module system and method
10/13/2009	US7602467 Liquid crystal display device
10/13/2009	US7601920 Surface mount composite electronic component and method for manufacturing same
10/13/2009	US7601919 Printed circuit boards for high-speed communication
10/13/2009	US7601775 Phenolic resins; halogen-free and providing for not only good fire retardancy which is required of molding materials for electronic use, adhesives, paints and the like, but also favorable mechanical and electrical characteristics
10/13/2009	US7601406 Nano-powder-based coating and ink compositions
10/13/2009	US7601039 Microelectronic contact structure and method of making same
10/13/2009	US7600548 Method and apparatus for applying viscous medium onto a substrate
10/13/2009	US7600310 Method of head stack assembly flexible circuit assembly attached to an actuator arm
10/08/2009	WO2009123125A1 Insulating metal base circuit board and hybrid integrated circuit module using the same
10/08/2009	WO2009123018A1 Composite material, and method for manufacturing the same
10/08/2009	WO2009122806A1 Low-temperature fired ceramic circuit board
10/08/2009	WO2009121739A1 Electric device
10/08/2009	WO2009121697A1 Current-carrying component comprising a carrier, conductor tracks and conductor laminae
10/08/2009	WO2009121200A1 Method of balancing multilayer substrate stress and multilayer substrate
10/08/2009	WO2009067996A3 Chip assembly, connecting assembly, led and method for producing a chip assembly
10/08/2009	WO2008122005A3 Fine pitch electrical interconnect assembly
10/08/2009	US20090253333 Liquid crystal display device
10/08/2009	US20090253325 Plural layer woven electronic textile, article and method

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