| Patents for H05K 1 - Printed circuits (98,583) |
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| 10/01/2009 | US20090242257 Electronic component and electronic component module |
| 10/01/2009 | US20090242256 Electronic component and electronic component module |
| 10/01/2009 | US20090242255 Wiring board with built-in electronic component and method of manufacturing same |
| 10/01/2009 | US20090242254 Multilayer wiring board and electrical connecting apparatus using the same |
| 10/01/2009 | US20090242253 Flexible printed circuit board and electronic apparatus |
| 10/01/2009 | US20090242252 Method for Manufacturing A Multilayer Printed Wiring Board for Providing an Electronic Component Therein |
| 10/01/2009 | US20090242251 Embedded printed circuit board and manufacturing method thereof |
| 10/01/2009 | US20090242250 Polyimide film, method for production thereof, polyimide-metal laminated product, and circuit board |
| 10/01/2009 | US20090242249 Bonding material, electronic component, bonding structure and electronic device |
| 10/01/2009 | US20090242248 Insulating sheet and printed circuit board having the same |
| 10/01/2009 | US20090242247 Package substrate and die spacer layers having a ceramic backbone |
| 10/01/2009 | US20090242246 Printed circuit board and method for manufacturing same |
| 10/01/2009 | US20090242245 Multi-layer wiring board and method of manufacturing the same |
| 10/01/2009 | US20090242244 Printed circuit board |
| 10/01/2009 | US20090242243 Printed circuit board and method for fabricating a printed circuit board |
| 10/01/2009 | US20090242242 Electronic component mounting board, method for manufacturing the same and electronic circuit unit |
| 10/01/2009 | US20090242241 Flex-rigid wiring board and method of manufacturing same |
| 10/01/2009 | US20090242240 Flexible circuit board, flexible circuit board positioning method, flexible circuit board positioning structure, droplet ejection head and image forming device |
| 10/01/2009 | US20090242239 process for preparing a heatsink system and heatsink system obtainable by said process |
| 10/01/2009 | US20090242238 Buried pattern substrate |
| 10/01/2009 | US20090242237 Surface mount device jumper and surface mount device jumper assembly |
| 10/01/2009 | US20090242236 Method of forming conductive tracks |
| 10/01/2009 | US20090242023 System and method for producing a solar cell array |
| 10/01/2009 | DE202009009950U1 Elektronische Baugruppe Electronic assembly |
| 10/01/2009 | DE102008016458A1 Printed circuit board for use in e.g. lighting device, has heat dissipating element arranged in through-hole, and radiation source i.e. LED, arranged on heat dissipating element, where heat dissipating element is electrically conductive |
| 10/01/2009 | DE102008015627A1 Komponententräger für elektrische/elektronische Bauteile sowie zugehöriges Herstellungsverfahren Component support for electrical / electronic components and manufacturing method thereof |
| 09/30/2009 | CN201319695Y Electrical connection structure of circuit board |
| 09/30/2009 | CN201319694Y Copper clad laminated board |
| 09/30/2009 | CN201319693Y Conductive cover structure of circuit board foundation column of electronic shell device |
| 09/30/2009 | CN101547572A Multilayer wiring board, multilayer wiring board unit, and electronic device |
| 09/30/2009 | CN101547570A Method for balancing stress of multi-layer substrate and multi-layer substrate |
| 09/30/2009 | CN101547563A Closed loop backdrilling system |
| 09/30/2009 | CN101547562A Closed loop backdrilling system |
| 09/30/2009 | CN101547561A Closed loop backdrilling system |
| 09/30/2009 | CN101547559A Flexible copper clad laminate |
| 09/30/2009 | CN101547558A Copper clad base plate and preparation method thereof |
| 09/30/2009 | CN101547557A Composite medium substrate covered with copper foil |
| 09/30/2009 | CN101547556A Printed circuit board, electronic device and connection device |
| 09/30/2009 | CN101547555A Printed circuit board |
| 09/30/2009 | CN101547554A Multi-functional flexible conductor circuit board and production method thereof |
| 09/30/2009 | CN101547553A Flexible printed circuit board and electronic apparatus |
| 09/30/2009 | CN101547552A Printed circuit board |
| 09/30/2009 | CN101547551A Printed circuit board and method for fabricating a printed circuit board |
| 09/30/2009 | CN101547550A Server system and circuit board thereof |
| 09/30/2009 | CN101546820A Protective circuit board and battery pack using the same |
| 09/30/2009 | CN101546759A Method for manufacturing an electronic module and an electronic module |
| 09/30/2009 | CN101546740A Embedded printed circuit board and manufacturing method thereof |
| 09/30/2009 | CN101546120A White cured resin composition and printed circuit board having insulation layer formed with the same |
| 09/30/2009 | CN101545122A Electrolysis copper foil and circuit board |
| 09/30/2009 | CN101544841A Composite material and high frequency circuit substrate made of the same |
| 09/30/2009 | CN101544784A Photocurable resin composition, dry film and cured object thereof, and printed circuit board with the same |
| 09/30/2009 | CN100546438C Circuit substrate and manufacturing method thereof |
| 09/30/2009 | CN100546431C Flexible wiring substrate, method for producing it, semiconductor device and electronic device |
| 09/30/2009 | CN100546430C Systems and methods for wiring circuit components |
| 09/30/2009 | CN100546429C Flexible connection substrate and folding electronic apparatus |
| 09/30/2009 | CN100546000C Wireless substrate-like sensor |
| 09/30/2009 | CN100545082C Aluminum nitride powder and aluminum nitride sintered compact |
| 09/29/2009 | US7595997 Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component |
| 09/29/2009 | US7595996 Expanding card mechanism |
| 09/29/2009 | US7595550 Flex-based circuit module |
| 09/29/2009 | US7595453 Surface mount package |
| 09/29/2009 | US7595452 Circuit board and method for its production |
| 09/29/2009 | US7595357 Vinyl ether curing composition |
| 09/29/2009 | US7595131 Connection between a conductive substrate and a laminate |
| 09/29/2009 | US7595120 Higher melting substrate is an oxide or nitride of aluminum, titanium or zirconium; layer is silica powder, glass powder, glaze powder, copper oxide, lead oxide, hafnium oxide, or boron oxide and has embedded nanostructure stalagmites or columns extending towards the substrate; no polishing required |
| 09/29/2009 | US7594740 Mounting arrangement for light emitting diodes |
| 09/29/2009 | US7594321 Substrate-imprinting methods |
| 09/29/2009 | US7594320 Method of manufacturing printed wiring board |
| 09/29/2009 | US7594319 Electronic-component alignment method |
| 09/29/2009 | US7594318 Multilayer circuit board with embedded components and method of manufacture |
| 09/24/2009 | WO2009117544A1 Large area thin film capacitors on metal foils and methods of manufacturing same |
| 09/24/2009 | WO2009116934A1 Substrate integrated waveguide |
| 09/24/2009 | WO2009116585A1 Power module |
| 09/24/2009 | WO2009116500A1 Polyimide material, polyimide film, method for producing the polyimide material and method for producing the polyimide film |
| 09/24/2009 | WO2009116488A1 Insulating metal base circuit board and hybrid integrated circuit module using the same |
| 09/24/2009 | WO2009116426A1 Electronic component and method for manufacturing the same |
| 09/24/2009 | WO2009116185A1 Composite silver nanopaste, process for production thereof, method of connection and pattern formation process |
| 09/24/2009 | WO2009115841A2 Display system |
| 09/24/2009 | US20090239394 Electronic component connecting apparatus, electronic unit and electronic apparatus |
| 09/24/2009 | US20090238959 Fabrics with high thermal conductivity coatings |
| 09/24/2009 | US20090237905 Motor Drive Apparatus |
| 09/24/2009 | US20090237904 Power Converter Apparatus |
| 09/24/2009 | US20090237901 Monolithic Molded Flexible Electronic Assemblies Without Solder and Methods for their Manufacture |
| 09/24/2009 | US20090237900 Component built-in wiring board |
| 09/24/2009 | US20090237899 Semiconductor package with embedded magnetic component and method of manufacture |
| 09/24/2009 | US20090237898 Heat sink arrangement for electrical apparatus |
| 09/24/2009 | US20090237895 Flexible Paddle Card For Installation On A Motherboard Of A Computing System |
| 09/24/2009 | US20090237894 Electronic device |
| 09/24/2009 | US20090237893 Fixing structure for fixing a circuit board |
| 09/24/2009 | US20090236650 Tantalum lanthanide oxynitride films |
| 09/24/2009 | US20090236424 Image sensor based optical reader |
| 09/24/2009 | US20090236143 Multilayer wiring board, multilayer wiring board unit and electronic device |
| 09/24/2009 | US20090236141 Electromagnetic bandgap structure and printed circuit board |
| 09/24/2009 | US20090236140 Wireless power receiver module |
| 09/24/2009 | US20090236139 Printed wiring board assembly and related methods |
| 09/24/2009 | US20090236138 Multilayer wiring board and method of manufacturing the same |
| 09/24/2009 | US20090236137 Method for Forming Resist Pattern, Method for Producing Circuit Board, and Circuit Board |
| 09/24/2009 | US20090236136 Printed circuit board assembly |
| 09/24/2009 | US20090236135 Multilayer wiring substrate and method of manufacturing the same |
| 09/24/2009 | US20090236134 Low frequency ball grid array resonator |