| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/20/2009 | CN101437363A Structure and method for welding circuit board |
| 05/20/2009 | CN101437362A Inverted through circuit board mounting with heat sink |
| 05/20/2009 | CN101437361A Printed circuit board assembly |
| 05/20/2009 | CN101437360A Flexible circuit board, preparation method and fixed method thereof |
| 05/20/2009 | CN101437359A Circuit board with position indication and jointing method (thereof) |
| 05/20/2009 | CN101437358A Protection film for printed circuit board and procedure for processing circuit board using the protection film |
| 05/20/2009 | CN101437357A Pad structure for welding printed circuit board and method for forming the same |
| 05/20/2009 | CN101437356A Circuit board module and structure intensification method thereof |
| 05/20/2009 | CN101437355A Circuit substrate and manufacturing method thereof |
| 05/20/2009 | CN101436819A Power electronics devices with integrated gate drive circuitry |
| 05/20/2009 | CN101436578A Wiring board and method for manufacturing the same |
| 05/20/2009 | CN101435934A LCD module and encapsulation method thereof |
| 05/20/2009 | CN101435933A Method for processing crystal covering thin film |
| 05/20/2009 | CN101435897A Method for connecting receiving end grounding pin of light transmit-receive device reliably |
| 05/20/2009 | CN100490611C Circuit board with embedded components and method of manufacture |
| 05/20/2009 | CN100490610C Circuit substrate production method and method for mounting electronic element |
| 05/20/2009 | CN100490605C Pcb |
| 05/20/2009 | CN100490604C Printing circuit board |
| 05/20/2009 | CN100490603C Circuit board with verified laminated layer sequence |
| 05/20/2009 | CN100490507C Small-sized image pickup module |
| 05/20/2009 | CN100490260C Mould for detaching or mounting connector and semiconductor experiment device possessing the mould |
| 05/20/2009 | CN100490165C Solid state image pickup device |
| 05/20/2009 | CN100490160C Optical device |
| 05/20/2009 | CN100490129C Metal-base circuit board and its manufacturing method |
| 05/20/2009 | CN100490024C Ru-M-O micropowder, its production method, thick film resistor composition using same |
| 05/20/2009 | CN100489495C Photoacoustic gas sensitive element and a method for its production |
| 05/20/2009 | CN100488906C Glass fiber-reinforced prepreg, laminates, electronic circuit boards and methods for assembling fabric |
| 05/20/2009 | CN100488689C Method for producing metal-ceramic composite lining and solder material used for same |
| 05/19/2009 | US7536161 Magnetically differential input |
| 05/19/2009 | US7535963 Data processing circuit with a driver and a receiver |
| 05/19/2009 | US7535728 Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors |
| 05/19/2009 | US7535719 Single chip USB packages with contact-pins cover |
| 05/19/2009 | US7535718 Memory card compatible with multiple connector standards |
| 05/19/2009 | US7535537 Liquid crystal display module and an assembly method therefor |
| 05/19/2009 | US7535106 Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate |
| 05/19/2009 | US7535095 Printed wiring board and method for producing the same |
| 05/19/2009 | US7535094 Substrate structure, a method and an arrangement for producing such substrate structure |
| 05/19/2009 | US7535090 LSI package provided with interface module |
| 05/19/2009 | US7534967 Conductor structures including penetrable materials |
| 05/19/2009 | US7534660 Methods for assembly and packaging of flip chip configured dice with interposer |
| 05/19/2009 | US7534654 Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
| 05/19/2009 | US7534487 transparent, electrically conductive, biaxially oriented, single- or multilayer polyester film which includes a coating composed of (a) conductive (ITO) indium tin oxide particles or (ATO) antimony tin oxide particles, or of a mixture of these |
| 05/19/2009 | US7534361 Methods for making laminated member for circuit board, making circuit board and laminating flexible film |
| 05/19/2009 | US7534145 Design and method for plating PCI express (PCIE) edge connector |
| 05/19/2009 | US7534133 Electrical connector assembly with alignment pin |
| 05/19/2009 | US7533824 Image sensor based optical reader |
| 05/14/2009 | WO2009060902A1 Ceramic substrate, method for producing ceramic substrate, and method for producing substrate for power module |
| 05/14/2009 | WO2009060029A1 Electronic component with mechanically decoupled ball-type connections |
| 05/14/2009 | WO2009059743A1 Method and devices for evaluating electrically conductive, printed structures und printing machine having such a device |
| 05/14/2009 | WO2006012139A3 System and method for mounting an image capture device on a flexible substrate |
| 05/14/2009 | US20090125865 System and method for making photomasks |
| 05/14/2009 | US20090124767 Sulfone Polymer Composition |
| 05/14/2009 | US20090124103 Method and apparatus for providing symmetrical signal return path in differential systems |
| 05/14/2009 | US20090124100 Shielded electrical interconnect |
| 05/14/2009 | US20090124045 Low Profile Stacking System and Method |
| 05/14/2009 | US20090123873 Lamination for Printed Photomask |
| 05/14/2009 | US20090123726 Fiber-reinforced composite material, method for manufacturing the same, and applications thereof |
| 05/14/2009 | US20090123716 Magnetic Substance-Containing Insulator and Circuit Board and Electronic Device Using the Same |
| 05/14/2009 | US20090122498 Circuit board and conductive through hole structure thereof |
| 05/14/2009 | US20090122231 Liquid crystal display device |
| 05/14/2009 | US20090120680 Method for manufacturing a printed wiring board |
| 05/14/2009 | US20090120678 Printed Circuit Board Interconnecting Structure With Compliant Cantilever Interposers |
| 05/14/2009 | US20090120677 Wiring substrate and associated manufacturing method |
| 05/14/2009 | US20090120676 Process for the production of a conductor track structure |
| 05/14/2009 | US20090120675 Mounted structural body and method of manufacturing the same |
| 05/14/2009 | US20090120674 Built-in battery assembly and a method of assembling the built-in battery with a circuit board |
| 05/14/2009 | US20090120673 Multilayer circuit board and electronic device |
| 05/14/2009 | US20090120672 Method for manufacturing a laminate cover, laminate protective layer, and laminate electronic device having a reduced cost, manufacturing time, weight, and thickness |
| 05/14/2009 | US20090120671 Fpcb substrate and method of manufacturing the same |
| 05/14/2009 | US20090120670 Bendable area design for flexible printed circuitboard |
| 05/14/2009 | US20090120669 Micro device with microtubes |
| 05/14/2009 | US20090120668 Cabled Signaling System and Components Thereof |
| 05/14/2009 | US20090120560 Functional textile structures |
| 05/14/2009 | US20090119915 Method for Manufacturing Circuit Device |
| 05/14/2009 | DE102008051921A1 Mehrschichtsystem mit Kontaktelementen und Verfahren zum Erstellen eines Kontaktelements für ein Mehrschichtsystem Multilayer system with contact elements and method for creating a contact member for a multi-layer system |
| 05/13/2009 | EP2059102A2 Wired circuit board |
| 05/13/2009 | EP2059101A2 Power line arrangement |
| 05/13/2009 | EP2059100A1 Flexible wiring board |
| 05/13/2009 | EP2058903A1 Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape |
| 05/13/2009 | EP2058874A1 Composite films suitable for use in opto-electronic and electronic devices |
| 05/13/2009 | EP2058861A1 Electric power converter |
| 05/13/2009 | EP2058119A2 Ceramic sheet and producing method thereof |
| 05/13/2009 | EP2057873A2 Sub-mezzanine structure for printed circuit card assemblies |
| 05/13/2009 | EP2057869A1 Power core devices and methods of making thereof |
| 05/13/2009 | EP2057868A1 Circuit board having configurable ground link and with coplanar circuit and ground traces |
| 05/13/2009 | EP1980142B1 Printed circuit board with functional elements and selectively filled passage openings of good thermal conductivity and method of production and use |
| 05/13/2009 | EP1949771B1 Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
| 05/13/2009 | EP1592551A4 Nanofabric articles and methods of making the same |
| 05/13/2009 | CN201238423Y 芯片模块 Chip Module |
| 05/13/2009 | CN201238422Y Split electronic circuit structure |
| 05/13/2009 | CN201238421Y Novel copper foil-covered epoxy glass cloth laminated sheet for printed circuit |
| 05/13/2009 | CN201238420Y Copper foil-covered epoxy glass cloth laminated sheet for printed circuit |
| 05/13/2009 | CN201238419Y Two-sided flexible copper-covered plate |
| 05/13/2009 | CN201238418Y Optimized circuit structure of FPC |
| 05/13/2009 | CN201238417Y Pcb板扣位结构 Pcb board buckle bit architecture |
| 05/13/2009 | CN201238416Y Hard circuit board of flat oscillating motor |
| 05/13/2009 | CN201238050Y System including printed circuit board and at least one electronic component |
| 05/13/2009 | CN201237173Y LED lamp |
| 05/13/2009 | CN201237098Y High power light-emitting diode |
| 05/13/2009 | CN101433133A Process for manufacturing circuit board and circuit board obtained by the process |