H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
10/2009
10/08/2009	US20090251869 Multilayer ceramic substrate, electronic component, and method of manufacturing multilayer ceramic substrate
10/08/2009	US20090251867 Reconfigurable, modularized fpga-based amc module
10/08/2009	US20090251863 Mounting device for mounting heat sink onto electronic component
10/08/2009	US20090251449 Array substrate, method of manufacturing the same and display apparatus having the same
10/08/2009	US20090251446 Liquid Crystal Display Device
10/08/2009	US20090250802 Multilayer wiring substrate, semiconductor package, and methods of manufacturing semiconductor package
10/08/2009	US20090250328 Input device with a flexible circuit board and related computer system
10/08/2009	US20090250260 High density circuit board and manufacturing method thereof
10/08/2009	US20090250258 Wiring Substrate, Semiconductor Package, Electronic Instrument, And Wiring Substrate Manufacturing Method
10/08/2009	US20090250257 Electronic parts packaging structure and method of manufacturing the same
10/08/2009	US20090250256 Socket contact terminal and semiconductor device
10/08/2009	US20090250255 Connections for electronic devices on double-sided circuit board
10/08/2009	US20090250254 Methods for configurable manufacturing and apparatus
10/08/2009	US20090250253 Printed circuit board and manufacturing method thereof
10/08/2009	US20090250252 Printed circuit board
10/08/2009	US20090250251 Circuit Device and Method for Manufacturing the Circuit Device
10/08/2009	US20090250249 Interposers, electronic modules, and methods for forming the same
10/08/2009	US20090250248 Support substrate structure for supporting electronic component thereon and method for fabricating the same
10/08/2009	US20090250247 Circuit board and manufacturing method thereof
10/08/2009	US20090250246 Solder by numbers, a method and system for populating printed circuit boards
10/08/2009	DE102008001000A1 Schichtsystem für Elektroden Layer system for electrodes
10/08/2009	DE102008000976A1 Multilayer printed circuit board for use in electrical/electronic module, has connection device provided for electrical connection of mass layer with housing, where connection device comprises coupling impedance with ohm's resistor as unit
10/08/2009	CA2719037A1 Protection device for an electronic system
10/07/2009	EP2107863A1 Multilayer ceramic substrate, electronic component, and method of manufacturing multilayer ceramic substrate
10/07/2009	EP2107577A1 Inductive component and method for its production
10/07/2009	CN201323720Y Flexible printed circuit board and foldable electronic equipment
10/07/2009	CN201323703Y Soft-hard composite circuit board structure
10/07/2009	CN201323702Y Zero-resistance replacement circuit and mobile terminal utilizing same
10/07/2009	CN201323701Y Thin film circuit board
10/07/2009	CN201323700Y Novel circuit layer structure
10/07/2009	CN201323699Y Combined-type circuit board easy to eliminate remainder
10/07/2009	CN201323104Y Sliding potentiometer and PCB board and potentiometer main body thereof
10/07/2009	CN101553104A Circuit board with electromagnetic interference preventing structure
10/07/2009	CN101553094A A method for manufacturing a circuit board provided with an embedded typed metal conduction column
10/07/2009	CN101553088A A circuit substrate with a coil
10/07/2009	CN101553087A Method of switched power supply to selectively increase area of copper foil and circuit board thereof
10/07/2009	CN101553086A Circuit board device and method of interconnecting wiring boards
10/07/2009	CN101553085A Preferential ground and via exit structures for printed circuit boards
10/07/2009	CN101553084A Circuit base plate and manufacturing method thereof
10/07/2009	CN101553083A Printed circuit board and method for installing component thereon
10/07/2009	CN101553082A Printed circuit board and setting method thereof
10/07/2009	CN101553081A Hollow-out double-sided flexible printed circuit board with ACP conductive adhesive being printed thereon
10/07/2009	CN101553080A Hollow-out flexible printed circuit board with ACP conductive adhesive being printed thereon
10/07/2009	CN101553079A Hollow-out flexible printed circuit board
10/07/2009	CN101553078A Double-sided flexible printed circuit board
10/07/2009	CN101553077A Double-sided flexible printed circuit board with ACP conductive adhesive being printed thereon
10/07/2009	CN101552211A Composite metal substrate and process thereof
10/07/2009	CN101552026A Printed circuit board
10/07/2009	CN101551533A Electro-optical device and electronic apparatus
10/07/2009	CN101550279A Composition of organic/inorganic dielectric hybrid material with electrostatic discharge protective characteristic
10/07/2009	CN101550240A Polyimide film, method for production thereof, polyimide-metal laminated product, and circuit board
10/07/2009	CN101550221A Resin composition, prepreg and metal-foil-clad laminate
10/07/2009	CN100548095C Hinge connector having a shaft member and electronic apparatus including the hinge connector
10/07/2009	CN100548086C Printed circuit board
10/07/2009	CN100547780C Package substrate
10/07/2009	CN100547706C Mounting structure for three-terminal capacitor
10/06/2009	US7599193 Tape circuit substrate with reduced size of base film
10/06/2009	US7599192 Layered structure with printed elements
10/06/2009	US7599190 High-frequency module, and method of producing same
10/06/2009	US7598621 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths
10/06/2009	US7598459 Electronic board, method of manufacturing the same, and electronic device
10/06/2009	US7597769 forming a solar cell conductive feature using monodisperse silver or silver alloy fine particles coated with a ceramic or metal; silver particles made in an aerosol stream and coated by vapor deposition
10/06/2009	CA2529430C Biosensor and method of making
10/01/2009	WO2009120633A2 Semiconductor package with embedded magnetic component and method of manufacture
10/01/2009	WO2009119877A1 Method of manufacturing wiring board, method of manufacturing optoelectric composite member, and method of manufacturing optoelectric composite board
10/01/2009	WO2009119850A1 Composite optical transmission substrate and optical module
10/01/2009	WO2009119849A1 Composite wiring board
10/01/2009	WO2009119821A1 Curable resin composition, cured article thereof, and printed circuit board
10/01/2009	WO2009119598A1 Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board, and semiconductor device
10/01/2009	WO2009119562A1 Multilayer printed wiring board
10/01/2009	WO2009119433A1 Lead-free glass and composition for lead-free glass ceramics
10/01/2009	WO2009119324A1 Anisotropic conductive film, joined structure and method for producing the same
10/01/2009	WO2009119305A1 Circuit board
10/01/2009	WO2009119289A1 Heat pipe, method of manufacturing heat pipe, and circuit board with heat pipe function
10/01/2009	WO2009119046A1 Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device
10/01/2009	WO2009118249A1 Method for the production of an electronic assembly
10/01/2009	WO2009117991A1 Component carrier for electrical/electronic components and associated manufacturing method
10/01/2009	WO2009086146A3 Plated dielectric frame with integrated connector
10/01/2009	US20090246911 Substrate for mounting electronic components and its method of manufacture
10/01/2009	US20090246611 Protective circuit board and battery pack using the same
10/01/2009	US20090246358 Conductive silver dispersions and uses thereof
10/01/2009	US20090244869 Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring
10/01/2009	US20090244868 Semiconductor device and bonding material
10/01/2009	US20090244866 Circuit Device
10/01/2009	US20090244865 Method for manufacturing multilayer printed wiring board
10/01/2009	US20090244864 Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof
10/01/2009	US20090244860 Mounting structure of semiconductor device and electronic apparatus using thereof
10/01/2009	US20090244859 Flexible printed circuit board and electronic apparatus
10/01/2009	US20090244858 Ic card having improved electrical contacts
10/01/2009	US20090244855 Data Processing Modules And Systems
10/01/2009	US20090244689 E-paper apparatus and driving substrate thereof
10/01/2009	US20090244429 Thin film transistor substrate and liquid crystal display device using the same
10/01/2009	US20090243117 Contact structure, a semiconductor device employing the same, and methods of manufacturing the same
10/01/2009	US20090243076 Electronic system modules and method of fabrication
10/01/2009	US20090242411 Polyimide-metal laminated body and polyimide circuit board
10/01/2009	US20090242262 Multi-layer wiring board and method of manufacturing the same
10/01/2009	US20090242261 Printed wiring board and associated manufacturing methodology
10/01/2009	US20090242260 Device interconnects
10/01/2009	US20090242259 Printed circuit board and method of manufacturing the same
10/01/2009	US20090242258 Electronic device package with connection terminals including uneven contact surfaces

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