| Patents for H05K 1 - Printed circuits (98,583) |
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| 09/24/2009 | US20090236133 Method of Manufacturing a Polymer and Poymer Material |
| 09/24/2009 | US20090236132 Organic/inorganic hybrid composition with electrostatic discharge protection property |
| 09/24/2009 | US20090236131 Multilayered printed circuit board and method of manufacturing the same |
| 09/24/2009 | US20090236130 Multilayered printed circuit board and method of manufacturing the same |
| 09/24/2009 | US20090236129 Methods for reducing corrosion on printed circuit boards |
| 09/24/2009 | US20090236128 Printed wiring board with resin complex layer and manufacturing method thereof |
| 09/24/2009 | US20090236127 Electronic device |
| 09/24/2009 | US20090236126 Flexible Wiring Board |
| 09/24/2009 | US20090236125 Multi-layer board and manufacturing method thereof |
| 09/24/2009 | DE202008007028U1 Leiterplatte für eine Lötverbindung Circuit board for solder |
| 09/24/2009 | DE112007003001T5 Leiterplatte und Verfahren für deren Herstellung Printed circuit board and process for production thereof |
| 09/24/2009 | DE102007032535B4 Elektronisches Modul für eine integrierte mechatronische Getriebesteuerung Electronic module for integrated mechatronic transmission control |
| 09/24/2009 | CA2719091A1 Innovative method to create a bus based switching scheme for a hdmi or similar i/f's |
| 09/23/2009 | EP2104407A1 Capacitive/resistive devices and printed wiring boards incorporating such devices, and methods of making thereof |
| 09/23/2009 | EP2103718A1 Method for coating ceramic film on metal, electrolysis solution for use in the method, and ceramic film and metal material |
| 09/23/2009 | EP2103652A1 Resin composition, prepreg and laminate |
| 09/23/2009 | EP2103641A1 Polyamide-imide resin, colorless transparent flexible metal laminate made of the same, and wiring board |
| 09/23/2009 | EP2102268A2 Crystalline encapsulants |
| 09/23/2009 | CN201315703Y PCB board |
| 09/23/2009 | CN201315702Y Pad structure and printing circuit board |
| 09/23/2009 | CN201315701Y Lead structure of flexible circuit board |
| 09/23/2009 | CN201315700Y Flexible circuit board |
| 09/23/2009 | CN201315699Y Circuit board with removable interface |
| 09/23/2009 | CN101543145A Wiring board module and method for manufacturing the wiring board module |
| 09/23/2009 | CN101543144A Recognition mark, and circuit substrate manufacturing method |
| 09/23/2009 | CN101543143A Wiring board |
| 09/23/2009 | CN101543142A Printed wiring board |
| 09/23/2009 | CN101541143A Printed circuit board and electronic device |
| 09/23/2009 | CN101541142A Surface disposed copper foil and circuit foundation plate |
| 09/23/2009 | CN101541141A Printed circuit board and method for avoiding electric short circuit |
| 09/23/2009 | CN101540449A Socket contact |
| 09/23/2009 | CN101538728A Production method and equipment of flexible copper clad laminate and flexible copper clad laminate |
| 09/23/2009 | CN100544559C Via transmission lines for multilayer printed circuit boards |
| 09/23/2009 | CN100544558C 多层印刷配线板 Multilayer printed wiring board |
| 09/23/2009 | CN100544556C Multilayer printed circuit board and manufacture method thereof |
| 09/23/2009 | CN100544548C Electronic unit and electronic apparatus having the same |
| 09/23/2009 | CN100544547C Multilayer printed circuit board and manufacturing method thereof |
| 09/23/2009 | CN100544546C Printed circuit board |
| 09/23/2009 | CN100544545C Multilayer circuit board |
| 09/23/2009 | CN100544544C Direct insertion type chip soldering seat and direct insertion type chip assembly structure |
| 09/23/2009 | CN100544543C Printed circuit board substrate and method for constructing same |
| 09/23/2009 | CN100544541C Method for producing circular inclined light lighting device and flexible circuit base board |
| 09/23/2009 | CN100543983C Method of manufacturing a circuit board layer on substrate surface |
| 09/23/2009 | CN100543752C Printed circuit board return route check method and printed circuit board pattern design CAD device |
| 09/23/2009 | CN100543195C Electroplating on composite substrates |
| 09/23/2009 | CN100542719C Spherical silver power and method for producing same |
| 09/22/2009 | US7593234 Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus |
| 09/22/2009 | US7593208 Multi-functional energy conditioner |
| 09/22/2009 | US7592703 RF and MMIC stackable micro-modules |
| 09/22/2009 | US7592696 Power module having at least two substrates |
| 09/22/2009 | US7592551 Wired circuit board assembly sheet |
| 09/22/2009 | US7592250 Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device |
| 09/22/2009 | US7592067 Epoxy resin compositions, processes utilizing same and articles made therefrom |
| 09/22/2009 | US7592065 For use in forming integrated circuit package, a module substrate and an electronic part; formation of an inner layer capacitor layer of a multi-layer system wiring substrate, useful for miniaturizing built-in antenna for wireless LAN and Radio Frequency Identification |
| 09/22/2009 | US7591921 heat decaying polymer containing a polyoxyalkylene resin as the principal ingredient formed by crosslinking a crosslinkable group containing hydrolyzing silyl group, an epoxy group, an acid anhydride group, a carboxyl group, a hydroxyl group; a decomposition promoter (SnO2 ) |
| 09/22/2009 | US7591689 Electrical connector with improved crosstalk compensation |
| 09/22/2009 | US7591194 Data capturing and processing system for a roller bearing and roller bearing with such system |
| 09/22/2009 | US7591067 Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same |
| 09/22/2009 | CA2399041C Printed circuit board |
| 09/17/2009 | WO2009113602A1 Method for manufacturing a resin substrate and a resin substrate |
| 09/17/2009 | WO2009113156A1 Connection device and optical device |
| 09/17/2009 | WO2009113124A1 Connector unit and electronic device |
| 09/17/2009 | WO2009113043A2 10g xfp compliant pcb |
| 09/17/2009 | WO2009112898A2 Antenna for use in earphone and earphone with integrated antenna |
| 09/17/2009 | WO2009112626A1 Method for packaging a component film comprising electronic components |
| 09/17/2009 | WO2009112241A1 Condenser microphone |
| 09/17/2009 | US20090233460 Output adapting device of plug-in power system |
| 09/17/2009 | US20090231823 Tape wiring substrate and semiconductor chip package |
| 09/17/2009 | US20090231822 Device, in particular intelligent power module with planar connection |
| 09/17/2009 | US20090231820 Capacitor-incorporated printed wiring board and electronic component |
| 09/17/2009 | US20090231819 Multilayer substrate |
| 09/17/2009 | US20090231818 Electronic element module and electronic device using the same |
| 09/17/2009 | US20090231816 System and method of preventing damage to metal traces of flexible printed circuits |
| 09/17/2009 | US20090231798 Method and housing for memory module including battery backup |
| 09/17/2009 | US20090231774 Reed Switch Arrays |
| 09/17/2009 | US20090231533 Semiconductor Device and Manufacturing Method Thereof |
| 09/17/2009 | US20090231065 Circuit structure and circuit substance for modifying characteristic impedance using different reference planes |
| 09/17/2009 | US20090229879 Printed circuit board and mounting structure for surface mounted device |
| 09/17/2009 | US20090229876 Flexible wiring board and method of manufacturing same |
| 09/17/2009 | US20090229875 Printed circuit board having fine pattern and manufacturing method thereof |
| 09/17/2009 | US20090229874 Multilayer wiring board |
| 09/17/2009 | US20090229873 Multilayer printed wiring board and component mounting method thereof |
| 09/17/2009 | US20090229872 Electronic component built-in board, manufacturing method of electronic component built-in board, and semiconductor device |
| 09/17/2009 | US20090229871 Feedthrough capacitor and mounted structure thereof |
| 09/17/2009 | US20090229870 Block copolymerized polyimide ink composition for printing |
| 09/17/2009 | US20090229869 Wiring board and method of making the same |
| 09/17/2009 | US20090229868 Printed wiring board with reinforced insulation layer and manufacturing method thereof |
| 09/17/2009 | US20090229867 Method for manufacturing a printed circuit board element as well as a printed circuit board element |
| 09/17/2009 | US20090229866 Wiring structure of a substrate |
| 09/17/2009 | US20090229865 Conductor for flexible substrate and fabrication method of same, and flexible substrate using same |
| 09/17/2009 | US20090229864 Insulating circuit board and insulating circuit board having cooling sink |
| 09/17/2009 | US20090229863 Conductor Carrier and Arrangement Comprising a Conductor Carrier |
| 09/17/2009 | US20090229862 Multilayer printed wiring board and method of manufacturing the same |
| 09/17/2009 | US20090229861 Wiring board having solder bump and method for manufacturing the same |
| 09/17/2009 | US20090229860 Green sheet for multi-layered electronics parts and manufacturing method for green chip using the same |
| 09/17/2009 | US20090229859 10G XFP compliant PCB |
| 09/17/2009 | DE102008013857A1 LED printed circuit board, has cooling fluid guide extending directly as through hole or extending indirectly from one side to another side of board, and active element i.e. nanomagnet, for active conveyance of cooling fluid in guide |
| 09/17/2009 | DE102005016676B4 Leiterbahn für elektronische Zwecke Wiring for electronic applications |
| 09/16/2009 | EP2101551A1 Piezoelectric Oscillator and a method of manufacturing the same |
| 09/16/2009 | EP2101550A1 Insulated metal substrate with an implant |