Patents for H05K 1 - Printed circuits (98,583)
06/2009
06/30/2009US7552876 IC card
06/30/2009US7552531 Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit
06/30/2009US7552530 Method of manufacturing a PCB having improved cooling
06/30/2009US7552525 Method for the production of a circuit board element
06/25/2009WO2009079182A2 High temperature composite tape and method for manufacturing the same
06/25/2009WO2009079033A1 Printed circuit board for a flat-panel speaker
06/25/2009WO2009078767A1 A device for reducing thermal stress on connection points
06/25/2009WO2009078409A1 Circuit connecting material and structure for connecting circuit member
06/25/2009WO2009078059A1 Printed board structure and connection electrode used for the same
06/25/2009WO2009077791A1 Antenna feed module
06/25/2009WO2009077601A1 Device for cooling an electronic card by conduction comprising heat pipes, and corresponding method of fabrication
06/25/2009WO2009077347A1 Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires, and device thereby obtained
06/25/2009US20090163049 Electronic module
06/25/2009US20090163048 Expansion card socket
06/25/2009US20090163046 Distribution board connection module
06/25/2009US20090162607 Flexible film and display device comprising the same
06/25/2009US20090162018 Hermetically Sealing Member Having Optical Transmission Means, Optoelectronic Apparatus, and Optical Transmission Method
06/25/2009US20090161022 Wiring board, electron source, image display apparatus, and image reproducing apparatus
06/25/2009US20090160474 Printed circuit board and impedance guarantee method of printed circuit board
06/25/2009US20090160438 System for measuring an electromagnetic field, a control system using the measuring system, and an electronic circuit designed for the measuring system
06/25/2009US20090159847 Resin Composition And Flexible Printed Circuit Board
06/25/2009US20090159331 Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate
06/25/2009US20090159327 Printed wiring board and manufacturing method of printed wiring board
06/25/2009US20090159326 S-turn via and method for reducing signal loss in double-sided printed wiring boards
06/25/2009US20090159324 Printed circuit board and method of producing the same
06/25/2009US20090159322 Through hole capacitor and method of manufacturing the same
06/25/2009US20090159321 Electronic devices with ultraviolet blocking layers and processes of forming the same
06/25/2009US20090159320 Low Cost High Frequency Device Package and Methods
06/25/2009US20090159319 Resin ejection nozzle, resin encapsulation method, and electronic part assembly
06/25/2009US20090159318 Printed circuit board and manufacturing method thereof
06/25/2009US20090159317 Printed circuit board and method for manufacturing the same
06/25/2009US20090159316 Wiring substrate and method of manufacturing the same
06/25/2009US20090159314 Shieldless, high-speed, low-cross-talk electrical connector
06/25/2009US20090159313 Curable epoxy resin composition and laminates made therefrom
06/25/2009DE102007062944A1 Electronic component/circuit i.e. organic electronic component/circuit, for use in e.g. radio-frequency identification tag, has regions of carrier substrate and pattern like layer made of inorganic or organic material and spaced from layer
06/25/2009DE102007061824A1 Data transmission system for transmitting coded data stream, has sender and receiver, where sender has loudspeaker for transmitting coded data stream and control circuit for controlling loudspeaker
06/25/2009DE102005033691B4 Verfahren zur Herstellung einer Basisplatte für eine Schaltungsbaugruppe, Basisplatte für eine Schaltungsbaugruppe, und Verwendung der Basisplatte für eine Schaltungsbaugruppe A process for preparing a base plate for a circuit board, base plate for a circuit package, and use of base plate for a circuit package
06/25/2009DE102004019877B4 Haftschicht zum Kleben von Harz auf eine Kupferoberfläche Adhesive layer for bonding resin on a copper surface
06/24/2009EP2073613A2 Flexible film and display device comprising the same
06/24/2009EP2073320A2 Methods and apparatus for reducing crosstalk in electrical connectors
06/24/2009EP2073316A1 Anisotropic conductive adhesive composition, anisotropic conductive film, circuit member connecting structure and method for manufacturing coated particles
06/24/2009EP2073265A1 Pressure contact in an assembly comprising a power semiconductor module
06/24/2009EP1771318B1 Control device, particularly a mechatronic transmission control device or engine control device
06/24/2009EP1698215A4 Method of manufacturing an electrical component
06/24/2009EP1645172A4 Environmental protection of serial ata and other electronic devices
06/24/2009EP1082732B1 Printed circuit board with a multilayer integral thin-film metal resistor and method therefor
06/24/2009CN201263252Y 印制线路板和电子装置 Printed circuit boards and electronic devices
06/24/2009CN201263251Y Carbon-printing key structure of printed circuit board
06/24/2009CN201263250Y Connection structure of DVD navigation board wire connection signal
06/24/2009CN201263249Y Dvd专用导航线路板 Dvd dedicated navigation board
06/24/2009CN201263248Y Integrated circuit board for home theater sound equipment
06/24/2009CN201263247Y Light source component and connection board thereof
06/24/2009CN101467502A Improved electrodes, inner layers, capacitors and printed wiring boards and methods of making thereof - part ii
06/24/2009CN101467501A Printed wiring board and method for manufacturing the same
06/24/2009CN101467500A Interconnect substrate and electronic circuit mounted structure
06/24/2009CN101467499A Power distribution system for integrated circuits
06/24/2009CN101466197A Circuit board and power amplifier double-channel transmit-receive unit and wireless base station provided thereon
06/24/2009CN101466196A Printed circuit board and impedance guarantee method of printed circuit board
06/24/2009CN101466195A Flexible printed circuit board and method of manufacturing the same
06/24/2009CN100506009C Release process film
06/24/2009CN100505995C Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection
06/24/2009CN100505990C Method for manufacturing double-sided printed circuit board
06/24/2009CN100505981C Flexible printed circuit board and its producing method
06/24/2009CN100505980C Substrate for flexible printed wiring board and method for manufacturing same
06/24/2009CN100505979C Wired circuit board holding sheet and production method thereof
06/24/2009CN100505978C Circuit board
06/24/2009CN100505977C Multilayer printed circuit board and its manufacture method
06/24/2009CN100505416C Method for forming RF ceramic block filters
06/24/2009CN100505124C Film capacitor, built-in high-density assembled substrate thereof and method for making said film capacitor
06/24/2009CN100504423C Low-intensity magnetic field sensor using printed circuit board manufacture technology and its manufacture method
06/24/2009CN100503718C Compositions with polymers for advanced materials
06/23/2009US7551768 Image recognition apparatus and method for surface discrimination using reflected light
06/23/2009US7551454 Thin-film assembly and method for producing said assembly
06/23/2009US7551453 Optically connectable circuit board with optical component(s) mounted thereon
06/23/2009US7551449 Flexible circuit board, electronic circuit device, and mobile communication terminal
06/23/2009US7551448 Electronic device having improved electrical connection
06/23/2009US7551325 Multifunctional apparatus
06/23/2009US7550985 Methods of testing memory devices
06/23/2009US7550855 Vertically spaced plural microsprings
06/23/2009US7550678 Plasma display module
06/23/2009US7550513 Fine metal hydride particles, their production process, dispersion containing fine metal hydride particles and metallic material
06/23/2009US7550321 Substrate having a functionally gradient coefficient of thermal expansion
06/23/2009US7549890 Alien next compensation for adjacently placed connectors
06/23/2009US7549872 Electric junction box
06/23/2009US7549724 Printhead assembly with multi-layered support structure
06/23/2009US7549591 Combined multi-frequency electromagnetic and optical communication system
06/23/2009US7549373 Integrated activating device for explosives
06/23/2009US7549222 Method of producing wiring board
06/23/2009US7549220 Method for making a multilayer circuit
06/18/2009WO2009075770A1 Improved insulating layer for rigid printed circuit boards
06/18/2009WO2009075213A1 Printed wiring board, method for manufacturing electronic component, insulating resin material, and method for manufacturing printed wiring board
06/18/2009WO2009075212A1 Laminate, method for producing laminate, flexible printed circuit board, and method for manufacturing flexible printed circuit board
06/18/2009WO2009075079A1 Circuit board, circuit board manufacturing method, and cover ray film
06/18/2009WO2009074564A1 Parts made of electrostructural composite material
06/18/2009WO2009074385A2 Direct current drive with extension for terminals and processing power
06/18/2009US20090156027 Electrical Connector
06/18/2009US20090156026 Contact and connecting device
06/18/2009US20090156024 Electrical junction box
06/18/2009US20090156020 Connector
06/18/2009US20090155684 Protection circuit assembly and battery pack having the same