| Patents for H05K 1 - Printed circuits (98,583) |
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| 08/13/2009 | WO2009100103A2 Method of connection of flexible printed circuit board and electronic device obtained thereby |
| 08/13/2009 | WO2009099707A1 Printed electronics |
| 08/13/2009 | WO2009099131A1 Multilayer circuit board, and motor-driving circuit board |
| 08/13/2009 | WO2009098937A1 Imaging module |
| 08/13/2009 | WO2009098889A1 Plasma display device |
| 08/13/2009 | WO2009098834A1 Manufacturing method of optical wiring printed board and optical wiring printed circuit board |
| 08/13/2009 | WO2009098832A1 Adhesive-free flexible laminate |
| 08/13/2009 | WO2009098765A1 Circuit board |
| 08/13/2009 | WO2009098553A1 Embedded spark gap |
| 08/13/2009 | WO2009098421A1 Method for making a heating element by depositing thin layers onto an insulating substrate, and resulting element |
| 08/13/2009 | WO2009098033A1 Method for producing a printed circuit board |
| 08/13/2009 | US20090202142 Circuit board, method for testing circuit board, and method for manufacturing circuit board |
| 08/13/2009 | US20090201656 Semiconductor package, and method of manufacturing semiconductor package |
| 08/13/2009 | US20090201654 Method and system for improving electrical performance of vias for high data rate transmission |
| 08/13/2009 | US20090201652 Circuit with an integrated shield and hearing aid |
| 08/13/2009 | US20090201650 Controller Assemblies For Electric Drive Utility Vehicles |
| 08/13/2009 | US20090201624 Component-embedded substrate and component package using component-embedded substrate |
| 08/13/2009 | US20090201399 Image Sensor |
| 08/13/2009 | US20090200648 Embedded die system and method |
| 08/13/2009 | US20090200074 Circuit Substrate Having Post-Fed Die Side Power Supply Connections |
| 08/13/2009 | US20090200073 Printed wiring board with capacitor |
| 08/13/2009 | US20090200072 Wiring substrate and method for manufacturing the same |
| 08/13/2009 | US20090200071 Resin composition, prepreg, laminate, and wiring board |
| 08/13/2009 | US20090200070 Cu-BASED WIRING MATERIAL AND ELECTRONIC COMPONENT USING THE SAME |
| 08/13/2009 | US20090200069 Multilayer printed wiring board |
| 08/13/2009 | US20090200068 Substrate for mounting semiconductor device |
| 08/13/2009 | US20090200067 Wiring substrate for electronic-component inspection apparatus |
| 08/13/2009 | US20090200066 Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure |
| 08/13/2009 | US20090200064 Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport |
| 08/13/2009 | US20090200063 Embedded spark gap |
| 08/13/2009 | US20090199401 Method for forming cast flexible substrate and resultant substrate and electronic device |
| 08/13/2009 | DE19903585B4 Halbleitersensor und Halbleitersensorchip und Halbleitersensorgehäuse Semiconductor sensor and semiconductor sensor chip and semiconductor sensor housing |
| 08/13/2009 | DE102008009220A1 Verfahren zum Herstellen einer Leiterplatte A method of manufacturing a printed circuit board |
| 08/13/2009 | CA2712381A1 Method for making a heating element by depositing thin layers onto an insulating substrate, and resulting element |
| 08/12/2009 | EP2087779A1 Compact control unit for a motor vehicle |
| 08/12/2009 | EP2087490A1 Aqueous formulation containing silver, and its use for production of electrically conductive or reflective coatings |
| 08/12/2009 | EP2086723A1 Power tool with electronic control unit |
| 08/12/2009 | EP1899986A4 An electrically conductive composite |
| 08/12/2009 | EP1886544A4 Method and arrangement for protecting sensitive components by textile and product including said arrangement |
| 08/12/2009 | EP1859490B1 Composite films suitable for use in opto-electronic and electronic devices |
| 08/12/2009 | EP1650248B1 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 08/12/2009 | EP1620885B1 Organic polymers, electronic devices, and methods |
| 08/12/2009 | EP1062634B1 Chip card equipped with a loop antenna, and associated micromodule |
| 08/12/2009 | CN201290200Y Leadless and non-welding circuit |
| 08/12/2009 | CN201290199Y Circuit board |
| 08/12/2009 | CN201290198Y Circuit board |
| 08/12/2009 | CN201290197Y Rigidity-flexible printed circuit board |
| 08/12/2009 | CN201290143Y Mold for producing liquid crystal screen plate |
| 08/12/2009 | CN101507373A Wiring board, semiconductor device using wiring board and their manufacturing methods |
| 08/12/2009 | CN101507372A Printed wiring board, method for manufacturing printed wiring board, and electric device |
| 08/12/2009 | CN101507058A Build-up printed wiring board substrate having a core layer that is part of a circuit |
| 08/12/2009 | CN101507057A Circuit connecting material, connection structure for circuit member using the same and production method thereof |
| 08/12/2009 | CN101505575A Flexible circuit based on PDMS biological compatibility |
| 08/12/2009 | CN101504936A Electric apparatus substrate, image forming control panel and image forming apparatus |
| 08/12/2009 | CN101504836A Printed circuit board and method of manufacturing the same |
| 08/12/2009 | CN100527108C Memory system and memory module |
| 08/12/2009 | CN100526901C Probe card for probing wafers with raised contact elements |
| 08/11/2009 | US7573727 Connecting device for contacting a semiconductor component |
| 08/11/2009 | US7573725 Optimizing power delivery and signal routing in printed circuit board design |
| 08/11/2009 | US7573721 Embedded passive device structure and manufacturing method thereof |
| 08/11/2009 | US7573718 Spacer, printed circuit board, and electronic equipment |
| 08/11/2009 | US7573709 Grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers |
| 08/11/2009 | US7573135 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
| 08/11/2009 | US7572984 Electronic module with dual connectivity |
| 08/11/2009 | US7572983 Printed circuit board |
| 08/11/2009 | US7572982 Tape carrier package |
| 08/11/2009 | US7572671 Stacked module systems and methods |
| 08/11/2009 | US7572533 Flat panel direct methanol fuel cell and method of making the same |
| 08/11/2009 | US7572515 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| 08/11/2009 | US7572503 Flame retardancy although it is halogen-free, with good bonding strength, soldering heat resistance and coefficient of thermal expansion; novolak epoxy resin, carboxylic acid-modified acrylonitrile butadiene rubber particles, a triazine ring-containing cresol novolak, phenolic phosphorus compound, filler |
| 08/11/2009 | US7572128 Systems for wireless antenna connection |
| 08/11/2009 | CA2345829C Process to manufacture tight tolerance embedded elements for printed circuit boards |
| 08/06/2009 | WO2009096507A1 Resin composition and multilayer resin film employing the same |
| 08/06/2009 | WO2009096241A1 Method for manufacturing electronic member, and electronic member |
| 08/06/2009 | WO2009096235A1 Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, method for producing phosphorus-containing epoxy resin, curable resin composition using the epoxy resin and the epoxy resin composition, and cured product |
| 08/06/2009 | WO2009096067A1 Opto-electric hybrid board and electronic device |
| 08/06/2009 | WO2009096003A1 Mounting structure for chip capacitor, electronic device and mounting method |
| 08/06/2009 | WO2009095559A2 Method for making a component having an electronic function |
| 08/06/2009 | WO2009064121A3 Prepreg having uniform permittivity, and metal clad laminates and print wiring board using the same |
| 08/06/2009 | US20090197559 Magnetically Differential Input |
| 08/06/2009 | US20090197439 Electrical press-in contact |
| 08/06/2009 | US20090197435 Printed circuit board direct connection and method of forming the same |
| 08/06/2009 | US20090196011 Device mounting board and manufacturing method therefor, and semiconductor module |
| 08/06/2009 | US20090196010 Device mounting board, and semiconductor module and manufacturing method therefor |
| 08/06/2009 | US20090196009 Semiconductor module, wiring board , and wiring method |
| 08/06/2009 | US20090196003 Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard |
| 08/06/2009 | US20090196002 Printed wiring board unit |
| 08/06/2009 | US20090196001 Wiring board with switching function and method of manufacturing the same |
| 08/06/2009 | US20090195999 Printed circuit board and method of manufacturing the same |
| 08/06/2009 | US20090195998 Printed circuit board and method of manufacturing the same |
| 08/06/2009 | US20090195997 Printed circuit board and method of manufacturing the same |
| 08/06/2009 | US20090195996 Image display apparatus |
| 08/06/2009 | US20090194322 Device mounting board and manufacturing method therefor, and semiconductor module |
| 08/06/2009 | US20090194321 Printed circuit board and method of manufacturing the same |
| 08/06/2009 | US20090194320 White Prepreg, White Laminated Plate, and Metal Foil Clad White Laminated Plate |
| 08/06/2009 | US20090194319 Photocurable resin composition, dry film, cured product, and printed circuit board |
| 08/06/2009 | US20090194318 Printed circuit board and method for manufacturing the same |
| 08/06/2009 | DE202008004481U1 Wand- oder Bodenbelag Wall or Floor covering |
| 08/06/2009 | DE19736962B4 Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben Arrangement comprising a carrier substrate for power components and a heat sink and method for manufacturing the same |
| 08/06/2009 | DE102009006388A1 Mit einem Leistungsverstärker versehenes Hochfrequenzmodul With a power amplifier provided high-frequency module |