Patents for H05K 1 - Printed circuits (98,583)
09/2009
09/16/2009EP2101412A1 Variable filter element, variable filter module and fabrication method thereof
09/16/2009EP2101406A1 Piezoelectric Oscillator and a method of manufacturing the same
09/16/2009EP2100987A1 Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated copper foil with very thin primer resin layer
09/16/2009EP2100783A2 Rain sensor embedded on printed circuit board
09/16/2009EP1725978B1 Polymeric film substrate for use in radio-frequency responsive tags
09/16/2009EP1603722B1 Breaking device for separating ceramic printed circuit boards
09/16/2009EP1207730B1 Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
09/16/2009CN101536618A Printed circuit board with embedded circuit component
09/16/2009CN101536617A Circuit board connection structure and circuit board
09/16/2009CN101534611A Method for manufacturing printed circuit board, printed circuit board, and electronic apparatus
09/16/2009CN101534610A Built-in capacitor element circuit board and manufacture method thereof
09/16/2009CN101534607A Routing substrate and production method thereof
09/16/2009CN101534606A Method for producing copper-clad laminate
09/16/2009CN101534604A Surface-mount circuit board piece module and preparation method thereof
09/16/2009CN101534603A Conductor used in flexible substrate, method for producing conductor, and flexible substrate
09/16/2009CN101534602A Printing circuit board of mixed materials
09/16/2009CN101534601A Routing carrier
09/16/2009CN101534600A Printed circuit board
09/16/2009CN101534599A LED radiating substrate and manufacturing method thereof
09/16/2009CN101533943A An electromagnetic coupler
09/16/2009CN101533834A Thin compact semiconductor die packages suitable for smart-power modules, methods of making the same, and systems using the same
09/16/2009CN101533824A Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
09/16/2009CN101533823A Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
09/16/2009CN101533822A Mounting structure and electro optical device
09/16/2009CN101533692A Surface-mount resistor and printed circuit board
09/16/2009CN101533325A Double-sided touch sensitive panel and flex circuit bonding
09/16/2009CN101532852A Intelligent increment or absolute-value encoder circuit board and calculation method thereof
09/16/2009CN101532618A LED flexible variable color neon lamp for replacing glass neon lamp
09/16/2009CN100542377C Welding pad design method, pad structure, printing circuit board and equipment
09/16/2009CN100542376C Multilayer ceramic substrate and its manufacturing method
09/16/2009CN100542375C Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
09/16/2009CN100542374C Double layer flexible board and method for manufacturing the same
09/16/2009CN100541950C Electric junction box and its assembling process
09/16/2009CN100541936C Power delivery system for integrated circuits
09/16/2009CN100541916C Interconnect structure and method for connecting buried signal lines to electrical devices
09/16/2009CN100541778C Method for preventing impedance of storage chip circumference from mismatching, storage system and template
09/16/2009CN100541777C An electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
09/16/2009CN100541562C Display
09/16/2009CN100541403C Touch panel input device
09/16/2009CN100540494C Crystallized glass complex and sintered crystallized glass used in circuit board
09/15/2009US7590434 Seal for portable electronic device housing with flex circuit
09/15/2009US7590357 Optical module having small stray capacitance and stray inductance
09/15/2009US7589975 Mobile instrument with flexible printed wiring board
09/15/2009US7589787 Solid state image sensing device
09/15/2009US7589611 Overvoltage protection materials and process for preparing same
09/15/2009US7589409 Stacked packages and microelectronic assemblies incorporating the same
09/15/2009US7589394 Interposer
09/15/2009US7589283 Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system
09/15/2009US7589282 Wiring board and a semiconductor device using the same
09/15/2009CA2524826C Miniaturized imaging module construction technique
09/15/2009CA2375739C Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics
09/11/2009WO2009111660A1 System and method of preventing damage to metal traces of flexible printed circuits
09/11/2009WO2009110387A1 Laminate for flexible board and heat conductive polyimide film
09/11/2009WO2009110376A1 Leadframe substrate, semiconductor module and method for manufacturing leadframe substrate
09/11/2009WO2009110355A1 Mounting structure and method for manufacturing same
09/11/2009WO2009110286A1 Electronic component and method for manufacturing the same
09/10/2009US20090227153 Grouped element transmission channel link with pedestal aspects
09/10/2009US20090226665 Nickel structures and methods for manufacturing the same by removal of an underlying material
09/10/2009US20090225527 Multi-function mezzanine board alignment and mounting device, with integrated handle
09/10/2009US20090225268 Mounting structure and electro optical device
09/10/2009US20090224411 Multi-Chips Module Package Structure and the Method thereof
09/10/2009US20090224399 Silicon nitride substrate, method of manufacturing the same, and silicon nitride circuit board and semiconductor module using the same
09/10/2009US20090224394 Solid-state image sensing apparatus and package of same
09/10/2009US20090223710 Method of Forming Solid Vias in a Printed Circuit Board
09/10/2009US20090223709 Printed circuit board having adaptable wiring lines and method for manufacturing the same
09/10/2009US20090223708 Coaxial connector mounted circuit board
09/10/2009US20090223707 Mutual capacitance and magnetic field distribution control for transmission lines
09/10/2009US20090223706 Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby
09/10/2009US20090223705 Electronic Component Mounting Method and Electronic Circuit Device
09/10/2009US20090223704 Laminated film and molded body
09/10/2009US20090223703 Method and composition for screen printing of conductive features
09/10/2009US20090223702 Trace carrier
09/10/2009US20090223701 Porous resin base, method for manufacturing same, and multilayer substrate
09/10/2009US20090223700 Thin flexible circuits
09/10/2009US20090223435 Substrate panel
09/10/2009DE102008013226A1 High-tensile solder connection manufacturing method for measuring instrument, involves assembling printed circuit board with surface mount device component in such manner that contact area of connection lies laminarly on soldering paste
09/10/2009DE102008012913A1 Elektrisches Bauteil oder Gerät mit einer flexiblen Leiterplatte Electrical component or device with a flexible printed circuit board
09/10/2009DE102008012572A1 Leiterbahnanordnung zum Kontaktieren elektronischer Bauteile Interconnect arrangement for contacting electronic components
09/10/2009DE102008012443A1 Optical sensor i.e. optical proximity switch, has opening partially limited by metal edge surface, and printed circuit boards forming mechanically rigid and electrically conductive solder connection and arranged right-angled to each other
09/10/2009DE102008011394A1 Method for assembling electronic components of assembly building group on plastic carrier substrate, involves providing bond pad in area adjacent to contact area or in contact area with fastening recess
09/10/2009DE102008008853A1 Schaltungsanordnung mit Bondverbindung Circuitry with bond
09/10/2009DE102004056466B4 Wärmeisolierungselement für eine Schaltungsanordnung Heat insulation element for a circuit arrangement
09/09/2009EP2099266A1 Electrical component or device with a flexible circuit board
09/09/2009EP2099265A2 Printed circuit path arrangement for contacting electronic components
09/09/2009EP2099264A1 Printed circuit board with thermocouple
09/09/2009EP2098550A1 Polymerizable composition
09/09/2009EP2098103A1 A surface-mountable waveguide arrangement
09/09/2009EP2097945A1 A dual polarized waveguide feed arrangement
09/09/2009EP2097908A2 Waterborne conductive compositions
09/09/2009EP1764206B1 Oriented polyester film for a flexible electronics device substrate
09/09/2009EP1761951A4 Lead solder indicator and method
09/09/2009EP1232677B1 Flip chip package, circuit board thereof and packaging method thereof
09/09/2009CN201307970Y Circuit board
09/09/2009CN201307969Y Circuit wafer compatible with different pin interval inductances
09/09/2009CN201307968Y Double-sided flexible copper-clad plate
09/09/2009CN201307967Y Double-sided flexible copper-clad plate
09/09/2009CN101530007A Circuit substrate device and circuit substrate module device
09/09/2009CN101530006A Flipped micro-strip filter
09/09/2009CN101528013A Assembling method for connecting circuit board and panel
09/09/2009CN101528007A Adhesion assisting agent-bearing metal foil, printed wiring board using the same and manufacturing method thereof