Patents for H05K 1 - Printed circuits (98,583)
05/2009
05/13/2009CN101433132A Shielded flexible circuits and methods for manufacturing same
05/13/2009CN101432861A Connection structure and method of producing the same
05/13/2009CN101432759A System and method for mounting an image capture device on a flexible substrate
05/13/2009CN101432330A Resin composition, prepreg, laminate, and wiring board
05/13/2009CN101431861A Printed wiring board
05/13/2009CN101431860A Clock pulse generator
05/13/2009CN101431859A Electric connection structure of circuit board and circuit board with the same
05/13/2009CN101431858A All-metal ultra-high conducting CTP circuit board
05/13/2009CN101431857A Printed wiring board
05/13/2009CN101431856A Wired circuit board
05/13/2009CN101431855A Circuit board with identification code and its production method
05/13/2009CN101430943A Bus bar to printed circuit board interface for electric and hybrid electric vehicles
05/13/2009CN100488338C Method for controlling impedance
05/13/2009CN100488337C Circuit board, and its fixing method, and electronic equipment using the same circuit board
05/13/2009CN100488336C Circuit board assembly employing solder vent hole
05/13/2009CN100488335C Multiple stage type print circuit board of probe card
05/13/2009CN100487940C Method of fabricating electronic interconnect devices using direct imaging of dielectric composite material
05/13/2009CN100487529C Flexible circuit board and flat display having said flexible circuit board
05/13/2009CN100487068C Conductive sizing material
05/12/2009US7533193 Apparatus and method for reducing electromigration
05/12/2009US7532487 Grounding structure for a liquid crystal module
05/12/2009US7532485 Multilayer module and method of manufacturing the same
05/12/2009US7532481 Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
05/12/2009US7532465 Computer enclosure with drive bracket
05/12/2009US7531755 Trimming of embedded structures
05/12/2009US7531754 Flexible substrate having interlaminar junctions, and process for producing the same
05/12/2009US7531753 Suspension board with circuit
05/12/2009US7531752 Flexible substrate and electronic device
05/12/2009US7531751 Method and system for an improved package substrate for use with a semiconductor package
05/12/2009US7531453 Microelectronic devices and methods for forming interconnects in microelectronic devices
05/12/2009US7531416 Thick film capacitors on ceramic interconnect substrates
05/12/2009US7531387 Flip chip mounting method and bump forming method
05/12/2009US7531252 Film and magnetic-recording medium using the same
05/12/2009US7531115 Conductive material and method for filling via-hole
05/12/2009US7531112 Thermoplastic or thermosetting resin; semiconductive filler (ZnO); and BaTiO3, PbTiO3, PMN-PT, SrTiO3, CaTiO3, or MgTiO3 as a ferroelectric insulator; the mixture is used to produce an embedded capacitor with a high dielectric constant
05/12/2009US7531011 Method of manufacturing capacitor device
05/12/2009US7530167 Method of making a printed circuit board with low cross-talk noise
05/12/2009US7530163 Electronic parts packaging structure and method of manufacturing the same
05/12/2009CA2523411C A double-sided pluggable backplane
05/07/2009WO2009059044A2 Surge protection circuit for passing dc and rf signals
05/07/2009WO2009057688A1 Electrolytic copper foil and process for producing the electrolytic copper foil
05/07/2009WO2009057612A1 Circuit connecting material and connecting structure for circuit member
05/07/2009WO2009057419A1 Method for forming circuit
05/07/2009WO2009057376A1 Circuit connecting material, connection structure and method for producing the same
05/07/2009WO2009057196A1 Device, mounting structure, inserting/removing jig and securing method
05/07/2009WO2009056645A1 Circuit board having contact surface and configuration
05/07/2009WO2009056422A1 Support element arrangement and method for producing a support element arrangement
05/07/2009WO2009036478A3 Printed circuit board element and method for the production thereof
05/07/2009WO2009003651A3 Display device, in particular transparent multimedia façade
05/07/2009US20090117458 Flexible printed circuit (PC) board, junction method thereof, and battery pack using the flexible PC board
05/07/2009US20090116206 Portable electronic device
05/07/2009US20090116204 Capacitor assembly of electrical circuit system
05/07/2009US20090116203 Mounting structure
05/07/2009US20090116201 Circuit board module and method for reinforcing structure thereof
05/07/2009US20090115754 Image display apparatus using thin-film transistors
05/07/2009US20090115442 Semiconductor integrated circuit and electronic device
05/07/2009US20090115401 System comprising an automotive fuse and an A/D converter
05/07/2009US20090114435 Electronic device and method of manufacturing same
05/07/2009US20090114434 Method of manufacturing non-shrinkage ceramic substrate and non-shrinkage ceramic substrate using the same
05/07/2009US20090114433 Multi-layered ceramic board and method of manufacturing the same
05/07/2009US20090114432 Laminate for printed wiring board, printed wiring board using same, method for manufacturing printed wiring board, electrical component, electronic component, and electrical device
05/07/2009US20090114431 Circuit board and manufacturing method thereof
05/07/2009US20090114430 Method for patterning of conductive polymer
05/07/2009US20090114429 Packaging substrate having pattern-matched metal layers
05/07/2009US20090114428 Printed wiring board
05/07/2009US20090114427 Circuit joining assembly materials for multi-layer lightning protection systems on composite aircraft
05/07/2009US20090114426 Wired circuit board
05/07/2009US20090114425 Conductive paste and printed circuit board using the same
05/07/2009US20090113698 Apparatus for electrically coupling a semiconductor package to a printed circuit board
05/07/2009DE19800928B4 Gehäuse, insbesondere stapelbares Gehäuse, zur Aufnahme von Bauelementen und Verfahren zu dessen Herstellung Housing, in particular a stackable housing for receiving components and process for its preparation
05/07/2009DE102007052366A1 Trägerelementanordnung und Verfahren zur Herstellung einer Trägerelementanordnung Support element arrangement and method for producing a support element arrangement
05/07/2009DE102007014579B4 Mikrofon Microphone
05/07/2009DE102004039806B4 Speichermodul Memory module
05/07/2009DE10142975B4 Wärmeableitelement für elktronische Bauteile und Verfahren zum Anbringen desselben The same heat sink member for elktronische components and methods for applying
05/06/2009EP2056655A1 Wiring board
05/06/2009EP2056654A1 PCB with contact surface and assembly
05/06/2009EP2056457A1 High frequency module
05/06/2009EP2056406A1 Circuit connecting material, connection structure for circuit member using the same and production method thereof
05/06/2009EP2056349A1 Component built-in module and method for producing the same
05/06/2009EP2055161A2 Lightweight audio system for automotive applications and method
05/06/2009EP2055155A1 Control unit for a motor vehicle
05/06/2009EP2055154A1 Standardized electronics housing having modular contact partners
05/06/2009EP2054947A1 Optoelectronic component
05/06/2009EP1813001B1 Two piece mid-plane
05/06/2009EP1360882A4 A stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same
05/06/2009EP1102338B1 Ptc element, ptc element-mounted pcb board, secondary cell protection circuit device and secondary cell assembly
05/06/2009CN201234406Y Flexible printed circuit board
05/06/2009CN201234405Y 印刷电路板 A printed circuit board
05/06/2009CN201234404Y Electrostatic discharging construction for PCB
05/06/2009CN201234403Y Flexible printed circuit board and mobile phone using the same
05/06/2009CN201234402Y PCB board
05/06/2009CN201234401Y Nickel partial electroplating printed circuit board
05/06/2009CN201234400Y Circuit board and plasma television comprising the circuit board
05/06/2009CN201230925Y Double temperature control hand warmer with alarm
05/06/2009CN101427614A Contact bank, measurement arrangement including a contact bank, telecommunications module provided with a contact bank or a measurement arrangement and telecommunications assembly including plural mod
05/06/2009CN101427613A Substrate joining member and three-dimensional structure using the same
05/06/2009CN101426959A Electrolytic copper foil, surface treated copper foil using the electrolytic copper foil, copper-clad laminated plate using the surface treated copper foil, and method for manufacturing the electrolyt
05/06/2009CN101426343A Mounting structure of electronic component
05/06/2009CN101426342A Manufacturing method of hollowed-out flexible circuit board
05/06/2009CN101426338A Lamination board and manufacturing method thereof