| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/27/2009 | CN201248198Y Routing structure for circuit board of secondary encapsulation quartz oscillator |
| 05/27/2009 | CN201248197Y Metal base single-sided copper foil covered board |
| 05/27/2009 | CN201248196Y Metal base two-sided copper foil covered board |
| 05/27/2009 | CN201248195Y Epoxy glass cloth base two-sided copper foil covered board |
| 05/27/2009 | CN201248194Y Ceramic-based copper foil covered board |
| 05/27/2009 | CN201248193Y Printed circuit board and electronic equipment |
| 05/27/2009 | CN201248192Y Combined structure of PCB and metal base |
| 05/27/2009 | CN201247772Y 线路板 Board |
| 05/27/2009 | CN101443960A Electrical connector |
| 05/27/2009 | CN101443285A Needled glass mat |
| 05/27/2009 | CN101442886A Printed circuit board and manufacturing method of the same |
| 05/27/2009 | CN101442879A Circuit board and conductivity through-hole structure thereof |
| 05/27/2009 | CN101442878A Flexible wiring board, method of producing the same and imaging device |
| 05/27/2009 | CN101442877A Novel interconnection structure and method for creating electric through-hole |
| 05/27/2009 | CN101442876A Circuit board |
| 05/27/2009 | CN101442875A Circuit board with multilayer welding-proof structure |
| 05/27/2009 | CN101442061A Circuit board and camera component using the same |
| 05/27/2009 | CN101442013A Circuit module and manufacturing method thereof |
| 05/27/2009 | CN101441357A Luminous module, molding mode of the same and application thereof |
| 05/27/2009 | CN101441293A Light pipe mounting interface |
| 05/27/2009 | CN100493299C Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 05/27/2009 | CN100493295C Method of mounting printed circuit board by flat package IC and its soldering method and air conditioner |
| 05/27/2009 | CN100493294C Microconnector for FPC and method of producing the same |
| 05/27/2009 | CN100493293C Plane display |
| 05/27/2009 | CN100493292C Radiator fixing device |
| 05/27/2009 | CN100493291C Plug-in and its manufacture method |
| 05/27/2009 | CN100492637C Semiconductor device package and its manufacturing method, and semiconductor |
| 05/27/2009 | CN100492633C Welding disc mode structure |
| 05/27/2009 | CN100492629C Electronic assembly comprising interposer with embedded capacitors and methods of manufacture |
| 05/27/2009 | CN100492628C Electronic assembly comprisnig substrate with embedded capacitors and methods of manufacture |
| 05/27/2009 | CN100492619C Semiconductor device and its making method |
| 05/27/2009 | CN100492112C Printing circuit board connecting structure of LCD module |
| 05/26/2009 | US7540003 Optical pickup device, disk drive unit, and disk drive device |
| 05/26/2009 | US7539376 Optically connectable circuit board with optical component(s) mounted thereon |
| 05/26/2009 | US7539027 Force distributing spring element |
| 05/26/2009 | US7539026 Sub-mezzanine structure for printed circuit card assemblies |
| 05/26/2009 | US7539025 Method of reducing electromagnetic interference and circuit connection device using the same |
| 05/26/2009 | US7539022 Chip embedded packaging structure |
| 05/26/2009 | US7538642 Waveguide coupler |
| 05/26/2009 | US7538440 Method for improved high current component interconnections |
| 05/26/2009 | US7538413 Semiconductor components having through interconnects |
| 05/26/2009 | US7538278 Printed circuit board for preventing increase of thermal expansion |
| 05/26/2009 | US7538237 gas-in-liquid emulsion in a reactor to continuously process relatively large quantities of materials; hydrogen peroxide synthesis by reacting a solution of DI H2O with oxygen and hydrogen gases; p-xylene oxidation by reacting p-xylene in water with oxygen |
| 05/26/2009 | US7538166 Such as 1-(3-methyl-4-oxiranylmethoxyphenyl)-4-(4-oxiranylmethoxyphenyl)-1-cyclohexene; monomer synthesis; polymers cured with such as 4,4'-diaminodiphenylmethane; prepregs; low melting point raw materials exhibiting liquid crystallinity |
| 05/26/2009 | US7538150 Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin |
| 05/26/2009 | US7537962 Method of fabricating a shielded stacked integrated circuit package system |
| 05/26/2009 | US7537668 Method of fabricating high density printed circuit board |
| 05/26/2009 | US7537464 Electrical pin interconnection for electronic package |
| 05/26/2009 | CA2490604C Connecting structure between busbar base and printed circuit board |
| 05/26/2009 | CA2413184C Energy absorbent laminate |
| 05/22/2009 | WO2009065105A2 Thermal packaging of transmission controller using carbon composite printed circuit board material |
| 05/22/2009 | WO2009064121A2 Prepreg having uniform permittivity, and metal clad laminates and print wiring board using the same |
| 05/22/2009 | WO2009063827A1 Circuit connecting material and structure for connecting circuit member |
| 05/22/2009 | WO2009063742A1 Metal laminate |
| 05/22/2009 | WO2009063709A1 Electronic circuit module |
| 05/22/2009 | WO2009063570A1 Electronic device and its manufacturing method |
| 05/22/2009 | WO2009062539A1 Blank and method for the production thereof |
| 05/22/2009 | WO2009033716A4 Illumination device and method for the production thereof |
| 05/21/2009 | US20090130914 Electrical Connector with Improved Crosstalk Compensation |
| 05/21/2009 | US20090130870 Electrical connector with a shielding shell having slodering tails |
| 05/21/2009 | US20090129041 Stacked semiconductor module, method of fabricating the same, and electronic system using the same |
| 05/21/2009 | US20090129039 Multilayer printed wiring board |
| 05/21/2009 | US20090129037 Printed wiring board with built-in semiconductor element, and process for producing the same |
| 05/21/2009 | US20090129034 Imaging device |
| 05/21/2009 | US20090129004 Electrically conducting and optically transparent nanowire networks |
| 05/21/2009 | US20090128606 Integrated circuit (ic) incorporating rows of proximal ink ejection ports |
| 05/21/2009 | US20090126991 Substrate for mounting electronic part and electronic part |
| 05/21/2009 | US20090126983 Method and Apparatus to Reduce Impedance Discontinuity in Packages |
| 05/21/2009 | US20090126982 Wiring board and method for manufacturing the same |
| 05/21/2009 | US20090126981 Wiring board and method for manufacturing the same |
| 05/21/2009 | US20090126980 Printed wiring board |
| 05/21/2009 | US20090126979 Semiconductor package circuit board and method of forming the same |
| 05/21/2009 | US20090126978 Reference layer openings |
| 05/21/2009 | US20090126977 Multilayer film |
| 05/21/2009 | US20090126976 Flexible wiring board, method of producing the same and imaging device |
| 05/21/2009 | US20090126975 Method for fabricating multilayer circuit board, circuit plate, and method for fabricating the circuit plate |
| 05/21/2009 | US20090126974 Manufacturing Process for a Prepreg with a Carrier, Prepreg with a Carrier, Manufacturing Process for a Thin Double-Sided Plate, Thin Double-Sided Plate and Manufacturing Process for a Multilayer-Printed Circuit Board |
| 05/21/2009 | US20090126967 Thermal packaging of transmission controller using carbon composite printed circuit board material |
| 05/20/2009 | EP2061289A1 Interconnection of embedded passive components and substrates |
| 05/20/2009 | DE20321684U1 Elektronische Schaltung mit einem Leistungshalbleiterbauelement und mit einem Sicherungsmittel zum Schutz des Leistungshalbleiterbauelements An electronic circuit comprising a power semiconductor device and having a safety means for protecting the power semiconductor component, |
| 05/20/2009 | DE202009003574U1 Leiterplatte und Vorrichtung mit einer solchen Leiterplatte PCB and device having such a circuit board |
| 05/20/2009 | DE102008050154A1 Verdrahtungsplatte und Verfahren zum Verhindern eines Hochspannungsschadens Wiring board and method for preventing a high voltage damage |
| 05/20/2009 | DE102004012979B4 Kopplungssubstrat für Halbleiterbauteile, Anordnungen mit dem Kopplungssubstrat, Kopplungssubstratstreifen, Verfahren zur Herstellung dieser Gegenstände und Verfahren zur Herstellung eines Halbleitermoduls Coupling substrate for semiconductor devices, with the coupling assemblies substrate, coupling substrate strip, process for producing these articles and methods for manufacturing a semiconductor module |
| 05/20/2009 | CN201243410Y Fixed welded structure of power transistor on printed circuit board |
| 05/20/2009 | CN201243409Y Fixed welded structure of transformer on printed circuit board |
| 05/20/2009 | CN201243408Y Circuit board with embedded capacitance element |
| 05/20/2009 | CN201243407Y Gold finger connection device |
| 05/20/2009 | CN201243406Y Flexible circuit board and liquid crystal display module applying the same |
| 05/20/2009 | CN201243405Y Pattern structure of circuit board |
| 05/20/2009 | CN201243404Y 电路板 Board |
| 05/20/2009 | CN201243149Y Sector electric connector and special sector printed board thereof |
| 05/20/2009 | CN201242894Y Copper foil covered pnenolic aldehyde paper laminated board for novel printed circuit |
| 05/20/2009 | CN201242893Y Copper foil covered pnenolic aldehyde paper laminated board for printed circuit |
| 05/20/2009 | CN101438634A Electrical assembly |
| 05/20/2009 | CN101438633A Thermal surface mounting of multiple LEDs onto a heatsink |
| 05/20/2009 | CN101438460A Electrical connector |
| 05/20/2009 | CN101437984A Metal compound film and method of manufacturing the same |
| 05/20/2009 | CN101437914A Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet |
| 05/20/2009 | CN101437368A Multi-chip common power supply/grounding structure for printed circuit board |
| 05/20/2009 | CN101437364A Device mounting structure and device mounting method |