Patents for H05K 1 - Printed circuits (98,583)
07/2009
07/02/2009WO2009081769A1 Circuit board structure having measures against heat
07/02/2009WO2009081685A1 Component mounting board and method for manufacturing same
07/02/2009WO2009081610A1 Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board
07/02/2009WO2009059044A3 Surge protection circuit for passing dc and rf signals
07/02/2009WO2009045888A3 Printed circuit board coil
07/02/2009US20090170352 Connector connection terminals
07/02/2009US20090170240 Optimized Circuit Design Layout for High Performance Ball Grid Array Packages
07/02/2009US20090170226 Package for a Semiconductor Light Emitting Device
07/02/2009US20090169730 Method of forming conductors at low temperatures using metallic nanocrystals and product
07/02/2009US20090169154 Multiple Channel Optical Tranceiver Modules with Compatibility Features
07/02/2009US20090169034 Condenser microphone mountable on main pcb
07/02/2009US20090168384 Electronic apparatus
07/02/2009US20090168380 Package substrate embedded with semiconductor component
07/02/2009US20090168374 Thin multi-chip flex module
07/02/2009US20090168373 Portable electronic device and method for assembling the same
07/02/2009US20090168371 Expansion card retention assembly
07/02/2009US20090168368 Discrete electronic component and related assembling method
07/02/2009US20090168366 Thin multi-chip flex module
07/02/2009US20090168348 High density component assembly method and apparatus
07/02/2009US20090167735 Flexible film and display device comprising the same
07/02/2009US20090167638 Flexible film and display device comprising the same
07/02/2009US20090166892 Circuit board for semiconductor package having a reduced thickness, method for manufacturing the same, and semiconductor package having the same
07/02/2009US20090166877 electro-optic device and a method for producing the same
07/02/2009US20090166431 Electronic component and manufacturing method thereof
07/02/2009US20090166080 Multilayer wiring board and method of manufacturing the same
07/02/2009US20090166079 Aluminum substrate is subjected to a first film dissolution treatment for dissolving up to 20 wt % of the anodized layer, followed by an anodizing treatment and a second film dissolution treatment
07/02/2009US20090166077 Wiring board and method of manufacturing the same
07/02/2009US20090166076 Insulating material and printed circuit board having the same
07/02/2009US20090166075 Printed circuit board
07/02/2009US20090166074 Electronic component
07/02/2009US20090166073 Ceramic substrate, method of manufacturing the same, and electrical device using the same
07/02/2009US20090166072 Electronic apparatus and method of manufacturing the same, and wiring substrate and method of manufacturing the same
07/02/2009US20090166071 Substrate and Electronic Device Using the Same
07/02/2009US20090166070 Flexible film and display device comprising the same
07/02/2009US20090166069 Solder Mounting Structure, Method for Manufacturing Such Solder Mounting Structure and Use of Such Solder Mounting Structure
07/02/2009US20090166068 Electronic component
07/02/2009US20090166067 Clad member and printed-circuit board
07/02/2009US20090166066 Copper foil
07/02/2009US20090166064 Circuit board and process for producing the same
07/02/2009US20090166063 Stiffener and strengthened flexible printed circuit board having the same
07/02/2009US20090166062 Printed circuit board assembly
07/02/2009US20090166061 PCB strip, PCB strip assembly device using the PCB strip, a method of using the PCB strip assembly device, and a method of fabricating a PCB strip
07/02/2009US20090166060 Insulating Resin Layer, Insulating Resin Layer With Carrier And Multiple-Layered Printed Wiring Board
07/02/2009US20090166059 Circuit board and process thereof
07/02/2009US20090166058 Printed circuit board
07/02/2009DE102008050875A1 Printed circuit board for testing e.g. electronic device, has set of bypass pads testing electric circuit i.e. memory and formed of copper, and solder resist layer exposing external pads and covering bypass pads
07/02/2009DE102007063282A1 Verfahren zur Herstellung eines elektrischen Leiters durch Auftragen zumindest einer Paste, insbesondere Dickschichtpaste A process for producing an electric conductor by applying at least one paste, in particular thick-film paste
07/02/2009DE102007061651A1 Transformer for e.g. switching regulator, of switching power supply, has daughter printed circuit board completely sealed as separate part with casting resin, and attached to base printed circuit board
07/02/2009DE102005018116B4 Leistungshalbleitermodul The power semiconductor module
07/02/2009CA2709793A1 Circuit board structure having measures against heat
07/01/2009EP2076103A2 Flexible film and display device comprising the same
07/01/2009EP2076102A2 Flexible film and display device comprising the same
07/01/2009EP2076101A1 Printed wiring board and printed circuit board unit
07/01/2009EP2076100A1 Wire-written circuit board or board with etched circuit routes
07/01/2009EP2076099A1 Stacked foil sheet device
07/01/2009EP2076098A1 Flexible film and display device comprising the same
07/01/2009EP2076097A2 Flexible film and display device comprising the same
07/01/2009EP2075802A1 Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film
07/01/2009EP2074872A2 Textile for connection of electronic devices
07/01/2009EP1645013B8 Component for a printed circuit board
07/01/2009CN201267055Y Via hole structure of keyboard board
07/01/2009CN201267054Y Metal base copper foil covered board
07/01/2009CN201267053Y Clamper for PCB board selective vacuum plug hole
07/01/2009CN201267052Y Line motherboard
07/01/2009CN201267051Y 自然散热式印制线路板 Natural cooling type printed circuit boards
07/01/2009CN101473706A Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components
07/01/2009CN101472392A Pad-welding structure and debug method applying the same
07/01/2009CN101472391A Copper foil
07/01/2009CN101472390A Reinforcing plate and reinforced flexible circuit board including the same
07/01/2009CN101472389A Printed circuit board and method of producing the same
07/01/2009CN101472388A Layout structure of circuit board
07/01/2009CN101472387A Layout capable of weightily welding pad and debug method applying the same
07/01/2009CN101472386A Printed circuit board
07/01/2009CN101472385A Printed circuit board
07/01/2009CN101471502A Electronic apparatus
07/01/2009CN100508707C Electrical circuit apparatus and method for assembling same
07/01/2009CN100508698C Ceramic circuit board, method for making the same, and power module
07/01/2009CN100508691C Multilayer printed circuit board
07/01/2009CN100508690C Laminate for printed circuit board and method of manufacturing the same
07/01/2009CN100508145C Chip-embedded modular circuit board
07/01/2009CN100507982C Dial module, its manufacturing process and meter employing that dial module
07/01/2009CN100507768C Timer including mechanism electrically connected to electric or electronic element of timer
07/01/2009CN100507068C Aluminum alloy thin film, wiring circuit having the thin film and target material depositing the thin film
07/01/2009CN100506917C Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepreg made with these, and metal
07/01/2009CN100506810C Epoxy compound and epoxy resin cured product obtained by curing the epoxy compound
06/2009
06/30/2009US7555206 Apparatus for retrieving data from detachable optical driver
06/30/2009US7554822 Power converter for led large area light source lamp
06/30/2009US7554814 Portable storage device having a sandwich package structure
06/30/2009US7554813 Memory card with two standard sets of contacts and a contact covering mechanism
06/30/2009US7554812 Structural support for portable electronic devices
06/30/2009US7554177 Attachment system incorporating a recess in a structure
06/30/2009US7554040 Printed circuit board and soldering method and apparatus
06/30/2009US7554039 Electronic device
06/30/2009US7553781 Fabrics with high thermal conductivity coatings
06/30/2009US7553512 Applying flowable precursor composition to organic substrate wherein precursor comprises molecular precursor to conductive phase and powder of insulating material, heating substrate to convert molecular precursor to conductive phase
06/30/2009US7553469 Aluminum nitride powder and aluminum nitride sintered compact
06/30/2009US7553457 Chemical processing apparatus for manufacturing circuit substrates
06/30/2009US7553166 Electrical connector for connecting a plurality of printed circuits
06/30/2009US7553164 Circuit device and method of manufacturing the same
06/30/2009US7553071 Sensor unit