Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/09/2014US8907407 Semiconductor device covered by front electrode layer and back electrode layer
12/09/2014US8907405 Semiconductor structures with dual trench regions and methods of manufacturing the semiconductor structures
12/09/2014US8907404 Semiconductor integrated circuit device and a method of manufacturing the same
12/09/2014US8907403 Memory devices capable of reducing lateral movement of charges
12/09/2014US8907399 Semiconductor device with flash memory cells having improved arrangement for floating gate electrodes and control gate electrodes of the flash memory cells
12/09/2014US8907398 Gate structure in non-volatile memory device
12/09/2014US8907397 Nonvolatile semiconductor memory device containing a material having an oxygen dissociation catalytic action
12/09/2014US8907393 Semiconductor device having buried bit lines and method for fabricating the same
12/09/2014US8907388 Optical-information acquiring element, optical information acquiring element array, and hybrid solid-state imaging device
12/09/2014US8907384 CNT-based sensors: devices, processes and uses thereof
12/09/2014US8907383 Stack packages having token ring loops
12/09/2014US8907382 Semiconductor device and fabrication method thereof
12/09/2014US8907381 Reduced short channel effect of III-V field effect transistor via oxidizing aluminum-rich underlayer
12/09/2014US8907379 Semiconductor device with a gate electrode having a shape formed based on a slope and gate lower opening and method of manufacturing the same
12/09/2014US8907372 Thyristor and method for the same
12/09/2014US8907370 Electronic devices with yielding substrates
12/09/2014US8907358 Organic light-emitting panel, manufacturing method thereof, and organic display device
12/09/2014US8907346 Imprint apparatus, imprint method, and manufacturing method of semiconductor device
12/09/2014US8907341 Thin-film semiconductor device and method for fabricating thin-film semiconductor device
12/09/2014US8907336 Stable amorphous metal oxide semiconductor
12/09/2014US8907334 Oxide for semiconductor layer of thin-film transistor, sputtering target, and thin-film transistor
12/09/2014US8907333 Pyrogenic zinc oxide-comprising composite of layers and field-effect transistor comprising this composite
12/09/2014US8907329 Organic el panel, display device using same, and method for producing organic el panel
12/09/2014US8907317 Silicon based nanoscale crossbar memory
12/09/2014US8907306 Multi charged particle beam writing apparatus and multi charged particle beam writing method
12/09/2014US8907285 Pyroelectric detector and method for manufacturing same, pyroelectric detection device, and electronic instrument
12/09/2014US8907259 Microwave irradiation device and microwave irradiation method
12/09/2014US8907254 Heating control system, deposition device provided therewith, and temperature control method
12/09/2014US8907253 Method and device for producing a compound semiconductor layer
12/09/2014US8907247 Annealing apparatus using two wavelengths of laser radiation
12/09/2014US8906838 Microelectronic cleaning and arc remover compositions
12/09/2014US8906813 SiOx process chemistry development using microwave plasma CVD
12/09/2014US8906812 Wet etch and clean chemistries for MoOx
12/09/2014US8906811 Shallow pn junction formed by in situ doping during selective growth of an embedded semiconductor alloy by a cyclic growth/etch deposition process
12/09/2014US8906810 Pulsed dielectric etch process for in-situ metal hard mask shape control to enable void-free metallization
12/09/2014US8906809 Multichip electronic packages and methods of manufacture
12/09/2014US8906808 Etching method
12/09/2014US8906807 Single fin cut employing angled processing methods
12/09/2014US8906806 Method of manufacturing semiconductor device
12/09/2014US8906805 Methods of fabricating semiconductor devices
12/09/2014US8906804 Composition including material, methods of depositing material, articles including same and systems for depositing materials
12/09/2014US8906803 Method of forming through substrate vias (TSVs) and singulating and releasing die having the TSVs from a mechanical support substrate
12/09/2014US8906802 Methods of forming trench/via features in an underlying structure using a process that includes a masking layer formed by a directed self-assembly process
12/09/2014US8906801 Processes for forming integrated circuits and integrated circuits formed thereby
12/09/2014US8906800 Stacked digital/RF system-on-chip with integral isolation layer
12/09/2014US8906799 Random local metal cap layer formation for improved integrated circuit reliability
12/09/2014US8906798 Methods of manufacturing stress buffer structures in a mounting structure of a semiconductor device
12/09/2014US8906797 Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
12/09/2014US8906796 Method of producing semiconductor transistor
12/09/2014US8906795 Semiconductor device manufacturing method
12/09/2014US8906794 Gate silicidation
12/09/2014US8906793 Borderless contact for an aluminum-containing gate
12/09/2014US8906792 Impurity diffusion method, substrate processing apparatus, and method of manufacturing semiconductor device
12/09/2014US8906791 Method of improving film non-uniformity and throughput
12/09/2014US8906790 Combinatorial approach for screening of ALD film stacks
12/09/2014US8906789 Asymmetric cyclic desposition etch epitaxy
12/09/2014US8906788 Method for making epitaxial structure
12/09/2014US8906786 Method for producing single crystal SiC substrate and single crystal SiC substrate produced by the same
12/09/2014US8906785 Method of epitaxially growing silicon by atomic layer deposition for TFT flash memory cell
12/09/2014US8906784 Graphene epitaxied on SiC, with an open band gap and mobility comparable to standard graphene with zero band gap
12/09/2014US8906783 Method for cutting brittle sheet-shaped structure
12/09/2014US8906782 Method of separating semiconductor die using material modification
12/09/2014US8906781 Method for electrically connecting wafers using butting contact structure and semiconductor device fabricated through the same
12/09/2014US8906780 Method for transferring a thin layer of monocrystalline silicon
12/09/2014US8906779 Solar-powered energy-autonomous silicon-on-insulator device
12/09/2014US8906778 Method of semiconductor manufacturing process
12/09/2014US8906777 Methods for evaluating and manufacturing semiconductor wafer
12/09/2014US8906776 Method for forming integrated circuits on a strained semiconductor substrate
12/09/2014US8906775 Semiconductor device and method for fabricating the same
12/09/2014US8906774 Methods and compositions for doping silicon substrates with molecular monolayers
12/09/2014US8906773 Integrated circuits including integrated passive devices and methods of manufacture thereof
12/09/2014US8906772 Graphene layer formation at low substrate temperature on a metal and carbon based substrate
12/09/2014US8906771 Semiconductor processing methods, and methods of forming isolation structures
12/09/2014US8906770 Semiconductor structure that reduces the effects of gate cross diffusion and method of forming the structure
12/09/2014US8906767 Semiconductor device with self-aligned interconnects
12/09/2014US8906765 Method of making a non-volatile double gate memory cell
12/09/2014US8906764 Non-volatile memory (NVM) and logic integration
12/09/2014US8906763 Method of manufacturing a dynamic random access memory (DRAM) including forming contact pads of adjacent cells by laterally etching a contact opening of a cell therebetween
12/09/2014US8906762 Flash memory with P-type floating gate
12/09/2014US8906760 Aspect ratio dependent deposition to improve gate spacer profile, fin-loss and hardmask-loss for FinFET scheme
12/09/2014US8906758 Regrown heterojunction bipolar transistors for multi-function integrated devices and method for fabricating the same
12/09/2014US8906757 Methods of forming patterns of a semiconductor device
12/09/2014US8906756 Method for manufacturing semiconductor device
12/09/2014US8906755 Active matrix using hybrid integrated circuit and bipolar transistor
12/09/2014US8906754 Methods of forming a semiconductor device with a protected gate cap layer and the resulting device
12/09/2014US8906753 Semiconductor structure and method for manufacturing the same
12/09/2014US8906752 Polythiophene-containing ink compositions for inkjet printing
12/09/2014US8906751 Silicon controlled rectifiers (SCR), methods of manufacture and design structures
12/09/2014US8906750 Method of encapsulation of a microcomponent
12/09/2014US8906749 Method for fabricating a semiconductor device
12/09/2014US8906748 Method for packaging a semiconductor structure
12/09/2014US8906747 Cavity-type semiconductor package and method of packaging same
12/09/2014US8906746 Method for producing semiconductor device
12/09/2014US8906745 Method using fluid pressure to remove back metal from semiconductor wafer scribe streets
12/09/2014US8906744 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
12/09/2014US8906743 Semiconductor device with molded casing and package interconnect extending therethrough, and associated systems, devices, and methods
12/09/2014US8906742 Two-beam laser annealing with improved temperature performance
12/09/2014US8906741 Electronic package structure having side-wing parts outside of a package layer for dissipating heat and method for making the same
12/09/2014US8906740 Integrated circuit packaging system having dual sided connection and method of manufacture thereof
12/09/2014US8906739 Thin film transistor substrate and method for manufacturing same
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