Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/10/2014CN102428547B 微细加工处理剂及微细加工处理方法 Micro-fine processing agents and processing methods
12/10/2014CN102420109B 一种提高mim器件电容均匀性的方法 A method for uniformly mim capacitive device to improve
12/10/2014CN102419822B 芯片焊接机的工装夹具管理方法和芯片焊接机 Chip welding machine fixture management methods and die bonder
12/10/2014CN102412266B 提高soa能力的功率器件结构及其制造方法 Improve the ability of soa power device structure and manufacturing method
12/10/2014CN102403212B 硅通孔晶片的抛光方法和用于该方法的抛光组合物 TSV wafer polishing method and a polishing composition used in the process of
12/10/2014CN102399506B 压敏粘合带 The pressure-sensitive adhesive tape
12/10/2014CN102363713B 稳定的化学机械抛光组合物以及抛光基板的方法 Stable chemical mechanical polishing composition and method of polishing a substrate,
12/10/2014CN102340980B 安装机 Mounting machine
12/10/2014CN102332383B 等离子体刻蚀工艺的终点监控方法 The end of the plasma etching process monitoring method
12/10/2014CN102314038B 电泳显示器件及其制造方法 Electrophoretic display device and manufacturing method thereof
12/10/2014CN102308382B 制造孔层的方法 The method of producing porous layer
12/10/2014CN102299177B 一种接触的制造方法以及具有该接触的半导体器件 A method of manufacturing a semiconductor device having a contact and the contact
12/10/2014CN102280380B 通过加工单晶而制造多个半导体晶片的方法 The method of processing a single crystal is manufactured by a plurality of semiconductor wafers
12/10/2014CN102263134B 一种双极性薄膜晶体管及其制备方法 A bipolar thin film transistor and its preparation method
12/10/2014CN102246306B 具有增大的击穿电压特性的基于沟槽的功率半导体器件 Trench based power semiconductor device having an increased breakdown voltage characteristics of
12/10/2014CN102246299B 用于制作通路互连的方法 The method for making the interconnection path
12/10/2014CN102246266B 常温接合装置 Room temperature bonding apparatus
12/10/2014CN102203913B 植入制程的热模组 Implantation process thermal module
12/10/2014CN102203910B 反应室 The reaction chamber
12/10/2014CN102194745B 光器件晶片的加工方法 Optical device wafer processing method
12/10/2014CN102190975B 芯片接合薄膜、切割/芯片接合薄膜及半导体装置 Die-bonding film, a thin film semiconductor device and the cutting / die-bonding
12/10/2014CN102173795B 强电介质薄膜形成用组合物、强电介质薄膜的形成方法及通过该方法形成的强电介质薄膜 Ferroelectric thin film forming composition, a method for forming a ferroelectric film and ferroelectric thin film formed by this method
12/10/2014CN102153960B 倒装芯片型半导体背面用膜 The back of a flip-chip type semiconductor film
12/10/2014CN102142404B 半导体器件和通信方法 Semiconductor device and communication method
12/10/2014CN102130152B 自对准双极晶体管及其制作方法 Self-aligned bipolar transistor and its manufacturing method
12/10/2014CN102130049B 半导体器件的制造方法以及半导体器件 The method of manufacturing a semiconductor device and a semiconductor device
12/10/2014CN102127391B 一种抗辐射复合材料及其配备方法 A radiation composite material and is equipped with anti-method
12/10/2014CN102082104B 用于制造半导体器件的方法 The method for manufacturing a semiconductor device
12/10/2014CN102069448B 半导体晶片的制造方法 The method of manufacturing a semiconductor wafer
12/10/2014CN102067738B 复合射频(rf)波形的匹配电路 Composite radio frequency (rf) waveform matching circuit
12/10/2014CN102055381B 磁力悬浮传送系统 Magnetically levitated transport system
12/10/2014CN101996894B 半导体器件和围绕管芯周边形成坝材料以减小翘曲的方法 Semiconductor device and method of forming a dam around the periphery of the die to reduce the warpage of the material
12/10/2014CN101950732B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/10/2014CN101931009B 薄膜晶体管和制备薄膜晶体管的方法 Method for preparing a thin film transistor and the thin film transistor
12/10/2014CN101905444B 修整装置、修整方法和抛光装置 Trimming device, trimming and polishing apparatus method
12/10/2014CN101893774B 液晶显示面板及其制造方法 A liquid crystal display panel and manufacturing method thereof
12/10/2014CN101852834B 低效率太阳能电池的短路排查装置 Low efficiency of the solar cell short circuit troubleshooting device
12/10/2014CN101827782B 使用纳米结构连接和粘接相邻层 Use nanostructures connection and bonding of adjacent layers
12/10/2014CN101740637B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/10/2014CN101740488B 在介电层中形成通孔及垂直蚀刻轮廓的方法 The method of forming the through-hole and vertical etch profile of the dielectric layer
12/10/2014CN101685266B 光学照明装置、曝光装置以及曝光方法 Illumination optical apparatus, exposure apparatus and exposure method
12/10/2014CN101175603B 一种生产半导体晶片抛光垫的方法 A method of manufacturing a semiconductor wafer polishing pad
12/09/2014USRE45286 Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming
12/09/2014US8910096 Focus position adjusting apparatus, reticle, focus position adjusting program, and method of manufacturing semiconductor device
12/09/2014US8909369 Transport facility
12/09/2014US8909364 Substrate processing system and substrate processing method
12/09/2014US8908455 Semiconductor integrated circuit device
12/09/2014US8908419 Semiconductor storage device and method of fabricating the same
12/09/2014US8908349 Member for semiconductor manufacturing apparatus
12/09/2014US8908348 Wafer grounding and biasing method, apparatus, and application
12/09/2014US8908161 Removing aluminum nitride sections
12/09/2014US8908153 Method to calculate transmission cross coefficient in an exposure apparatus
12/09/2014US8908150 Substrate processing method, manufacturing method of EUV mask, and EUV mask
12/09/2014US8908143 Substrate holder, lithographic apparatus, and device manufacturing method involving a heater and/or temperature sensor
12/09/2014US8908138 Contact structure
12/09/2014US8908091 Alignment of lens and image sensor
12/09/2014US8907690 Method of determining an electrical property of a test sample
12/09/2014US8907503 Manufacturing an underfill in a semiconductor chip package
12/09/2014US8907502 Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device
12/09/2014US8907499 Three dimensional structure memory
12/09/2014US8907498 Semiconductor device and method of forming a shielding layer between stacked semiconductor die
12/09/2014US8907496 Circuit structures and methods of fabrication with enhanced contact via electrical connection
12/09/2014US8907495 Semiconductor device and manufacturing method thereof
12/09/2014US8907490 Semiconductor packages having the first and second chip inclined sidewalls contact with each other
12/09/2014US8907489 Wiring substrate, method of manufacturing the same, and semiconductor device
12/09/2014US8907486 Ruthenium for a dielectric containing a lanthanide
12/09/2014US8907485 Copper ball bond features and structure
12/09/2014US8907484 Semiconductor device and method for manufacturing same
12/09/2014US8907481 Stack of semiconductor structures and corresponding manufacturing method
12/09/2014US8907479 Treating copper surfaces for packaging
12/09/2014US8907478 Bump pad structure
12/09/2014US8907476 Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
12/09/2014US8907472 3DIC package comprising perforated foil sheet
12/09/2014US8907471 Window interposed die packaging
12/09/2014US8907470 Millimeter wave wafer level chip scale packaging (WLCSP) device and related method
12/09/2014US8907468 Semiconductor device
12/09/2014US8907467 PCB based RF-power package window frame
12/09/2014US8907466 Stackable molded microelectronic packages
12/09/2014US8907461 Heat dissipation device embedded within a microelectronic die
12/09/2014US8907459 Three-dimensional semiconductor integrated circuit device and method of fabricating the same
12/09/2014US8907458 Creation of vias and trenches with different depths
12/09/2014US8907457 Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
12/09/2014US8907456 Multi-material hard mask or prepatterned layer for use with multi-patterning photolithography
12/09/2014US8907455 Voltage-controlled switches
12/09/2014US8907451 Semiconductor chip and semiconductor apparatus with embedded capacitor
12/09/2014US8907450 Metal-semiconductor wafer bonding for high-Q devices
12/09/2014US8907444 Stress-inducing structures, methods, and materials
12/09/2014US8907443 Semiconductor device
12/09/2014US8907442 System comprising a semiconductor device and structure
12/09/2014US8907441 Methods for double-patterning-compliant standard cell design
12/09/2014US8907434 MEMS inertial sensor and method for manufacturing the same
12/09/2014US8907430 Semiconductor device and manufacturing method of semiconductor device
12/09/2014US8907429 Semiconductor device, semiconductor integrated circuit, SRAM, and method for producing Dt-MOS transistor
12/09/2014US8907426 Semiconductor device having embedded strain-inducing pattern and method of forming the same
12/09/2014US8907425 Semiconductor device
12/09/2014US8907423 Method of manufacturing a semiconductor device and the semiconductor device
12/09/2014US8907414 High voltage fast recovery trench diode
12/09/2014US8907412 Semiconductor device
12/09/2014US8907410 TSV structure with a built-in U-shaped FET transistor for improved characterization
12/09/2014US8907409 Semiconductor device having buried bit lines and method for fabricating the same
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