Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2014
11/27/2014US20140345526 Coated liner assembly for a semiconductor processing chamber
11/27/2014US20140345525 Coated liner assembly for a semiconductor processing chamber
11/27/2014US20140345522 High-energy ion implanter
11/27/2014US20140345518 Method for manufacturing workpieces and apparatus
11/27/2014US20140345484 Blanket, printing process, and a method of manufacturing display unit and electronic apparatus
11/27/2014US20140345360 Apparatus for evaluating dynamic forces
11/27/2014US20140345117 Semiconductor device with thermal dissipation lead frame
11/25/2014US8897914 Conveyance system and method of communication in conveyance system
11/25/2014US8897906 Wafer processing based on sensor detection and system learning
11/25/2014US8897631 Annealing apparatus
11/25/2014US8897051 Semiconductor storage device and method for producing the same
11/25/2014US8897050 Local bit lines and methods of selecting the same to access memory elements in cross-point arrays
11/25/2014US8896778 Liquid crystal display device
11/25/2014US8896777 Semiconductor device comprising a spacer wherein the spacer has an opening through which a pixel electrode is connected to a first transistor
11/25/2014US8896138 Chip identification for organic laminate packaging and methods of manufacture
11/25/2014US8896136 Alignment mark and method of formation
11/25/2014US8896135 Encapsulation film, package structure utilizing the same, and method for forming the package structure
11/25/2014US8896133 Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
11/25/2014US8896132 Electronic device and fabrication method thereof
11/25/2014US8896129 Semiconductor device and manufacturing method for the same
11/25/2014US8896128 Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
11/25/2014US8896127 Via structure and via etching process of forming the same
11/25/2014US8896125 Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
11/25/2014US8896122 Semiconductor devices having gates including oxidized nickel
11/25/2014US8896120 Structures and methods for air gap integration
11/25/2014US8896118 Electronic assembly with copper pillar attach substrate
11/25/2014US8896115 Semiconductor device and method of forming shielding layer around back surface and sides of semiconductor wafer containing IPD structure
11/25/2014US8896113 Base plate and semiconductor device
11/25/2014US8896111 Semiconductor device and method for manufacturing the same
11/25/2014US8896109 Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die
11/25/2014US8896102 Die edge sealing structures and related fabrication methods
11/25/2014US8896100 III nitride structure and method for manufacturing III nitride semiconductor fine columnar crystal
11/25/2014US8896099 Carbon material and method of manufacturing the same
11/25/2014US8896097 Method of manufacturing capacitor, capacitor and method of forming dielectric film for use in capacitor
11/25/2014US8896096 Process-compatible decoupling capacitor and method for making the same
11/25/2014US8896093 Circuit configuration and manufacturing processes for vertical transient voltage suppressor (TVS) and EMI filter
11/25/2014US8896089 Interposers for semiconductor devices and methods of manufacture thereof
11/25/2014US8896088 Reliable electrical fuse with localized programming
11/25/2014US8896085 Semiconductor light-emitting element manufacturing method, lamp, electronic equipment, and mechanical apparatus
11/25/2014US8896077 Optoelectronic semiconductor device and method of fabrication
11/25/2014US8896074 MEMS vibration isolation system and method
11/25/2014US8896071 Reducing defects in electronic switching devices
11/25/2014US8896069 Semiconductor devices having tensile and/or compressive stress and methods of manufacturing
11/25/2014US8896068 Semiconductor device including source/drain regions and a gate electrode, and having contact portions
11/25/2014US8896062 Semiconductor device and method for forming the same
11/25/2014US8896055 Accumulation type FinFET, circuits and fabrication method thereof
11/25/2014US8896053 Semiconductor device and method of manufacturing the same
11/25/2014US8896052 Nonvolatile semiconductor memory device and method of manufacturing the same
11/25/2014US8896051 Semiconductor device and method for manufacturing the same
11/25/2014US8896050 Electronic device including a tunnel structure
11/25/2014US8896049 Semiconductor device and method for manufacturing the same
11/25/2014US8896042 Semiconductor device comprising oxide semiconductor
11/25/2014US8896041 Spin hall effect assisted spin transfer torque magnetic random access memory
11/25/2014US8896037 Solid-state imaging device and method for manufacturing the same
11/25/2014US8896028 Semiconductor device, manufacturing method thereof, protective element, and manufacturing method thereof
11/25/2014US8896025 Method for fabricating semiconductor device
11/25/2014US8896022 Method of manufacturing compound semiconductor device
11/25/2014US8896017 Vertical structure LEDs
11/25/2014US8896010 Wafer-level flip chip device packages and related methods
11/25/2014US8896005 Lighting devices that comprise one or more solid state light emitters
11/25/2014US8896001 Nitride semiconductor light emitting device
11/25/2014US8895994 Electronic device including silicon carbide diode dies
11/25/2014US8895991 Organic electroluminescent display and method of manufacturing the same
11/25/2014US8895982 Organic light-emitting display apparatus and method of manufacturing the same
11/25/2014US8895977 Thin film transistor and method of forming the same
11/25/2014US8895974 Organic el display device and method for manufacturing the same
11/25/2014US8895962 Silicon/germanium nanoparticle inks, laser pyrolysis reactors for the synthesis of nanoparticles and associated methods
11/25/2014US8895959 Superlattice structure and method for making the same
11/25/2014US8895958 Light emitting element and method for manufacturing same
11/25/2014US8895944 Scan head and scan arm using the same
11/25/2014US8895943 Lithography system and method of processing substrates in such a lithography system
11/25/2014US8895942 Dielectric treatment module using scanning IR radiation source
11/25/2014US8895889 Methods and apparatus for rapidly responsive heat control in plasma processing devices
11/25/2014US8895843 Thick-film pastes containing lead-tellurium-boron-oxides, and their use in the manufacture of semiconductor devices
11/25/2014US8895842 High quality TCO-silicon interface contact structure for high efficiency thin film silicon solar cells
11/25/2014US8895651 Composition for printing a seed layer and process for producing conductor tracks
11/25/2014US8895457 Method of manufacturing semiconductor device and substrate processing apparatus
11/25/2014US8895456 Method of depositing a film
11/25/2014US8895455 Method for manufacturing semiconductor device and substrate processing apparatus
11/25/2014US8895454 Etching method of multilayer film
11/25/2014US8895453 Semiconductor device with an insulation layer having a varying thickness
11/25/2014US8895452 Substrate support providing gap height and planarization adjustment in plasma processing chamber
11/25/2014US8895451 Method for etching micro-electrical films using a laser beam
11/25/2014US8895450 Low resistivity tungsten PVD with enhanced ionization and RF power coupling
11/25/2014US8895449 Delicate dry clean
11/25/2014US8895448 Single crystal silicon membrane with a suspension layer, method for fabricating the same, and a micro-heater
11/25/2014US8895447 Semiconductor hole structure
11/25/2014US8895446 Fin deformation modulation
11/25/2014US8895445 Method of forming via holes
11/25/2014US8895444 Hard mask removal during FinFET formation
11/25/2014US8895443 N-metal film deposition with initiation layer
11/25/2014US8895442 Cobalt titanium oxide dielectric films
11/25/2014US8895440 Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV
11/25/2014US8895439 Method for forming pattern and method for manufacturing display device by using the same
11/25/2014US8895438 Method for forming a multi-level surface on a substrate with areas of different wettability and a semiconductor device having the same
11/25/2014US8895437 Method for forming staircase word lines in a 3D non-volatile memory having vertical bit lines
11/25/2014US8895436 Implementing enhanced power supply distribution and decoupling utilizing TSV exclusion zone
11/25/2014US8895435 Polysilicon layer and method of forming the same
11/25/2014US8895434 Replacement metal gate structure for CMOS device
11/25/2014US8895433 Method of forming a graphene cap for copper interconnect structures
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