Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2014
11/25/2014US8895432 Method of fabricating a self-aligned buried bit line for a vertical channel DRAM
11/25/2014US8895431 Method for fabricating semiconductor device
11/25/2014US8895430 Method of making a semiconductor device comprising a land grid array flip chip bump system with short bumps
11/25/2014US8895429 Micro-channel structure with variable depths
11/25/2014US8895428 Manufacture method of thin film transistor array substrate
11/25/2014US8895427 Substrate having a transparent electrode and method for producing the same
11/25/2014US8895426 Metal gate transistor, integrated circuits, systems, and fabrication methods thereof
11/25/2014US8895425 Method of forming channel layer of electric device and method of manufacturing electric device using the same
11/25/2014US8895423 Method for making semiconductor diodes with low reverse bias currents
11/25/2014US8895422 Production of an integrated circuit including electrical contact on SiC
11/25/2014US8895421 III-N device structures and methods
11/25/2014US8895420 Method of fabricating a device with a concentration gradient and the corresponding device
11/25/2014US8895419 Nitride semiconductor light-emitting element and method for fabricating the same
11/25/2014US8895418 Semiconductor device and method for producing a semiconductor device
11/25/2014US8895417 Reducing contact resistance for field-effect transistor devices
11/25/2014US8895416 Semiconductor device PN junction fabrication using optical processing of amorphous semiconductor material
11/25/2014US8895415 Tensile stressed doped amorphous silicon
11/25/2014US8895414 Method and apparatus for forming amorphous silicon film
11/25/2014US8895413 Monolithic integration of photonics and electronics in CMOS processes
11/25/2014US8895412 Nano-structure manufacturing method using sacrificial etching mask
11/25/2014US8895411 Method for creating semiconductor junctions with reduced contact resistance
11/25/2014US8895410 Method of manufacturing semiconductor device and semiconductor manufacturing apparatus
11/25/2014US8895409 Semiconductor wafer plating bus and method for forming
11/25/2014US8895408 Semiconductor device
11/25/2014US8895407 Manufacturing method of SOI substrate and manufacturing method of semiconductor device
11/25/2014US8895406 Release strategies for making transferable semiconductor structures, devices and device components
11/25/2014US8895405 Method for manufacturing a semiconductor device
11/25/2014US8895404 Method of back-side patterning
11/25/2014US8895403 Transistor, method for fabricating the transistor, and semiconductor device comprising the transistor
11/25/2014US8895402 Fin-type memory
11/25/2014US8895400 Methods of fabricating semiconductor devices having buried word line interconnects
11/25/2014US8895399 Integrated circuit and method of forming sealed trench junction termination
11/25/2014US8895398 Method for manufacturing double-gate structures
11/25/2014US8895397 Methods for forming thin film storage memory cells
11/25/2014US8895396 Epitaxial Process of forming stress inducing epitaxial layers in source and drain regions of PMOS and NMOS structures
11/25/2014US8895395 Reduced resistance SiGe FinFET devices and method of forming same
11/25/2014US8895394 Trench FET with source recess etch
11/25/2014US8895393 Memory devices including vertical pillars and methods of manufacturing and operating the same
11/25/2014US8895392 Method for fabricating semiconductor device
11/25/2014US8895391 Method of manufacturing semiconductor memory device
11/25/2014US8895390 Memory device with a textured lowered electrode
11/25/2014US8895389 Semiconductor structures and fabrication method thereof
11/25/2014US8895388 Method of manufacturing a semiconductor device and a non-volatile semiconductor storage device including the formation of an insulating layer using a plasma treatment
11/25/2014US8895387 Method of manufacturing nonvolatile semiconductor memory device
11/25/2014US8895386 Method of forming semiconductor structure
11/25/2014US8895385 Methods of forming semiconductor structures
11/25/2014US8895384 Gate structures and methods of manufacture
11/25/2014US8895383 Multiple-gate semiconductor device and method
11/25/2014US8895382 Solid-state imaging device
11/25/2014US8895381 Method of co-integration of strained-Si and relaxed Si or strained SiGe FETs on insulator with planar and non-planar architectures
11/25/2014US8895380 Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby
11/25/2014US8895379 Integrated circuit having raised source drains devices with reduced silicide contact resistance and methods to fabricate same
11/25/2014US8895378 Compound semiconductor device and method of manufacturing the same
11/25/2014US8895377 Method for manufacturing semiconductor device
11/25/2014US8895376 Thin film transistor, method for manufacturing same, display device, and method for manufacturing same
11/25/2014US8895375 Field effect transistor and method for manufacturing the same
11/25/2014US8895374 Semiconductor field-effect transistor structure and method for manufacturing the same
11/25/2014US8895373 Method for manufacturing flexible semiconductor device having gate electrode disposed within an opening of a resin film
11/25/2014US8895372 Graphene based three-dimensional integrated circuit device
11/25/2014US8895371 Transistor employing vertically stacked self-aligned carbon nanotubes
11/25/2014US8895370 Vertical conduction power electronic device and corresponding realization method
11/25/2014US8895369 Methods for manufacturing superjunction semiconductor device having a dielectric termination
11/25/2014US8895368 Method for manufacturing chip package structure
11/25/2014US8895367 Fabrication method of semiconductor package
11/25/2014US8895366 Fabrication method of semiconductor package
11/25/2014US8895365 Techniques and configurations for surface treatment of an integrated circuit substrate
11/25/2014US8895364 Structured wafer for device processing
11/25/2014US8895363 Die preparation for wafer-level chip scale package (WLCSP)
11/25/2014US8895362 Methods for bonding material layers to one another and resultant apparatus
11/25/2014US8895359 Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus
11/25/2014US8895358 Semiconductor device and method of forming cavity in PCB containing encapsulant or dummy die having CTE similar to CTE of large array WLCSP
11/25/2014US8895357 Integrated circuit and method of manufacturing the same
11/25/2014US8895356 Chemical vapor deposition apparatus and method of forming semiconductor epitaxial thin film using the same
11/25/2014US8895355 Magnetic trap for cylindrical diamagnetic materials
11/25/2014US8895352 Method to improve nucleation of materials on graphene and carbon nanotubes
11/25/2014US8895351 Method and apparatus of forming a conductive layer
11/25/2014US8895349 Backside illuminated image sensor having capacitor on pixel region
11/25/2014US8895348 Methods of forming a high efficiency solar cell with a localized back surface field
11/25/2014US8895347 Method for fabricating semiconductor layer having textured surface and method for fabricating solar cell
11/25/2014US8895346 Solid-state imaging device, manufacturing method for the same, and imaging apparatus
11/25/2014US8895345 Dicing methods
11/25/2014US8895344 Method of making a low stress cavity package for back side illuminated image sensor
11/25/2014US8895343 High density capacitor integrated into focal plane array processing flow
11/25/2014US8895342 Heterojunction subcells in inverted metamorphic multijunction solar cells
11/25/2014US8895340 Biosensor and system and process for forming
11/25/2014US8895338 Method of fabricating MEMS, NEMS, photonic, micro- and nano-fabricated devices and systems
11/25/2014US8895337 Method of fabricating vertically aligned group III-V nanowires
11/25/2014US8895335 Impurity-induced disorder in III-nitride materials and devices
11/25/2014US8895333 Method for manufacturing semiconductor device with pixel electrode over gate electrode of thin film transistor
11/25/2014US8895332 Light-emitting diode chip with high light extraction and method for manufacturing the same
11/25/2014US8895331 Semiconductor light emitting diode having high efficiency and method of manufacturing the same
11/25/2014US8895328 Fabrication method of light-emitting device
11/25/2014US8895326 Method of attaching wafer to sheet
11/25/2014US8895325 System and method for aligning substrates for multiple implants
11/25/2014US8895322 Method for making semiconductor device having ferroelectric capacitor therein
11/25/2014US8895235 Process for production of photoresist pattern
11/25/2014US8895232 Mask material conversion
11/25/2014US8895231 Patterning process and resist composition
11/25/2014US8895230 Spin-on carbon compositions for lithographic processing
11/25/2014US8894889 Compound semiconductor precursor ink composition, method for forming a chalcogenide semiconductor film, and method for forming a photovoltaic device
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