Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/11/2014US20140363926 Semiconductor device and method for manufacturing the same
12/11/2014US20140363925 Method for Producing a Semiconductor Module by Using an Adhesion Carrier
12/11/2014US20140363924 Stacked multi-die packages with impedance control
12/11/2014US20140363922 Method for creating a 3d stacked multichip module
12/11/2014US20140363921 Thin film transistor, thin film transistor array panel including the same, and method of manufacturing the same
12/11/2014US20140363916 Process box, arrangements and methods for processing coated substrates
12/11/2014US20140363914 Method for fabricating liquid crystal display
12/11/2014US20140363906 Method of testing semiconductor device
12/11/2014US20140363905 Optical Wafer and Die Probe Testing
12/11/2014US20140363904 Method for evaluating silicon single crystal and method for manufacturing silicon single crystal
12/11/2014US20140363903 Substrate treating apparatus and method of treating substrate
12/11/2014US20140363587 Substrate processing apparatus and substrate processing method
12/11/2014US20140363575 Methods for the Deposition Of Manganese-Containing Films Using Diazabutadiene-Based Precursors
12/11/2014US20140363565 Photoresist coating apparatus and methods
12/11/2014US20140363258 Load port unit and efem system
12/11/2014US20140363153 Optical Die Test Interface
12/11/2014US20140362536 Group iii nitride based flip-chip integrated circuit and method for fabricating
12/11/2014US20140361446 Resin-sealed semiconductor device and method of manufacturing the same
12/11/2014US20140361443 Method of manufacturing flip-chip type semiconductor device
12/11/2014US20140361440 Process for producing at least one through-silicon via with improved heat dissipation, and corresponding three-dimensional integrated structure
12/11/2014US20140361439 Packaging substrate and method for manufacturing same
12/11/2014US20140361438 Seal ring structure and method of forming the same
12/11/2014US20140361437 Package substrates and methods of fabricating the same
12/11/2014US20140361436 Semiconductor device manufacturing method, storage medium and semiconductor device
12/11/2014US20140361434 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
12/11/2014US20140361426 Stacked semiconductor package and method for manufacturing the same
12/11/2014US20140361416 Resin-sealed semiconductor device and method of manufacturing resin-sealed semiconductor device
12/11/2014US20140361415 Photoresists and methods for use thereof
12/11/2014US20140361414 Processes And Systems For Laser Crystallization Processing Of Film Regions On A Substrate Utilizing A Line-Type Beam, And Structures Of Such Film Regions
12/11/2014US20140361412 Cavity Structure Using Patterned Sacrificial Layer
12/11/2014US20140361408 Oxygen precipitation in heavily doped silicon wafers sliced from ingots grown by the czochralski method
12/11/2014US20140361407 Silicon material substrate doping method, structure and applications
12/11/2014US20140361400 Electrostatic discharge protection structure and method for forming the same
12/11/2014US20140361399 Stripe structures and fabrication method thereof
12/11/2014US20140361398 Semiconductor device and method of manufacturing same
12/11/2014US20140361385 Method of forming a semiconductor device structure employing fluorine doping and according semiconductor device structure
12/11/2014US20140361384 Metal gate transistor and method for forming the same
12/11/2014US20140361382 Semiconductor devices having compact footprints and related devices, systems, and methods
12/11/2014US20140361381 Multi-metal gate semiconductor device having triple diameter metal opening
12/11/2014US20140361376 Dielectric liner added after contact etch before silicide formation
12/11/2014US20140361375 Fabrication of nickel free silicide for semiconductor contact metallization
12/11/2014US20140361374 High-voltage transistor device and production method
12/11/2014US20140361370 Semiconductor device and method of fabricating the same
12/11/2014US20140361364 Doped protection layer for contact formation
12/11/2014US20140361353 Semiconductor device and method for manufacturing the same
12/11/2014US20140361352 Semiconductor device and fabrication method thereof
12/11/2014US20140361351 Gate electrode with stabilized metal semiconductor alloy-semiconductor stack
12/11/2014US20140361345 Nitride semiconductor wafer, nitride semiconductor element, and method for manufacturing nitride semiconductor wafer
12/11/2014US20140361336 Fin Structure of Semiconductor Device
12/11/2014US20140361335 Device including a transistor having a stressed channel region and method for the formation thereof
12/11/2014US20140361311 GaN Substrate, Semiconductor Device and Method for Fabricating GaN Substrate and Semiconductor Device
12/11/2014US20140361308 Semiconductor device and method of manufacturing the same
12/11/2014US20140361299 Semiconductor device
12/11/2014US20140361298 Lithography process monitoring of local interconnect continuity
12/11/2014US20140361295 Semiconductor device and method for producing same
12/11/2014US20140361280 Organic el device and manufacturing method thereof
12/11/2014US20140361276 Thin film transistor and active matrix organic light emitting diode assembly and method for manufacturing the same
12/11/2014US20140361250 Graphene Transistor
12/11/2014US20140361228 Processes for synthesizing nanocrystals
12/11/2014US20140361197 Workpiece carrier
12/11/2014US20140361183 Electric device, method for manufacturing the same, and radiation inspection apparatus
12/11/2014US20140361102 Gas supply method for semiconductor manufacturing apparatus, gas supply system, and semiconductor manufacturing apparatus
12/11/2014US20140360977 Methods and apparatus for in situ substrate temperature monitoring by electromagnetic radiation emission
12/11/2014US20140360915 Wafer container with recessed latch
12/11/2014US20140360851 Electrically Controllable Integrated Switch
12/11/2014US20140360671 Apparatus for separating wafer from carrier
12/11/2014US20140360566 Method of making photovoltaic devices incorporating improved pnictide semiconductor films using metallization/annealing/removal techniques
12/11/2014US20140360539 Edge bead removal apparatus and methods
12/11/2014US20140360536 Substrate processing apparatus, substrate processing method and computer-readable storage medium recording therein substrate processing program
12/11/2014US20140360531 Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication
12/11/2014US20140360427 Method for producing the growth of a semiconductor material
12/11/2014US20140360426 Method for Producing a Group III Nitride Semiconductor Crystal and Method for Producing a GaN Substrate
12/11/2014US20140360041 Substrate treating apparatus
12/11/2014US20140359996 Laminate peripheral clamping to control microelectronic module bsm warpage
12/11/2014US20140359995 Constrained die adhesion cure process
12/10/2014CN204011463U 用于放置led芯片的治具 For placement led chip fixture
12/10/2014CN204011462U 用于制备led的退火炉管腔体 Annealing furnace for the preparation of the body lumen led the
12/10/2014CN204011459U 一种硅片的轻便洁净周转箱 Clean lightweight silicon wafers Crate
12/10/2014CN204011428U 一种高灵敏度图像传感器像素结构 A high-sensitivity image sensor pixel structure
12/10/2014CN204011424U 半导体组件 Semiconductor Components
12/10/2014CN204011422U 一种阵列基板及显示装置 One kind of array substrate and a display device
12/10/2014CN204011420U 集成电路mcm-3d封装结构 IC mcm-3d package
12/10/2014CN204011401U 高效散热器具 Efficient radiator with
12/10/2014CN204011397U 电容式的指纹传感器封装结构 Capacitive fingerprint sensor package structure
12/10/2014CN204011396U 一种新型PoP堆叠封装结构 A new PoP stacked package structure
12/10/2014CN204011395U 一种双面半导体器件的qfn封装结构 Qfn package structure of a semiconductor device, double-sided
12/10/2014CN204011389U 一种真空吸笔 A vacuum suction pen
12/10/2014CN204011388U 一种半导体晶圆定向系统 A semiconductor wafer orientation system
12/10/2014CN204011387U 一种硅片镀膜用的石墨舟以及舟钩 A silicon wafer coated with a graphite boat and the boat hook
12/10/2014CN204011386U 晶圆盒 Cassettes
12/10/2014CN204011385U 晶片承架 Chip rack
12/10/2014CN204011384U 晶圆收纳盒 Wafer storage box
12/10/2014CN204011383U 一种清理工具 A method of cleaning tool
12/10/2014CN204011382U 一种晶圆碰撞监测系统 One kind of wafer collision monitoring system
12/10/2014CN204011381U 一种组合冷凝板及刻蚀设备 A condensing combination plate and etching equipment
12/10/2014CN204011380U 一种自动切筋系统可调节送料装置 An automatic cut tendons system adjustable feeding device
12/10/2014CN204011379U 全自动分片装置 Automatic slicing device
12/10/2014CN204011378U 一种摇臂式硅片蚀刻装置 One kind of rocker silicon etching device
12/10/2014CN204011377U 一种硅片开沟装置 Ditching device silicon wafers
12/10/2014CN204011376U 基片处理的控制设备 The control device of the substrate processing
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