Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/10/2014CN102867775B 深沟槽的填充方法 The method of filling the deep trench
12/10/2014CN102867761B 一种动态互补晶圆的缺陷扫描方法及系统 A dynamic complementary wafer defect scanning method and system
12/10/2014CN102856450B 一种GaN基发光二极管及其制造方法 Making a GaN-based light emitting diode and its manufacturing method
12/10/2014CN102856449B 一种GaN基半导体发光二极管及其制造方法 Making a GaN-based semiconductor light-emitting diode and its manufacturing method
12/10/2014CN102856213B 一种基于ltcc基板薄膜多层布线制作方法 A thin-film multilayer wiring substrate ltcc based approach
12/10/2014CN102843858B 用于固设一半导体芯片的线路基板及其制造方法 Circuit substrate is fixedly arranged and a semiconductor chip manufacturing method for
12/10/2014CN102825541B 晶圆减薄方法 Wafer thinning method
12/10/2014CN102822391B 用于含铜和钛的金属层的蚀刻液组合物 Etchant composition for a metal layer of copper and titanium
12/10/2014CN102812373B 半导体装置、检测方法 Semiconductor device, the detection method
12/10/2014CN102800696B 半导体元件及其制造方法 Semiconductor device and manufacturing method
12/10/2014CN102800678B 场边次位线反或nor快闪阵列以及其制造工艺方法 Sidelines of the second bit line or nor anti-flash arrays and its manufacturing process for
12/10/2014CN102800588B 一种绝缘栅双极型晶体管的制造方法 A method of manufacturing an insulated gate bipolar transistor
12/10/2014CN102791426B 用线锯切断工件的切断方法以及线锯 Cutting a workpiece with a wire saw and wire saw cutting method
12/10/2014CN102790056B 阵列基板及其制作方法、goa单元制作方法及显示装置 Array substrate and production methods, goa unit and display device manufacturing method
12/10/2014CN102790051B 阵列基板及其制备方法、显示装置 Array substrate and its preparation method, the display device
12/10/2014CN102768993B 一种应力记忆技术的nmos器件制作方法 One kind of stress memorization technique nmos device fabrication method
12/10/2014CN102760773B Nvm器件及其制造方法 Nvm device and manufacturing method thereof
12/10/2014CN102741988B 图案形成用树脂组合物、图案形成方法及发光元件的制造方法 Pattern forming method and a method of manufacturing the light emitting element is formed of a resin composition, a pattern
12/10/2014CN102738211B 在mosfet器件中集成肖特基的方法和结构 Integrated Schottky in mosfet devices methods and structures
12/10/2014CN102738207B 超级结器件的终端保护结构及制造方法 Terminal protection structure and method of manufacture super-junction devices
12/10/2014CN102738115B 集成电路器件及其制造方法 Integrated circuit device and manufacturing method thereof
12/10/2014CN102725840B 复合型半导体装置 Compound semiconductor device
12/10/2014CN102725837B 半导体晶片收纳容器 The semiconductor wafer storage container
12/10/2014CN102723369B 一种具有低导通压降的PiN二极管 With a low voltage drop of the PiN diode
12/10/2014CN102719887B 一种基于氮化镓衬底的高质量氮化镓外延薄膜的生长方法 Based on high-quality gallium nitride substrate of GaN epitaxial films grown
12/10/2014CN102709312B 一种氧化物薄膜、薄膜晶体管及其制备方法 An oxide thin film, a thin film transistor and its preparation method
12/10/2014CN102709242B 显示装置的制造方法 A display device manufacturing method
12/10/2014CN102709215B 太阳能组件排版机 Solar modules typesetting machine
12/10/2014CN102683394B 一种增强型器件及其制造方法 An enhanced device and manufacturing method thereof
12/10/2014CN102683311B 晶片封装体及其形成方法 Chip package and method of forming
12/10/2014CN102683224B 一种制备双层隔离混合晶向应变硅纳米线cmos方法 A double isolation to prepare a mixed crystal strained silicon nanowires cmos method
12/10/2014CN102683203B 一种制作内建应力硅纳米线的方法 A built-in stress method of making silicon nanowires
12/10/2014CN102683202B 一种制作内建应力硅纳米线、以及制作半导体的方法 A method of making a built-stress silicon nanowires, as well as a method for fabricating a semiconductor
12/10/2014CN102683176B 一种提高金属-绝缘体-金属电容器可靠性的方法及其工艺结构 A way to improve the metal - insulator - metal capacitor structure and process reliability methods
12/10/2014CN102668062B 半导体器件 Semiconductor devices
12/10/2014CN102668046B 半导体元件基板 Semiconductor device substrate
12/10/2014CN102655144B 一种tft阵列基板及其制造方法和液晶显示器 One kind tft array substrate and manufacturing method and a liquid crystal display
12/10/2014CN102655093B 厚绝缘膜的工艺实现方法 Process to achieve a thickness of the insulating film Method
12/10/2014CN102651370B 一种tft阵列基板、制造方法及显示装置 One kind tft array substrate, and a method of manufacturing a display device
12/10/2014CN102651334B 半导体装置及用于制造半导体装置的方法 The method of manufacturing a semiconductor device and a semiconductor device for
12/10/2014CN102651303B 基板温度管控系统及方法 The substrate temperature control system and method
12/10/2014CN102648265B Cmp浆料组合物及抛光方法 Cmp slurry composition and polishing method
12/10/2014CN102646703B 单晶InP基化合物半导体材料薄膜的外延结构 Single-crystal InP epitaxial structure-based compound semiconductor material films
12/10/2014CN102646699B 一种氧化物薄膜晶体管及其制备方法 An oxide thin film transistor and its preparation method
12/10/2014CN102646597B 基于体硅的三维阵列式后栅型SiNWFET制备方法 After a three-dimensional grid array SiNWFET bulk silicon-based preparation
12/10/2014CN102642253B 一种硅片切边方法及其装置 Method and apparatus for trimming silicon wafers
12/10/2014CN102638944B 电路连接用粘接薄膜、连接结构体以及其制造方法 Circuit-connecting adhesive film, the connection structure and a manufacturing method
12/10/2014CN102637740B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/10/2014CN102637632B 一种薄膜晶体管阵列的制作方法和薄膜晶体管阵列 A method of manufacturing a thin film transistor array and a thin film transistor array
12/10/2014CN102637610B 用于在载体上安装半导体芯片的方法 Mounting a semiconductor chip on a support method for
12/10/2014CN102629601B 粘接的晶圆片堆叠和电镀粘接的晶圆片堆叠的方法 Wafers stacked wafer bonding method stacking and bonding plating
12/10/2014CN102623340B 沟槽型双层栅mos器件的制备方法 Preparation trench type double gate mos devices
12/10/2014CN102623324B 半导体的电化学蚀刻 Electrochemical etching semiconductors
12/10/2014CN102610568B 为沟槽mos和sgt制备沟槽多晶硅静电放电 Mos and sgt preparation for trench trench polysilicon electrostatic discharge
12/10/2014CN102598245B 同轴硅通孔 Coaxial silicon vias
12/10/2014CN102593181B 基于soi衬底的高压金属氧化物半导体管及制造方法 Soi-based high-pressure metal-oxide semiconductor substrate and manufacturing method
12/10/2014CN102593118B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/10/2014CN102593040B Locos多层氧化层的集成制作方法 The method of making a multilayer integrated oxidized layer Locos
12/10/2014CN102593039B 基于AlN埋绝缘层的机械致单轴应变GeOI晶圆的制作方法 Based on the buried insulating layer of AlN mechanical actuator uniaxial strain GeOI wafer production method
12/10/2014CN102593012B 半导体装置的制造方法 The method of manufacturing a semiconductor device
12/10/2014CN102592968B 一种多层金属-氮化硅-金属电容的制造方法 A multi-layer metal - nitride - metal capacitor manufacturing method
12/10/2014CN102585516B 用于形成硅基绝缘层的组合物及其制造方法、硅基绝缘层及其制造方法 The composition and manufacturing method for forming a silicon insulating layer, the silicon insulating layer and its manufacturing method
12/10/2014CN102576663B 在图案化基材上藉由氢化物气相外延法(hvpe)形成三族氮化物结晶膜的方法 On the patterned substrate by hydride vapor phase epitaxy (hvpe) Method-III nitride crystals formed film
12/10/2014CN102569370B BiCMOS工艺中垂直寄生型PNP器件及制造方法 BiCMOS process type vertical parasitic PNP device and manufacturing method
12/10/2014CN102569198B 藉由氮化物硬掩膜层及氧化物掩膜形成信道半导体合金 Channel semiconductor alloy by the nitride hard mask layer and the oxide mask is formed
12/10/2014CN102569163B 一种基于AlN埋绝缘层的晶圆级单轴应变SOI晶圆的制作方法 A buried insulating layer based on AlN wafer-level method of manufacturing SOI wafers uniaxial strain of
12/10/2014CN102569150B 一种易清洗的薄壁盘状物夹持装置及方法 One kind of easy to clean thin plate-like clamping device and method
12/10/2014CN102569099B 一种倒装芯片的封装方法 A flip-chip packaging method
12/10/2014CN102569079B 具有自对准金属硅化工艺的双栅ldmos的制备方法 Preparation has self-aligned metal silicide process of dual-gate ldmos
12/10/2014CN102554462B 激光加工方法 The laser processing method
12/10/2014CN102548868B 基于衬里的存储系统和将流体材料输送给半导体工艺的方法 The storage system and method for lining fluid material delivered to the semiconductor process based
12/10/2014CN102543927B 嵌埋穿孔中介层的封装基板及其制造方法 Embedded perforated package substrate and a manufacturing method of the interposer
12/10/2014CN102543862B 产生多核心晶片的光罩组改良 Produce mask group improved multi-core chip
12/10/2014CN102543828B 一种soi硅片的制备方法 Method for preparing silicon soi
12/10/2014CN102543765B 一种贴片元器件焊盘设计方法、焊盘结构及印刷电路板 A patch components pad design methods, and printed circuit board pad structure
12/10/2014CN102543719B 基于机械弯曲台的AlN埋绝缘层上单轴应变SGOI晶圆的制作方法 AlN-based mechanical bending station uniaxial strain on the buried insulating layer of wafer fabrication method SGOI
12/10/2014CN102528950B 一种划片机物料传输系统的调试装置 A debugging device machine materials transmission system planning
12/10/2014CN102522393B 封装器件及封装多个集成电路的组件 Packaged device assembly and packaging a plurality of integrated circuits
12/10/2014CN102513695B 激光加工方法 The laser processing method
12/10/2014CN102505145B 石墨预热片、半导体预热装置、硅芯炉及磷检炉 Preheat the graphite sheet, preheat the semiconductor device, silicon core furnace and phosphorus furnace inspection
12/10/2014CN102498561B 半导体装置的制造方法 The method of manufacturing a semiconductor device
12/10/2014CN102484938B 等离子体光源 Plasma light source
12/10/2014CN102484084B 使用设计和缺陷数据的扫描仪性能比较和匹配 Use design and defect data scanner performance comparison and matching
12/10/2014CN102484070B 用于铝-硅氮化物的化学气相沉积处理 For aluminum - chemical vapor deposition process of the silicon nitride
12/10/2014CN102479807B 碳化硅半导体装置及其制造方法 Silicon carbide semiconductor device and manufacturing method thereof
12/10/2014CN102479686B 处理基板的方法 A substrate processing method
12/10/2014CN102473681B 形成电容器的方法 The method of forming a capacitor
12/10/2014CN102473614B 硅晶片的热处理方法 The method of heat treatment of the silicon wafer
12/10/2014CN102473610B 基板加工设备及用于选择性地插入扩散板的基板加工方法 Substrate processing equipment and means for selectively inserting the substrate processing method of the diffuser plate
12/10/2014CN102473591B 互连封装结构及制造和使用该互连封装结构的方法 Interconnect package structure and method of making and using the interconnect package structure
12/10/2014CN102468300B 后段制程平面电阻器及其形成方法 BEOL planar resistor and method of forming
12/10/2014CN102459717B 用于电镀的方法及设备 The method and apparatus for electroplating
12/10/2014CN102455555B Tft-lcd及其驱动方法和阵列基板制造方法 Tft-lcd and driving method and array substrate manufacturing method
12/10/2014CN102449016B 用于电光显示器的粘结剂和粘合剂 Binders for electro-optic displays, and a binder
12/10/2014CN102446979B Pin二极管及其制造方法 Pin diode and its manufacturing method
12/10/2014CN102446849B 一种形成厚金属的单大马士革方法 A thick metal method of forming a single-Damascus
12/10/2014CN102441843B 一种cmp机台内置清洗结构及方法 One kind of built-in washing machine cmp structure and method
12/10/2014CN102439712B 热电偶及温度测量系统 Thermocouples and temperature measurement system
12/10/2014CN102437085B 机械致单轴应变soi晶圆的制作方法 Mechanically induced uniaxial strain soi wafer fabrication method
12/10/2014CN102436095B 透射式硅基液晶显示器的制作方法 Production methods silicon transmissive LCD
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