Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/16/2014US8912619 Ultra-violet light sensing device and manufacturing method thereof
12/16/2014US8912614 Magnetic tunnel junction devices having magnetic layers formed on composite, obliquely deposited seed layers
12/16/2014US8912611 Semiconductor device having a high-K gate dielectric layer
12/16/2014US8912610 Structure and method for MOSFETS with high-K and metal gate structure
12/16/2014US8912607 Replacement metal gate structures providing independent control on work function and gate leakage current
12/16/2014US8912606 Integrated circuits having protruding source and drain regions and methods for forming integrated circuits
12/16/2014US8912601 Double diffused drain metal oxide semiconductor device and manufacturing method thereof
12/16/2014US8912597 Semiconductor device including asymmetric lightly doped drain (LDD) region, related method and design structure
12/16/2014US8912595 Trench MOS structure and method for forming the same
12/16/2014US8912590 Semiconductor device including monos-type memory cell
12/16/2014US8912585 Semiconductor memory device and method of forming the same
12/16/2014US8912575 Semiconductor memory device and method of fabricating the same
12/16/2014US8912574 Device isolation with improved thermal conductivity
12/16/2014US8912573 Semiconductor device containing HEMT and MISFET and method of forming the same
12/16/2014US8912571 Compound semiconductor device including first film on compound semiconductor layer and second film on first film and method of manufacturing the same
12/16/2014US8912568 Semiconductor device and manufacturing method thereof
12/16/2014US8912565 Light emitting diode and method for manufacturing the same
12/16/2014US8912563 Nitride semiconductor light-emitting device
12/16/2014US8912557 Light emitting diode having N-face GaN with roughened surface
12/16/2014US8912556 Light emitting device and method of manufacturing the same
12/16/2014US8912549 Optical device and method of making
12/16/2014US8912548 Organic light-emitting diode comprising amine-based compounds and anthracene-based compounds
12/16/2014US8912546 Thin film transistor and display device
12/16/2014US8912545 Nanowires, nanowire fielde-effect transistors and fabrication method
12/16/2014US8912540 Semiconductor device
12/16/2014US8912538 Thin film transistor array substrate and method for manufacturing the same
12/16/2014US8912535 Naphthalene-diimide-heterocycle-naphthalene diimide oligomers as organic semiconductors and transistors therefrom
12/16/2014US8912529 Selective emitter photovoltaic device
12/16/2014US8912528 Method for forming a cleaved facet of semiconductor device
12/16/2014US8912522 Nanodevice arrays for electrical energy storage, capture and management and method for their formation
12/16/2014US8912490 Method for preparing samples for imaging
12/16/2014US8912464 Hole forming method and laser processing apparatus
12/16/2014US8912449 Thermal warp compensation IC package
12/16/2014US8912433 Lattice matchable alloy for solar cells
12/16/2014US8912424 Multi-junction photovoltaic device and fabrication method
12/16/2014US8912238 Compositions comprising supercritical carbon dioxide and metallic compounds
12/16/2014US8912134 Method of cleaning copper material surfaces in ultra large scale integrated circuits after polishing the same
12/16/2014US8912104 Method for fabricating integrated circuits with patterned thermal adjustment layers for design optimization
12/16/2014US8912103 Method of fabricating and correcting nanoimprint lithography templates
12/16/2014US8912102 Laser annealing
12/16/2014US8912101 Method for forming Si-containing film using two precursors by ALD
12/16/2014US8912100 Manufacturing method of complementary metal oxide semiconductor
12/16/2014US8912099 Method of manufacturing semiconductor device
12/16/2014US8912098 Self-aligned carbon electronics with embedded gate electrode
12/16/2014US8912097 Method and system for patterning a substrate
12/16/2014US8912096 Methods for precleaning a substrate prior to metal silicide fabrication process
12/16/2014US8912095 Polishing method, polishing apparatus and polishing tool
12/16/2014US8912094 Method for manufacturing stretchable thin film transistor
12/16/2014US8912093 Die seal layout for VFTL dual damascene in a semiconductor device
12/16/2014US8912092 Method of forming semiconductor device with a contact plug formed by chemical mechanical polishing
12/16/2014US8912091 Backside metal ground plane with improved metal adhesion and design structures
12/16/2014US8912090 Mixer fabrication technique and system using the same
12/16/2014US8912089 Method for manufacturing a semiconductor device including a stacked body comprising pluralities of first and second metallic conductive layers
12/16/2014US8912088 Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate
12/16/2014US8912087 Method of fabricating a chip package
12/16/2014US8912086 Method for manufacturing transparent electrode using print-based metal wire and transparent electrode manufactured thereby
12/16/2014US8912085 Method and apparatus for adjusting threshold voltage in a replacement metal gate integration
12/16/2014US8912084 Semiconductor device
12/16/2014US8912083 Silicon substrates with doped surface contacts formed from doped silicon inks and corresponding processes
12/16/2014US8912082 Implant alignment through a mask
12/16/2014US8912081 Stiffening layers for the relaxation of strained layers
12/16/2014US8912080 Manufacturing method of the semiconductor device
12/16/2014US8912079 Compound semiconductor deposition method and apparatus
12/16/2014US8912078 Dicing wafers having solder bumps on wafer backside
12/16/2014US8912077 Hybrid laser and plasma etch wafer dicing using substrate carrier
12/16/2014US8912075 Wafer edge warp supression for thin wafer supported by tape frame
12/16/2014US8912074 Method of forming shallow trench isolations
12/16/2014US8912073 Method of manufacturing semiconductor device
12/16/2014US8912071 Selective emitter photovoltaic device
12/16/2014US8912069 Semiconductor device with STI and method for manufacturing the semiconductor device
12/16/2014US8912068 Semiconductor device with strained channel and method of fabricating the same
12/16/2014US8912067 Method for manufacturing MOS transistors with different types of gate stacks
12/16/2014US8912066 Lateral double-diffused high voltage device
12/16/2014US8912065 Method of fabricating semiconductor device
12/16/2014US8912064 Method for forming impurity region of vertical transistor and method for fabricating vertical transistor using the same
12/16/2014US8912063 Semiconductor device having blocking pattern and method for fabricating the same
12/16/2014US8912062 Semiconductor storage device and method of manufacturing same
12/16/2014US8912061 Floating gate device with oxygen scavenging element
12/16/2014US8912060 Method for manufacturing semiconductor device and apparatus for manufacturing same
12/16/2014US8912059 Middle of-line borderless contact structure and method of forming
12/16/2014US8912058 Method of forming a thin film transistor using a gray-scale photoresist
12/16/2014US8912057 Fabrication of nickel free silicide for semiconductor contact metallization
12/16/2014US8912056 Dual epitaxial integration for FinFETS
12/16/2014US8912055 Method for manufacturing a hybrid MOSFET device and hybrid MOSFET obtainable thereby
12/16/2014US8912054 Thin-film semiconductor device and method of manufacturing the same
12/16/2014US8912053 Non-volatile memory device and method for fabricating the same
12/16/2014US8912052 Semiconductor device and structure
12/16/2014US8912051 Method for controlling molding compound geometry around a semiconductor die
12/16/2014US8912050 Capping coating for 3D integration applications
12/16/2014US8912049 PEC biasing technique for LEDs
12/16/2014US8912048 Method of fabricating semiconductor device including a substrate attached to a carrier
12/16/2014US8912047 Method for producing a metal layer on a substrate and device
12/16/2014US8912046 Integrated circuit packaging system with lead frame and method of manufacture thereof
12/16/2014US8912045 Three dimensional flip chip system and method
12/16/2014US8912044 Method for bonding semiconductor substrates and devices obtained thereof
12/16/2014US8912043 Dual-side interconnected CMOS for stacked integrated circuits
12/16/2014US8912042 Manufacturing method for layered chip packages
12/16/2014US8912041 Method for forming recess-free interconnect structure
12/16/2014US8912040 Method for manufacturing semiconductor device
12/16/2014US8912039 Semiconductor device and manufacturing method thereof
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