Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2014
11/20/2014US20140342498 Semiconductor device and method for manufacturing the same
11/20/2014US20140342489 Method of manufacturing silicon-containing film and method of manufacturing photovoltaic device
11/20/2014US20140342481 Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
11/20/2014US20140342479 Method and system for template assisted wafer bonding using pedestals
11/20/2014US20140342477 Method of monitoring semiconductor fabrication process using xps
11/20/2014US20140342476 Land grid array semiconductor device packages
11/20/2014US20140342475 Semiconductor test method and semiconductor test apparatus
11/20/2014US20140342474 Temperature detecting apparatus, substrate processing apparatus and method of manufacturing semiconductor device
11/20/2014US20140342473 Semiconductor processing method
11/20/2014US20140342472 Substrate Processing Based On Resistivity Measurements
11/20/2014US20140342471 Variable Doping Of Solar Cells
11/20/2014US20140342292 Di-t-butoxydiacetoxysilane-based silsesquioxane resins as hard-mask antireflective coating material and method of making
11/20/2014US20140342167 Silicon-rich antireflective coating materials and method of making same
11/20/2014US20140341700 System and method for quick-swap of multiple substrates
11/20/2014US20140341682 Substrate processing module and substrate processing apparatus including the same
11/20/2014US20140341681 Substrate processing apparatus, storage device, and method of transporting substrate storing container
11/20/2014US20140341679 Elevator-based tool loading and buffering system
11/20/2014US20140341003 LED Light Means with Timepiece
11/20/2014US20140340813 Ac-driven electrostatic chuck
11/20/2014US20140339713 Semiconductor device manufacturing method and semiconductor device
11/20/2014US20140339711 Semiconductor device, method of positioning semiconductor device, and positioning apparatus for semiconductor device
11/20/2014US20140339706 Integrated circuit package with an interposer formed from a reusable carrier substrate
11/20/2014US20140339705 Iintegrated circuit package using silicon-on-oxide interposer substrate with through-silicon vias
11/20/2014US20140339702 Metal pvd-free conducting structures
11/20/2014US20140339700 Graphene-based metal diffusion barrier
11/20/2014US20140339699 Under ball metallurgy (ubm) for improved electromigration
11/20/2014US20140339698 Semiconductor device with through-substrate via covered by a solder ball and related method of production
11/20/2014US20140339696 Interconnect Structure for Wafer Level Package
11/20/2014US20140339694 Semiconductor Devices Having a Glass Substrate, and Method for Manufacturing Thereof
11/20/2014US20140339686 Group III-V Device with a Selectively Modified Impurity Concentration
11/20/2014US20140339685 Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device
11/20/2014US20140339684 Synthetic diamond coated compound semiconductor substrates
11/20/2014US20140339683 Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die
11/20/2014US20140339682 Semiconductor device and method for manufacturing semiconductor device
11/20/2014US20140339681 Method for fabricating a composite structure to be separated by exfoliation
11/20/2014US20140339680 III-V Device and Method for Manufacturing Thereof
11/20/2014US20140339676 Semiconductor device and method of forming the same
11/20/2014US20140339675 Polysilicon fuse, manufacturing method thereof, and semiconductor device including polysilicon fuse
11/20/2014US20140339673 Wafer processing
11/20/2014US20140339672 Wafer die separation
11/20/2014US20140339671 Method to form stepped dielectric for field plate formation
11/20/2014US20140339670 Semiconductor Device with a Thick Bottom Field Plate Trench Having a Single Dielectric and Angled Sidewalls
11/20/2014US20140339669 Semiconductor Device with a Field Plate Trench Having a Thick Bottom Dielectric
11/20/2014US20140339647 Densely packed standard cells for integrated circuit products, and methods of making same
11/20/2014US20140339646 Non-planar transitor fin fabrication
11/20/2014US20140339645 Methods of forming semiconductor devices with different insulation thicknesses on the same semiconductor substrate and the resulting devices
11/20/2014US20140339643 Finfet structures having silicon germanium and silicon fins
11/20/2014US20140339642 Reduction of oxide recesses for gate height control
11/20/2014US20140339639 Multi-direction wiring for replacement gate lines
11/20/2014US20140339638 Integrating channel sige into pfet structures
11/20/2014US20140339637 Method of forming semiconductor device
11/20/2014US20140339613 Semiconductor device and method of manufacturing same
11/20/2014US20140339612 Using sacrificial oxide layer for gate length tuning and resulting device
11/20/2014US20140339609 Transistor performance using a two-step damage anneal
11/20/2014US20140339605 Group III-V Device with a Selectively Reduced Impurity Concentration
11/20/2014US20140339564 Peeling method and method for manufacturing display device using the peeling method
11/20/2014US20140339559 Semiconductor device having test structure
11/20/2014US20140339558 Alternating open-ended via chains for testing via formation and dielectric integrity
11/20/2014US20140339550 Laminated structure, ferroelectric gate thin film transistor, and ferroelectric thin film capacitor
11/20/2014US20140339545 Semiconductor device, method for manufacturing the same, and apparatus for manufacturing semiconductor device
11/20/2014US20140339536 Tft with insert in passivation layer or etch stop layer
11/20/2014US20140339215 Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus
11/20/2014US20140339074 Wafer clamp assembly for holding a wafer during a deposition process
11/20/2014US20140339073 Sputtering Target and Oxide Semiconductor Film
11/20/2014US20140338956 Semiconductor device package and method of manufacture
11/20/2014US20140338834 Magnesium aluminate-based sintered body and semiconductor manufacturing apparatus member
11/20/2014US20140338828 Substrate separation apparatus and method
11/20/2014US20140338827 Substrate Removal from a Carrier
11/20/2014US20140338744 Process For Texturing The Surface Of A Silicon Substrate, Structured Substrate And Photovoltaic Device Comprising Such A Structured Substrate
11/20/2014US20140338706 Liquid processing method, liquid processing device, and storage medium
11/20/2014US20140338596 Self-centering susceptor ring assembly
11/20/2014US20140338589 Semiconductor Heterostructures Having Reduced Dislocation Pile-Ups and Related Methods
11/20/2014US20140338288 Load port device
11/20/2014US20140338189 Interconnection structure made of redirected carbon nanotubes
11/18/2014US8892568 Building a library of spectra for optical monitoring
11/18/2014US8892278 Overhead rail guided transport system and implementation method thereof
11/18/2014US8892248 Manipulator auto-teach and position correction system
11/18/2014US8892242 Robot system
11/18/2014US8892237 Systems and methods for fabricating semiconductor device structures using different metrology tools
11/18/2014US8891948 Heat treatment apparatus and heat treatment method for heating substrate by irradiating substrate with flashes of light
11/18/2014US8891573 6.1 angstrom III-V and II-VI semiconductor platform
11/18/2014US8891316 Nonvolatile memory devices including notched word lines
11/18/2014US8891299 MOSFET having memory characteristics
11/18/2014US8891284 Memristors based on mixed-metal-valence compounds
11/18/2014US8891240 Apparatus and method for cooling a semiconductor device
11/18/2014US8891227 Process of forming dielectric thin film and thin film capacitor having said dielectric thin film
11/18/2014US8891170 Laser irradiation apparatus and manufacturing method of semiconductor device
11/18/2014US8891159 Optical semiconductor element, semiconductor laser, and method of manufacturing optical semiconductor element
11/18/2014US8891079 Wafer inspection
11/18/2014US8891064 Moving body apparatus and exposure apparatus
11/18/2014US8890560 Crack sensors for semiconductor devices
11/18/2014US8890551 Test key structure and method for measuring step height by such test key structure
11/18/2014US8890533 Apparatus for inspecting light emitting diode package and inspecting method using the same
11/18/2014US8890339 Self-defining, low capacitance wire bond pad
11/18/2014US8890336 Cylindrical bonding structure and method of manufacture
11/18/2014US8890334 Semiconductor device, a mobile communication device, and a method for manufacturing a semiconductor device
11/18/2014US8890329 Semiconductor device
11/18/2014US8890328 Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers
11/18/2014US8890327 Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
11/18/2014US8890324 Semiconductor structure having a through substrate via (TSV) and method for forming
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