Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/04/2014US20140357050 Method of forming isolating structure and through silicon via
12/04/2014US20140357049 Semiconductor Structures and Methods with High Mobility and High Energy Bandgap Materials
12/04/2014US20140357048 Method for Producing a Semiconductor Component
12/04/2014US20140357045 eFUSE AND METHOD OF FABRICATION
12/04/2014US20140357043 Lateral bipolar transistors having partially-depleted intrinsic base
12/04/2014US20140357042 Spacer stress relaxation
12/04/2014US20140357041 Method of forming strained source and drain regions in a p-type finfet structure
12/04/2014US20140357040 Method of making a semiconductor device using spacers for source/drain confinement
12/04/2014US20140357039 Method for the formation of a protective dual liner for a shallow trench isolation structure
12/04/2014US20140357038 Through silicon via processing method for lateral double-diffused mosfets
12/04/2014US20140357037 Finfet with enhanced embedded stressor
12/04/2014US20140357035 Semiconductor device and method of manufacturing the same
12/04/2014US20140357034 Multi-height finfets with coplanar topography
12/04/2014US20140357033 Method for fabricating a metal high-k gate stack for a buried recessed access device
12/04/2014US20140357032 Nonvolatile semiconductor memory device and method for manufacturing the same
12/04/2014US20140357031 Nonvolatile memory device and method for fabricating the same
12/04/2014US20140357030 Fabrication of mos device with schottky barrier controlling layer
12/04/2014US20140357029 Method of making a semiconductor device using sacrificial fins
12/04/2014US20140357028 Methods for fabricating integrated circuits with the implantation of fluorine
12/04/2014US20140357027 Method for manufacturing semiconductor device
12/04/2014US20140357026 Production method for semiconductor device
12/04/2014US20140357025 Semiconductor device and method of manufacturing semiconductor device
12/04/2014US20140357023 Semiconductor device package with cap element
12/04/2014US20140357022 A qfn with wettable flank
12/04/2014US20140356989 Method of manufacturing mems devices with reliable hermetic seal
12/04/2014US20140356988 Mechanical Debonding Method and System
12/04/2014US20140356987 Laser beam irradiation apparatus and method of manufacturing organic light-emitting display device by using the same
12/04/2014US20140356986 Precision controlled collapse chip connection mapping
12/04/2014US20140356985 Temperature controlled substrate support assembly
12/04/2014US20140356984 Solid state source introduction of dopants and additives for a plasma doping process
12/04/2014US20140356983 Distorting donor wafer to corresponding distortion of host wafer
12/04/2014US20140356982 Methods for overlay improvement through feed forward correction
12/04/2014US20140356981 Wafer bonding misalignment reduction
12/04/2014US20140356980 Method and process to reduce stress based overlay error
12/04/2014US20140356954 Method for producing different populations of molecules or fine particles with arbitrary distribution forms and distribution densities simultaneously and in quantity, and masking member therefor
12/04/2014US20140356792 Composition for forming tungsten oxide film and method for producing tungsten oxide film using same
12/04/2014US20140356106 Substrate processing apparatus
12/04/2014US20140355170 Electrostatic chuck
12/04/2014US20140355169 Electrostatic chuck device
12/04/2014US20140355168 Micro pick up array with compliant contact
12/04/2014US20140354347 Bipolar transistor, band-gap reference circuit and virtual ground reference circuit
12/04/2014US20140353851 Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device
12/04/2014US20140353850 Semiconductor package and fabrication method thereof
12/04/2014US20140353848 Adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor device
12/04/2014US20140353846 Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant
12/04/2014US20140353845 Semiconductor device and production method therefor
12/04/2014US20140353843 Circuit structures and methods of fabrication with enhanced contact via electrical connection
12/04/2014US20140353841 Method for forming an electrical connection between metal layers
12/04/2014US20140353839 Manganese oxide hard mask for etching dielectric materials
12/04/2014US20140353838 3D Packages and Methods for Forming the Same
12/04/2014US20140353837 Semiconductor device and manufacturing method thereof
12/04/2014US20140353836 Chip arrangements and a method for manufacturing a chip arrangement
12/04/2014US20140353835 Methods of self-forming barrier integration with pore stuffed ulk material
12/04/2014US20140353832 Semiconductor device and manufacturing method thereof
12/04/2014US20140353831 Methods of forming substrate microvias with anchor structures
12/04/2014US20140353829 Semiconductor device having insulating layers containing oxygen and a barrier layer containing manganese
12/04/2014US20140353828 Substrate bonding with diffusion barrier structures
12/04/2014US20140353825 Silicidation Blocking Process Using Optically Sensitive HSQ Resist and Organic Planarizing Layer
12/04/2014US20140353823 Semiconductor package and method of manufacturing the same
12/04/2014US20140353819 Polymer Layers Embedded with Metal Pads for Heat Dissipation
12/04/2014US20140353818 Power module comprising two substrates and method of manufacturing the same
12/04/2014US20140353814 Semiconductor device and method of manufacturing semiconductor device
12/04/2014US20140353810 Semiconductor device and method of manufacturing the same
12/04/2014US20140353805 Methods of semiconductor contaminant removal using supercritical fluid
12/04/2014US20140353804 Method for Producing Group III Nitride Semiconductor and Group III Nitride Semiconductor
12/04/2014US20140353802 Methods for integration of pore stuffing material
12/04/2014US20140353801 Device isolation in finfet cmos
12/04/2014US20140353800 Tone inversion of self-assembled self-aligned structures
12/04/2014US20140353797 Fuse/resistor utilizing interconnect and vias and method of making
12/04/2014US20140353796 Fin eFuse Formed by Trench Silicide Process
12/04/2014US20140353795 Integrated circuits including finfet devices with shallow trench isolation that includes a thermal oxide layer and methods for making the same
12/04/2014US20140353794 Semiconductor arrangement and method of forming
12/04/2014US20140353793 Guarding ring structure of a high voltage device and manufacturing method thereof
12/04/2014US20140353774 Methods for stiction reduction in mems sensors
12/04/2014US20140353771 Semiconductor Dielectric Interface and Gate Stack
12/04/2014US20140353770 Semiconductor device and method for fabricating the same
12/04/2014US20140353767 Method for the formation of fin structures for finfet devices
12/04/2014US20140353765 Double sidewall image transfer process
12/04/2014US20140353761 Multi-orientation semiconductor devices employing directed self-assembly
12/04/2014US20140353760 METHOD TO CO-INTEGRATE SiGe AND Si CHANNELS FOR FINFET DEVICES
12/04/2014US20140353759 Self-Aligned Gate Electrode Diffusion Barriers
12/04/2014US20140353756 Semiconductor device and method of manufacturing the same
12/04/2014US20140353753 Fin field effect transistor device with reduced overlap capacitance and enhanced mechanical stability
12/04/2014US20140353751 Local interconnects by metal-iii-v alloy wiring in semi-insulating iii-v substrates
12/04/2014US20140353742 Semiconductor Device and Method for Producing the Same
12/04/2014US20140353740 Semiconductor device and manufacturing method thereof
12/04/2014US20140353738 Floating gate ultrahigh density vertical nand flash memory and method of making thereof
12/04/2014US20140353734 Semiconductor devices and methods of fabrication with reduced gate and contact resistances
12/04/2014US20140353733 Protection of the gate stack encapsulation
12/04/2014US20140353732 Halo region formation by epitaxial growth
12/04/2014US20140353730 Low gate-to-drain capacitance fully merged finfet
12/04/2014US20140353728 Method and apparatus for a reduced capacitance middle-of-the-line (mol) nitride stack
12/04/2014US20140353727 I/o cell esd system
12/04/2014US20140353724 Semiconductor device and method of manufacturing the same
12/04/2014US20140353715 Finfet device and fabrication method thereof
12/04/2014US20140353710 Method for Producing Optoelectronic Semiconductor Components, Leadframe Assemblage and Optoelectronic Semiconductor Component
12/04/2014US20140353705 Semiconductor light emitting element, method of manufacturing semiconductor light emitting element, semiconductor light emitting device and substrate
12/04/2014US20140353685 Semi-Polar III-Nitride Films and Materials and Method for Making the Same
12/04/2014US20140353684 Silicon carbide epitaxial wafer and method for fabricating the same
12/04/2014US20140353683 Semiconductor device and method of manufacturing the same
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