Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/10/2014CN104201196A 表面无微裂纹的Si基III族氮化物外延片 No surface microcracks Si-based III-nitride epitaxial wafers
12/10/2014CN104201195A 一种无结场效应晶体管及其制备方法 A non-junction field effect transistor and its preparation method
12/10/2014CN104201193A 一种双栅soi器件结构及其制作方法 A dual-gate device structure and fabrication method soi
12/10/2014CN104201186A 平板显示器及其制造方法 Flat panel display and manufacturing method
12/10/2014CN104201181A 一种改良黑电平校准的图像传感器及其制作方法 An improved black level calibration of the image sensor and manufacturing method thereof
12/10/2014CN104201179A 半导体装置 Semiconductor device
12/10/2014CN104201178A 阵列基板及其制备方法、显示装置 Array substrate and its preparation method, the display device
12/10/2014CN104201177A 阵列基板及制作方法、显示装置 Array substrate and manufacturing method, a display device
12/10/2014CN104201176A 3d nand闪存结构及其制作方法 3d nand flash memory structure and production methods
12/10/2014CN104201171A 一种检测缺陷残留的测试结构 A method of detecting residual defect test structure
12/10/2014CN104201168A 一种芯片倾斜堆叠的圆片级封装单元及封装方法 A chip tilt unit stacked wafer level packaging and packaging methods
12/10/2014CN104201166A 低成本tsv转接板及其制造工艺 Adapter board and its low cost manufacturing processes tsv
12/10/2014CN104201165A 一种双环硅通孔结构及其制造方法 A Double Loop silicon vias structure and manufacturing method
12/10/2014CN104201164A 一种三维集成电路组件及其制备方法 A three-dimensional integrated circuit component and its preparation method
12/10/2014CN104201163A 一种基于铝阳极氧化技术的高密度转接板及其制造方法 A high-density patch panel and method of manufacturing technologies based on anodized aluminum
12/10/2014CN104201156A 基于基板的凸点倒装芯片csp封装件、基板及制造方法 Based csp bump flip chip package, the substrate and substrate manufacturing method
12/10/2014CN104201155A 芯片装配工装 Chip assembly tooling
12/10/2014CN104201154A 一种改善Flash产品隔离区域的过刻蚀缺陷的方法 Overetching method of improving the defect Flash product isolation region
12/10/2014CN104201153A 芯片切割方法 Chip cutting method
12/10/2014CN104201152A 制作显示面板的方法 The method of making a display panel
12/10/2014CN104201151A 薄膜晶体管阵列基板及其像素暗点化处理方法 The thin film transistor array substrate and dark pixels attunement approach
12/10/2014CN104201150A 一种用于改善perc电池背部开槽接触的方法 A method for improving battery back slotted contact perc
12/10/2014CN104201149A 一种含氟的多孔低介电常数复合薄膜及其制备方法 Porous low dielectric constant composite film and method for preparing fluorinated
12/10/2014CN104201148A 一种在低k介电层中形成孔隙的方法 A method of forming pores in the low-k dielectric layer
12/10/2014CN104201147A 双浅沟槽隔离的形成方法 The method for forming shallow trench isolation double
12/10/2014CN104201146A 双浅沟槽隔离的形成方法 The method for forming shallow trench isolation double
12/10/2014CN104201145A 半导体生产中关键尺寸的控制方法 Semiconductor manufacturing critical dimension control method
12/10/2014CN104201144A 二极管自动分离搬运系统及其分离搬运方法 Diodes automatic handling systems and separate handling separation method
12/10/2014CN104201143A 一种二极管送料机构 To a diode feeding mechanism
12/10/2014CN104201142A 一种机械手及真空反应设备 A mechanical hand and vacuum response equipment
12/10/2014CN104201141A 研磨垫及晶片清洗方法 Polishing pad and wafer cleaning method
12/10/2014CN104201140A 一种湿法清洗装置 One kind of wet cleaning device
12/10/2014CN104201139A 利于引脚整形质量的ic整脚装置 Conducive to pin plastic quality ic whole foot device
12/10/2014CN104201138A Ic整脚装置 Ic whole foot device
12/10/2014CN104201137A 便于提高引脚整形质量且适用于不同ic的整脚机 Easy to improve the quality and orthopedic pins for different ic whole foot
12/10/2014CN104201136A 适用于不同ic元件的整脚装置 Applies to the whole foot device different components ic
12/10/2014CN104201135A 一种湿法腐蚀装置及其使用方法 One kind of a wet etching apparatus and method of use
12/10/2014CN104201134A 一种二极管整形装置 To a diode-shaping device
12/10/2014CN104201133A 回收和再利用六氟化钨的系统和方法 Recycling and reuse of tungsten hexafluoride, a system and method of
12/10/2014CN104201132A 改善亮场机台缺陷扫描精度的方法 Ways to improve the light-field scanning precision machine defects
12/10/2014CN104201131A 评估多晶硅栅极缺失缺陷的方法 Polysilicon gate missing defect evaluation method
12/10/2014CN104201130A 一种用于缺陷分类的光学检测方法 Optical detection method for defect classification
12/10/2014CN104201129A 一种清洗设备颗粒监控的方法 A cleaning apparatus particle monitoring method
12/10/2014CN104201128A 一种检测图形尺寸对离子阱形貌影响的方法 A method for detecting image size effect on the morphology of the ion trap
12/10/2014CN104201127A 一种半导体激光器阵列连接界面表征方法及装置 A semiconductor laser array connection interface characterization methods and apparatus
12/10/2014CN104201126A 末端射程损伤的检测以及修复方法 Detect and fix the end of the range of damage
12/10/2014CN104201125A 热压产品温度曲线的测量方法 Measurement method for producing hot product temperature curve
12/10/2014CN104201124A 根据图形特征对自动聚焦光强进行补偿的缺陷检测方法 Defect detection method based on graphical features for automatic focusing point to compensate
12/10/2014CN104201123A 一种利用表面微纳米结构的低温固态键合方法 A bonding method using low-temperature solid surface micro nanostructures
12/10/2014CN104201122A 热压焊头水平调节的方法 Hot welding head leveling method
12/10/2014CN104201121A 一种铜柱凸点封装结构的成型方法 A method of forming copper pillar bump package structure
12/10/2014CN104201120A 半导体倒装封装方法 Flip semiconductor packaging method
12/10/2014CN104201119A 倒装芯片封装方法 Flip-chip packaging method
12/10/2014CN104201118A 芯片级封装方法 Chip-level packaging method
12/10/2014CN104201117A 一种采用超声辅助纳米银焊膏烧结制作功率模块的方法 One kind of nano-silver paste using ultrasound-assisted sintering method of making power module
12/10/2014CN104201116A 指纹识别芯片封装方法和封装结构 Fingerprint identification chip encapsulation method and package structure
12/10/2014CN104201115A 晶圆级指纹识别芯片封装结构及封装方法 Wafer-level fingerprint identification chip packaging structure and packaging method
12/10/2014CN104201114A 一种侧壁绝缘保护的芯片封装方法及其封装结构 One kind of sidewall insulation method of chip packaging and packaging structure
12/10/2014CN104201113A 系统级封装的气密性密封结构及其制造方法 Hermetically sealed structure and manufacturing method of the system-in-package
12/10/2014CN104201112A 一种基于水溶液薄膜晶体管的制备方法 A method of preparing an aqueous solution of a thin film transistor-based
12/10/2014CN104201111A 一种氧化物半导体薄膜晶体管的制备方法 Preparation method of an oxide semiconductor thin film transistor
12/10/2014CN104201110A 一种Ⅲ族氮化物半导体材料干法刻蚀后的表面处理方法 A method of surface treatment Ⅲ nitride semiconductor material after dry etching
12/10/2014CN104201109A 一种用于制备等离子氮化栅极介质层的方法 A method of preparing plasma nitridation of a gate dielectric layer for
12/10/2014CN104201108A SiGe源/漏区的制造方法 The method of manufacturing SiGe source / drain regions
12/10/2014CN104201107A 半导体器件及其制备方法 Semiconductor device and method of preparation
12/10/2014CN104201106A 一种薄膜晶体管制作方法、系统及薄膜晶体管 A thin film transistor fabrication method, system, and a thin film transistor
12/10/2014CN104201105A 一种支持晶圆级芯片尺寸封装的半导体器件的制造方法 A method of manufacturing support wafer level chip size package of the semiconductor device
12/10/2014CN104201104A 一种氮化镓基增强型器件的制造方法 A gallium nitride-based enhancement mode device manufacturing method
12/10/2014CN104201103A 沟槽型igbt的制备方法 Preparation of trench igbt
12/10/2014CN104201102A 一种快恢复二极管frd芯片及其制作工艺 Frd in fast recovery diode chip and its manufacturing process
12/10/2014CN104201101A 一种双接触孔刻蚀停止层的制作方法 A dual contact hole etch stop layer manufacturing method
12/10/2014CN104201100A 小尺寸图形的制作方法 Small graphic production methods
12/10/2014CN104201099A 超结器件制备工艺 Preparation of super-junction devices
12/10/2014CN104201098A 栅介质氧化层的制备方法 Preparation gate dielectric oxide layer
12/10/2014CN104201097A 小尺寸图形的制作方法 Small graphic production methods
12/10/2014CN104201096A 一种解离剂、解离工艺、柔性显示器件制备及其制备工艺 One kind of dissociation agent, dissociation process, preparation and preparation of flexible display technology
12/10/2014CN104201095A 一种晶边刻蚀工艺 A crystalline side etching process
12/10/2014CN104201094A 一种重离子微孔膜蚀刻装置 One heavy ion etching device microporous membrane
12/10/2014CN104201093A 湿法清洗工艺设备颗粒监控方法 Wet cleaning process equipment particle monitoring method
12/10/2014CN104199255A 用于eb或euv平版印刷的化学放大负性抗蚀剂组合物和图案化方法 Chemical or euv for lithographic printing eb amplified negative resist composition and patterning method
12/10/2014CN104198386A 一种基于双显示器显示采集多相机图像的方法及装置 Method and apparatus for a dual-display-based multi-camera image acquisition
12/10/2014CN104192835A 一种石墨烯闪存存储器的制备方法 Method for preparing a flash memory of graphene
12/10/2014CN104191094A 高精度晶圆背刻对中系统沟槽对位方法 High-precision wafer alignment method back engraved grooves in the system
12/10/2014CN104190665A 一种中大尺寸蓝宝石晶圆图案化制程黄光涂布前清洗装置及方法 An apparatus and method for cleaning the former large-size sapphire wafers patterned coating system 程黄光
12/10/2014CN103871941B 间歇线性传输装置 Intermittent linear transfer devices
12/10/2014CN103477439B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/10/2014CN103295964B 基于混合晶向soi及沟道应力的器件系统结构及制备方法 Mixed crystal devices based on system configuration and preparation of the soi and channel stress
12/10/2014CN103261358B 用于抛光多晶硅的组合物及方法 Polysilicon polishing compositions and methods for
12/10/2014CN103151312B 一种在cmos源漏注入前进行多晶硅掺杂的方法 A polycrystalline silicon doped source and drain cmos method before implantation
12/10/2014CN103118962B 移载系统 Transfer system
12/10/2014CN103107134B 一种阵列基板及其制作方法、液晶显示装置 One kind of array substrate and its production method, a liquid crystal display device
12/10/2014CN103098199B 电介质薄膜元件、反熔丝元件及电介质薄膜元件的制造方法 The method of manufacturing a dielectric thin film element, the antifuse element and the dielectric thin film element
12/10/2014CN103021936B 一种双极电路的制造方法 A method of manufacturing a bipolar circuit
12/10/2014CN103000577B 电子可编程熔丝器件制作方法 Electrically programmable fuse device fabrication method
12/10/2014CN102956487B 隔离型功率晶体管的制造方法 Manufacturing method isolated power transistor
12/10/2014CN102945830B 一种控制浅沟道绝缘层制程中衬底氧化层的均匀性的方法 A method for uniformly shallow trench insulating layer is an oxide layer of the substrate manufacturing process control
12/10/2014CN102915950B 在半导体器件上同时制作通孔和沟槽的方法 Method on the semiconductor device while making vias and trenches
12/10/2014CN102915911B 一种改善碳化硅台面底部的刻蚀方法 An improvement in the bottom of the mesa etching silicon carbide
12/10/2014CN102912319B 液体材料气化装置 Liquid material vaporizer
12/10/2014CN102876277B 粘接剂组合物和使用该组合物的电路连接膜，以及电路部件的连接方法和电路连接体 The adhesive composition and the circuit-connecting film using the composition, and a circuit member connection method and the circuit-connected body
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