Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2013
01/23/2013CN101447502B Non-volatile memory devices and methods of fabricating and using the same
01/23/2013CN101447477B Light emitting diode package, method for fabricating the same and backlight assembly including the same
01/23/2013CN101413780B Polishing monitoring method and polishing apparatus
01/23/2013CN101373725B Semiconductor chip housing tray
01/23/2013CN101322074B Silicon-containing resist underlying layer film forming composition for formation of photocrosslinking cured resist underlying layer film
01/23/2013CN101295135B Photoresist composition and method of manufacturing a thin-film transistor substrate using the same
01/23/2013CN101285912B Optical waveguide apparatus and method for manufacturing the same
01/23/2013CN101281912B Soi substrate and manufacturing method thereof, and semiconductor device
01/23/2013CN101278404B Transistor element, display device and these manufacturing methods
01/23/2013CN101221976B 有机发光装置及其制造方法 The organic light emitting device and manufacturing method
01/23/2013CN101118333B Method of manufacturing a liquid crystal display apparatus
01/23/2013CN101085543B Light emitting unit, apparatus and method for manufacturing the same, apparatus for moulding lens thereof, and light emitting device package thereof
01/22/2013US8359494 Parallel fault detection
01/22/2013US8358525 Low cost high density rectifier matrix memory
01/22/2013US8358493 Electrostatic chuck, production method of electrostatic chuck and electrostatic chuck device
01/22/2013US8358144 Method for manufacturing semiconductor device, semiconductor inspection device, and program including color imaging of metal silicide
01/22/2013US8358014 Structure and method for power field effect transistor
01/22/2013US8358007 Integrated circuit system employing low-k dielectrics and method of manufacture thereof
01/22/2013US8357999 Assembly having stacked die mounted on substrate
01/22/2013US8357998 Wirebonded semiconductor package
01/22/2013US8357994 Antifuse with a single silicon-rich silicon nitride insulating layer
01/22/2013US8357989 Semiconductor device and method for manufacturing the same
01/22/2013US8357988 Die seal ring
01/22/2013US8357978 Methods of forming semiconductor devices with replacement gate structures
01/22/2013US8357977 Semiconductor device and method for manufacturing same
01/22/2013US8357966 Semiconductor device and method for manufacturing semiconductor device
01/22/2013US8357965 Semiconductor device having multiple storage regions
01/22/2013US8357962 Spin transistor and method of manufacturing the same
01/22/2013US8357952 Power semiconductor structure with field effect rectifier and fabrication method thereof
01/22/2013US8357939 Silicon wafer and production method therefor
01/22/2013US8357935 Electronic component having an authentication pattern
01/22/2013US8357933 Manufacturing method of semiconductor integrated circuit device
01/22/2013US8357927 Semiconductor device and method for manufacturing the same
01/22/2013US8357922 Nanodevice, transistor comprising the nanodevice, method for manufacturing the nanodevice, and method for manufacturing the transistor
01/22/2013US8357620 Laser annealing method and laser annealing apparatus
01/22/2013US8357619 Film formation method for forming silicon-containing insulating film
01/22/2013US8357618 Frequency doubling using a photo-resist template mask
01/22/2013US8357617 Method of patterning a metal gate of semiconductor device
01/22/2013US8357616 Adjustable solubility in sacrificial layers for microfabrication
01/22/2013US8357615 Method of manufacturing semiconductor device
01/22/2013US8357614 Ruthenium-containing precursors for CVD and ALD
01/22/2013US8357613 Methods of fabricating semiconductor devices and semiconductor devices including a contact plug processed by rapid thermal annealing
01/22/2013US8357612 Method for manufacturing semiconductor device and semiconductor device
01/22/2013US8357610 Reducing patterning variability of trenches in metallization layer stacks with a low-k material by reducing contamination of trench dielectrics
01/22/2013US8357609 Dual damascene-like subtractive metal etch scheme
01/22/2013US8357608 Multi component dielectric layer
01/22/2013US8357607 Method for fabricating nitride-based semiconductor device having electrode on m-plane
01/22/2013US8357606 Resist feature and removable spacer pitch doubling patterning method for pillar structures
01/22/2013US8357605 Methods of fabricating semiconductor memory devices
01/22/2013US8357604 Work function adjustment in high-k gate stacks for devices of different threshold voltage
01/22/2013US8357603 Metal gate fill and method of making
01/22/2013US8357602 Compound semiconductor device and method of manufacturing the same
01/22/2013US8357601 Cross-hair cell wordline formation
01/22/2013US8357600 Method for fabricating buried gate using pre landing plugs
01/22/2013US8357599 Seed layer passivation
01/22/2013US8357598 Method for manufacturing antenna and method for manufacturing semiconductor device
01/22/2013US8357597 Process for producing Si(1-v-w-x)CwAlxNv base material, process for producing epitaxial wafer, Si(1-v-w-x)CwAlxNv base material, and epitaxial wafer
01/22/2013US8357596 Method of forming a polycrystalline silicon layer and method of manufacturing thin film transistor
01/22/2013US8357595 Semiconductor substrate with solid phase epitaxial regrowth with reduced depth of doping profile and method of producing same
01/22/2013US8357594 Methods of growing nitride semiconductors and methods of manufacturing nitride semiconductor substrates
01/22/2013US8357593 Methods of removing water from semiconductor substrates and methods of depositing atomic layers using the same
01/22/2013US8357592 Method and apparatus for manufacturing semiconductor substrate dedicated to semiconductor device, and method and apparatus for manufacturing semiconductor device
01/22/2013US8357591 Method of processing a wafer by using and reusing photolithographic masks
01/22/2013US8357590 Method for producing semiconductor wafers composed of silicon having a diameter of at least 450 mm, and semiconductor wafer composed of silicon having a diameter of 450 mm
01/22/2013US8357589 Method of thinning a structure
01/22/2013US8357588 Method for machining a workpiece on a workpiece support
01/22/2013US8357587 Method for routing a chamfered substrate
01/22/2013US8357586 Method for manufacturing SOI wafer
01/22/2013US8357585 Semiconductor device and method of manufacturing the same
01/22/2013US8357584 Metal capacitor design for improved reliability and good electrical connection
01/22/2013US8357583 Method for manufacturing semiconductor device
01/22/2013US8357582 Methods of forming electrical components and memory cells
01/22/2013US8357581 Transistor performance improving method with metal gate
01/22/2013US8357580 Semiconductor device and method of manufacturing semiconductor device
01/22/2013US8357579 Methods of forming integrated circuits
01/22/2013US8357578 Semiconductor device and method for manufacturing the same
01/22/2013US8357577 Manufacturing method of semiconductor device having vertical type transistor
01/22/2013US8357576 Method of manufacturing semiconductor device
01/22/2013US8357575 Technique for exposing a placeholder material in a replacement gate approach by modifying a removal rate of stressed dielectric overlayers
01/22/2013US8357574 Method of fabricating epitaxial structures
01/22/2013US8357573 Strain enhancement in transistors comprising an embedded strain-inducing semiconductor alloy by creating a patterning non-uniformity at the bottom of the gate electrode
01/22/2013US8357572 Method of manufacturing semiconductor device with recess and Fin structure
01/22/2013US8357570 Pixel structure and method for fabricating the same
01/22/2013US8357569 Method of fabricating finfet device
01/22/2013US8357567 Manufacturing method of semiconductor device
01/22/2013US8357566 Pre-encapsulated lead frames for microelectronic device packages, and associated methods
01/22/2013US8357565 Integrated circuit package and a method for forming an integrated circuit package
01/22/2013US8357564 Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
01/22/2013US8357563 Stitch bump stacking design for overall package size reduction for multiple stack
01/22/2013US8357562 Method to improve the reliability of the breakdown voltage in high voltage devices
01/22/2013US8357561 Method of fabricating backside illuminated image sensor
01/22/2013US8357560 Package of MEMS device and method for fabricating the same
01/22/2013US8357559 Method of making sensor platform using a non-horizontally oriented nanotube element
01/22/2013US8357558 Method of making semiconductor light-emitting device
01/22/2013US8357556 Method of protecting semiconductor chips from mechanical and ESD damage during handling
01/22/2013US8357555 Method for producing semiconductor optical device
01/22/2013US8357554 Display substrate and method of manufacturing the same
01/22/2013US8357553 Light source with hybrid coating, device including light source with hybrid coating, and/or methods of making the same
01/22/2013US8357552 Light emitting diode chip, and methods for manufacturing and packaging the same
01/22/2013US8357551 Method of manufacturing light emitting device