Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2013
01/15/2013US8354346 Method for fabricating low-k dielectric and Cu interconnect
01/15/2013US8354345 Method for forming side contact in semiconductor device through self-aligned damascene process
01/15/2013US8354344 Methods for forming metal-germanide layers and devices obtained thereby
01/15/2013US8354341 Method for forming an interconnect structure
01/15/2013US8354340 Electronic device and method of manufacturing the same
01/15/2013US8354339 Methods to form self-aligned permanent on-chip interconnect structures
01/15/2013US8354338 Carrier board structure with embedded semiconductor chip and fabrication method thereof
01/15/2013US8354337 Metal oxide film formation method and apparatus
01/15/2013US8354336 Forming an electrode having reduced corrosion and water decomposition on surface using an organic protective layer
01/15/2013US8354335 Apparatus and associated method for making a floating gate cell with increased overlay between the control gate and floating gate
01/15/2013US8354334 Power semiconductor chip with a formed patterned thick metallization atop
01/15/2013US8354333 Patterned doping of semiconductor substrates using photosensitive monolayers
01/15/2013US8354332 Methods of forming micro-electromichanical resonators having boron-doped resonator bodies containing eutectic alloys
01/15/2013US8354331 Multiplying pattern density by single sidewall imaging transfer
01/15/2013US8354330 Method of fabricating SOI super-junction LDMOS structure capable of completely eliminating substrate-assisted depletion effects
01/15/2013US8354329 Semiconductor device manufacturing method, semiconductor device and display apparatus
01/15/2013US8354328 Semiconductor device manufacturing method and semiconductor device
01/15/2013US8354327 Scheme for planarizing through-silicon vias
01/15/2013US8354326 Precision trench formation through oxide region formation for a semiconductor device
01/15/2013US8354325 Method for forming a toroidal inductor in a semiconductor substrate
01/15/2013US8354324 Mesa heterojunction phototransistor and method for making same
01/15/2013US8354323 Doped graphene electronic materials
01/15/2013US8354322 Fabricating and operating a memory array having a multi-level cell region and a single-level cell region
01/15/2013US8354321 Method for fabricating semiconductor devices with reduced junction diffusion
01/15/2013US8354320 Methods of controlling fin height of FinFET devices by performing a directional deposition process
01/15/2013US8354319 Integrated planar and multiple gate FETs
01/15/2013US8354318 Semiconductor memory device and method of fabrication of the same
01/15/2013US8354317 Relaxed-pitch method of aligning active area to digit line
01/15/2013US8354316 Reduced mask configuration for power mosfets with electrostatic discharge (ESD) circuit protection
01/15/2013US8354315 Fabrication method of a power semicondutor structure with schottky diode
01/15/2013US8354314 Silicon germanium film formation method and structure
01/15/2013US8354313 Method to optimize work function in complementary metal oxide semiconductor (CMOS) structures
01/15/2013US8354312 Semiconductor device fabrication method
01/15/2013US8354311 Method for forming nanofin transistors
01/15/2013US8354310 SOI MOS device having a source/body ohmic contact and manufacturing method thereof
01/15/2013US8354309 Method of providing threshold voltage adjustment through gate dielectric stack modification
01/15/2013US8354308 Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate
01/15/2013US8354306 Method of fabricating organic light emitting diode display
01/15/2013US8354305 Thin film transistor liquid crystal display array substrate and manufacturing method thereof
01/15/2013US8354304 Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant
01/15/2013US8354303 Thermally enhanced low parasitic power semiconductor package
01/15/2013US8354302 Semiconductor device fabrication method including formation of columnar electrodes having protrusion sections
01/15/2013US8354301 Packaged microdevices and methods for manufacturing packaged microdevices
01/15/2013US8354300 Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits
01/15/2013US8354299 Semiconductor component having a stack of semiconductor chips and method for producing the same
01/15/2013US8354298 Semiconductor device and manufacturing method of a semiconductor device
01/15/2013US8354297 Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die
01/15/2013US8354295 Backside illuminated sensor processing
01/15/2013US8354293 Method of making an imaging tablet-lens structure comprising an index of refraction that varies directionally
01/15/2013US8354292 CMOS image sensor having a crosstalk prevention structure and method of manufacturing the same
01/15/2013US8354291 Integrated circuits based on aligned nanotubes
01/15/2013US8354288 Etchant and method of manufacturing an array substrate using the same
01/15/2013US8354287 Method for manufacturing organic electroluminescence device
01/15/2013US8354286 Method of manufacturing silicon optoelectronic device, silicon optoelectronic device manufactured by the method, and image input and/or output apparatus using the silicon optoelectronic device
01/15/2013US8354284 LED module and method of manufacturing the same
01/15/2013US8354283 Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump
01/15/2013US8354282 Very high transmittance, back-illuminated, silicon-on-sapphire semiconductor wafer substrate for high quantum efficiency and high resolution, solid-state, imaging focal plane arrays
01/15/2013US8354281 Method of manufacturing back-surface electrode type solar cell
01/15/2013US8354215 Method for stripping photoresist
01/15/2013US8353986 Substrate processing apparatus
01/15/2013US8353101 Method of making substrate package with through holes for high speed I/O flex cable
01/15/2013CA2514133C Reverse printing
01/10/2013WO2013006775A1 Methods for automatically determining capacitor values and systems thereof
01/10/2013WO2013006407A1 Electrostatic chuck assembly
01/10/2013WO2013006337A1 Half-through vias for suppression of substrate modes
01/10/2013WO2013006242A1 Atomic layer deposition of transition metal thin films
01/10/2013WO2013006211A1 Method and apparatus for self-annealing multi-die interconnect redundancy control
01/10/2013WO2013005872A1 Apparatus for aligning, picking up, and transporting flat plate-like objects
01/10/2013WO2013005797A1 Resist underlayer film-forming composition which contains alicyclic skeleton-containing carbazole resin
01/10/2013WO2013005740A1 Substrate storage container
01/10/2013WO2013005738A1 COMPOSITION FOR FORMING n-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING n-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING SOLAR CELL ELEMENT
01/10/2013WO2013005696A1 Temperature adjustment device and method for manufacturing temperature adjustment device
01/10/2013WO2013005667A1 METHOD FOR MANUFACTURING GaN SEMICONDUCTOR ELEMENT
01/10/2013WO2013005604A1 Semiconductor device and method for manufacturing same
01/10/2013WO2013005589A1 Method for peeling glass substrate, and apparatus for peeling glass substrate
01/10/2013WO2013005582A1 Optical inspection device, inspection system and coordinate management wafer
01/10/2013WO2013005555A1 Metal-bonded structure and method for manufacturing same
01/10/2013WO2013005529A1 Overvoltage protection circuit, power supply apparatus, liquid crystal display apparatus, electronic apparatus, and television set
01/10/2013WO2013005481A1 Susceptor apparatus and film-forming apparatus provided with same
01/10/2013WO2013005470A1 Adhesive film, and dicing/die bonding film and method for processing semiconductor using said dicing/die bonding film
01/10/2013WO2013005468A1 Dielectric thin film, dielectric thin film element, and thin film capacitor
01/10/2013WO2013005461A1 Magnetoresistive element, magnetic memory, and method of manufacturing magnetoresistive element
01/10/2013WO2013005427A1 Buffer layer, method for manufacturing photoelectric conversion element comprising same, and photoelectric conversion element
01/10/2013WO2013005400A1 Sputtering target
01/10/2013WO2013005398A1 Tape application apparatus
01/10/2013WO2013005380A1 Semiconductor device and manufacturing method thereof
01/10/2013WO2013005372A1 Semiconductor device
01/10/2013WO2013005363A1 Container opening/closing device
01/10/2013WO2013005279A1 Method for forming contact hole and method for manufacturing semiconductor device
01/10/2013WO2013005254A1 Flexible device manufacturing method and flexible device
01/10/2013WO2013005250A1 Thin-film transistor, method of manufacturing thereof, and display apparatus
01/10/2013WO2013004543A1 Method for producing structured sintering connection layers and semiconductor component comprising a structured sintering connection layer
01/10/2013WO2013004188A1 Solar cell, system, and manufacturing method thereof
01/10/2013WO2013004083A1 Shielding structure of flexible substrate package and fabricating process thereof
01/10/2013WO2013004050A1 Thin film transistor array substrate and manufacturing method thereof
01/10/2013WO2013004031A1 Mosfet and manufacturing method therefor
01/10/2013WO2013004000A1 Device for static charge reduction
01/10/2013WO2013003979A1 Method for integrating manganese-oxide-based resistive memory with copper interconnection rear end process
01/10/2013WO2013003877A1 Device for holding a planar substrate
01/10/2013WO2012158347A3 Spin torque transfer memory cell structures and methods