Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2013
01/24/2013US20130021840 Semiconductor device and method of manufacturing the same
01/24/2013US20130021835 Resistive ram, method for fabricating the same, and method for driving the same
01/24/2013US20130021834 Memory device and method of manufacturing the same
01/24/2013US20130021717 Electrostatic chuck with wafer backside plasma assisted dechuck
01/24/2013US20130021061 Tunnel field-effect transistor
01/24/2013US20130021060 Method for fabrication of a semiconductor device and structure
01/24/2013US20130020726 Package module structure for high power device with metal substrate and method of manufacturing the same
01/24/2013US20130020725 Semiconductor device and method of manufacturing semiconductor device
01/24/2013US20130020724 Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
01/24/2013US20130020721 Semiconductor device and method for manufacturing the same
01/24/2013US20130020718 MEMS Devices and Methods of Forming Same
01/24/2013US20130020717 Integrated circuit having a stressor and method of forming the same
01/24/2013US20130020716 System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3d chip stacks
01/24/2013US20130020714 Contact pad
01/24/2013US20130020713 Wafer Level Package and a Method of Forming a Wafer Level Package
01/24/2013US20130020712 Implementing integrated circuit mixed double density and high performance wire structure
01/24/2013US20130020711 Interconnect Pillars with Directed Compliance Geometry
01/24/2013US20130020710 Semiconductor substrate, package and device and manufacturing methods thereof
01/24/2013US20130020709 Semiconductor package and method of fabricating the same
01/24/2013US20130020708 Copper Interconnects Separated by Air Gaps and Method of Making Thereof
01/24/2013US20130020706 Semiconductor device and manufacturing method thereof
01/24/2013US20130020705 Method to form uniform silicide by selective implantation
01/24/2013US20130020704 Bonding surfaces for direct bonding of semiconductor structures
01/24/2013US20130020700 Chip package and fabrication method thereof
01/24/2013US20130020699 Package structure and method for fabricating the same
01/24/2013US20130020698 Pillar Design for Conductive Bump
01/24/2013US20130020697 Techniques and structures for testing integrated circuits in flip-chip assemblies
01/24/2013US20130020695 "L" Shaped Lead Integrated Circuit Package
01/24/2013US20130020694 Power module packaging with double sided planar interconnection and heat exchangers
01/24/2013US20130020693 Chip package structure and method for forming the same
01/24/2013US20130020692 Semiconductor device and method of manufacturing the same
01/24/2013US20130020691 Method of Manufacturing a Semiconductor Device
01/24/2013US20130020690 Stacked die semiconductor package
01/24/2013US20130020689 Semiconductor device and method of packaging same
01/24/2013US20130020688 Chip package structure and manufacturing method thereof
01/24/2013US20130020687 Power module package and method for manufacturing the same
01/24/2013US20130020686 Package structure and package process
01/24/2013US20130020684 Actinic ray-sensitive or radiation-sensitive resin composition, and actinic ray-sensitive or radiation-sensitive film and pattern forming method using the same
01/24/2013US20130020682 Wafer backside defectivity clean-up utilizing slective removal of substrate material
01/24/2013US20130020681 Process for preparing a bonding type semiconductor substrate
01/24/2013US20130020680 Semiconductor structure and a method for manufacturing the same
01/24/2013US20130020679 Semiconductor device and production method thereof
01/24/2013US20130020678 Semiconductor Devices with Orientation-Free Decoupling Capacitors and Methods of Manufacture Thereof
01/24/2013US20130020677 Embedded capacitor structure and the forming method thereof
01/24/2013US20130020672 System and Method for Packaging of High-Voltage Semiconductor Devices
01/24/2013US20130020671 Termination of high voltage (HV) devices with new configurations and methods
01/24/2013US20130020669 Method for manufacturing semiconductor device, resin sealing apparatus, and semiconductor device
01/24/2013US20130020658 Replacement gate electrode with planar work function material layers
01/24/2013US20130020657 Metal oxide semiconductor transistor and method of manufacturing the same
01/24/2013US20130020656 High performance hkmg stack for gate first integration
01/24/2013US20130020655 Semiconductor device and manufacturing method thereof
01/24/2013US20130020653 Shallow Trench Isolation Structure, Manufacturing Method Thereof and a Device Based on the Structure
01/24/2013US20130020652 Method for suppressing short channel effect of cmos device
01/24/2013US20130020651 Metal gate structure of a cmos semiconductor device and method of forming the same
01/24/2013US20130020650 Semiconductor device and method of manufacturing semiconductor device
01/24/2013US20130020649 Nitride electronic device and method for manufacturing the same
01/24/2013US20130020648 Semiconductor device
01/24/2013US20130020645 Esd field-effect transistor and integrated diffusion resistor
01/24/2013US20130020643 Transistor and its Method of Manufacture
01/24/2013US20130020642 Finfet spacer formation by oriented implantation
01/24/2013US20130020641 Substrate for display panel, manufacturing method of same, display panel, and display device
01/24/2013US20130020640 Semiconductor device structure insulated from a bulk silicon substrate and method of forming the same
01/24/2013US20130020636 High Voltage Device and Manufacturing Method Thereof
01/24/2013US20130020635 Semiconductor device with field threshold MOSFET for high voltage termination
01/24/2013US20130020632 Lateral transistor with capacitively depleted drift region
01/24/2013US20130020631 Memory Cell and Method of Manufacturing a Memory Cell
01/24/2013US20130020630 Gate dielectric of semiconductor device
01/24/2013US20130020628 Process for fabricating a transistor comprising nanocrystals
01/24/2013US20130020627 Shift register memory and method of manufacturing the same
01/24/2013US20130020626 Memory cell with decoupled channels
01/24/2013US20130020625 Manufacturing method and structure of non-volatile memory
01/24/2013US20130020623 Structure and method for single gate non-volatile memory device
01/24/2013US20130020622 Semiconductor device and method for manufacturing the same
01/24/2013US20130020619 Method for manufacturing semiconductor device
01/24/2013US20130020618 Semiconductor device, formation method thereof, and package structure
01/24/2013US20130020616 Silicided device with shallow impurity regions at interface between silicide and stressed liner
01/24/2013US20130020615 Borderless Contacts in Semiconductor Devices
01/24/2013US20130020614 Dual-gate normally-off nitride transistors
01/24/2013US20130020613 Semiconductor device and manufacturing method thereof
01/24/2013US20130020612 Re-growing Source/Drain Regions from Un-Relaxed Silicon Layer
01/24/2013US20130020611 Semiconductor device and method of forming a structure in a target substrate for manufacturing a semiconductor device
01/24/2013US20130020594 Semiconductor template substrate, light-emitting element using a semiconductor template substrate, and a production method therefor
01/24/2013US20130020587 Power semiconductor device and method for manufacturing same
01/24/2013US20130020585 Silicon carbide substrate, semiconductor device, and methods for manufacturing them
01/24/2013US20130020583 Epitaxial substrate and method for manufacturing epitaxial substrate
01/24/2013US20130020580 Heteroepitaxial growth using ion implantation
01/24/2013US20130020578 Semiconductor Device and Method for Manufacturing the Same
01/24/2013US20130020575 Semiconductor device and manufacturing method thereof
01/24/2013US20130020573 Pressure detecting device and method for manufacturing the same, display device and method for manufacturing the same, and tft substrate with pressure detecting device
01/24/2013US20130020572 Cap Chip and Reroute Layer for Stacked Microelectronic Module
01/24/2013US20130020567 Thin film transistor having passivation layer comprising metal and method for fabricating the same
01/24/2013US20130020549 Systems and methods for fabricating longitudinally-shaped structures
01/24/2013US20130020548 Seed layer for a p+ silicon germanium material for a non-volatile memory device and method
01/24/2013US20130020468 Solid-state imaging device, manufacturing method of solid-state imaging device, manufacturing method of semiconductor device, semiconductor device, and electronic device
01/24/2013US20130020026 Wiggling control for pseudo-hardmask
01/24/2013US20130019932 Nanostructure Array Substrate, Method for Fabricating the Same and Dye-Sensitized Solar Cell Using the Same
01/24/2013US20130019918 Thermoelectric devices, systems and methods
01/24/2013US20130019893 Ultrasonic cleaning method and apparatus
01/24/2013US20130019804 Method of manufacturing semiconductor device and substrate processing apparatus
01/24/2013US20130019797 Impurity-doped layer formation apparatus and electrostatic chuck protection method