| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/23/2013 | CN102890353A Method of forming process substrate using thin glass substrate and method of fabricating flat display device using the same |
| 01/23/2013 | CN102890348A COF (chip on film) base band, manufacturing method of COF base band, liquid crystal display module |
| 01/23/2013 | CN102888647A Plating device and plating method |
| 01/23/2013 | CN102888208A Abrasive and substrate polishing method |
| 01/23/2013 | CN102888193A Chemical mechanical polishing solution for processing surface of sapphire or carborundum wafer for LED (Light Emitting Diode) substrate slice and preparation method thereof |
| 01/23/2013 | CN102886973A Support and transport unit for a print substrate for a plant for depositing print tracks, and relative deposition method |
| 01/23/2013 | CN102886829A Processing method |
| 01/23/2013 | CN102437136B Bonding alloy wire and production technology thereof |
| 01/23/2013 | CN102306631B Method for improving Sn-Ag solder performance based on galvanization technology |
| 01/23/2013 | CN102270663B Planar power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) device with super junction structure and manufacturing method of planar power MOSFET device |
| 01/23/2013 | CN102270652B LED (light-emitting diode) module with cross-over electrode and manufacturing method thereof |
| 01/23/2013 | CN102231382B Ceramic package for image sensor and package method |
| 01/23/2013 | CN102222618B Trench metal oxide semiconductor field effect tube |
| 01/23/2013 | CN102201382B Semiconductor packaging piece and manufacturing method thereof |
| 01/23/2013 | CN102194656B Method for generating chip authentication code, and chip authentication method and system |
| 01/23/2013 | CN102163610B Thin-film transistor panel having structure that suppresses characteristic shifts and method for manufacturing the same |
| 01/23/2013 | CN102157348B Flattening mechanism of wafer film laminator |
| 01/23/2013 | CN102148261B Manufacturing method of capacitor structure |
| 01/23/2013 | CN102148229B Memory element, and semiconductor device |
| 01/23/2013 | CN102142387B Vertical crystal boat for semiconductor equipment for heat treatment |
| 01/23/2013 | CN102142370B Preparation method of diode chip on P+ substrate and structure of diode chip |
| 01/23/2013 | CN102136476B Semiconductor packaging structure and manufacture method thereof |
| 01/23/2013 | CN102129978B Method of forming a semiconductor device |
| 01/23/2013 | CN102117799B Buried multi-chip semiconductor package structure and manufacturing method thereof |
| 01/23/2013 | CN102104071B Power metal-oxide-semiconductor field effect transistor (MOSFET) and manufacturing method thereof |
| 01/23/2013 | CN102103987B Film adhering method and device of wafer |
| 01/23/2013 | CN102103819B Positioning and clamping device for detection of flat-panel display |
| 01/23/2013 | CN102097352B Disk fixing device |
| 01/23/2013 | CN102097320B NMOS (N-channel Metal Oxide Semiconductor) device and forming method thereof |
| 01/23/2013 | CN102091995B Chemical and mechanism grinding method and system |
| 01/23/2013 | CN102087993B Groove forming method |
| 01/23/2013 | CN102084483B Semiconductor element and manufacturing method therefor |
| 01/23/2013 | CN102077320B Plasma processing device, plasma processing method, and mechanism for regulating temperature of dielectric window |
| 01/23/2013 | CN102074552B Semiconductor device packages and manufacturing methods thereof |
| 01/23/2013 | CN102067296B Jig for aligning leadframe |
| 01/23/2013 | CN102065640B Method for reducing warping in assembly of circuit board |
| 01/23/2013 | CN102064110B LDMOS transistor, method for fabricating the same and power field effect transistor |
| 01/23/2013 | CN102054827B Light-emitting diode wafer encapsulation body and encapsulation method thereof |
| 01/23/2013 | CN102054748B Formation method of copper interconnection and processing method of dielectric layer |
| 01/23/2013 | CN102039555B 研磨头装置 Grinding head unit |
| 01/23/2013 | CN102037552B Stage |
| 01/23/2013 | CN102034859B Compound semiconductor device and method of manufacturing the same |
| 01/23/2013 | CN102034737B Making method of metal interconnection layer |
| 01/23/2013 | CN102034728B Positioning transmission apparatus |
| 01/23/2013 | CN101997082B Self-convergence bottom electrode ring |
| 01/23/2013 | CN101996947B Method for integrating silicon-based photoelectric device |
| 01/23/2013 | CN101996888B Method for forming bumps |
| 01/23/2013 | CN101995764B Dustproof thin film assembly accepting container |
| 01/23/2013 | CN101989569B Copper interconnection method |
| 01/23/2013 | CN101965628B Inks comprising doping agent |
| 01/23/2013 | CN101964302B Heating device, substrate processing apparatus, and method of manufacturing semiconductor device |
| 01/23/2013 | CN101960625B Semiconductor light emitting element, method for manufacturing the semiconductor light emitting element and lamp using the semiconductor light emitting element |
| 01/23/2013 | CN101958277B Method for forming metal wiring groove |
| 01/23/2013 | CN101937919B Three-dimensional nonvolatile memory device and method for fabricating the same |
| 01/23/2013 | CN101930924B Fabrication method of MOS (Metal Oxide Semiconductor) transistor |
| 01/23/2013 | CN101924064B Making method of thin film transistor array substrate |
| 01/23/2013 | CN101916771B A method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode |
| 01/23/2013 | CN101911260B Dicing/die bonding film |
| 01/23/2013 | CN101908506B Semiconductor apparatus and method for fabricating the same |
| 01/23/2013 | CN101903986B Apparatus for particle removal by single-phase and two-phase media |
| 01/23/2013 | CN101903959B Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution |
| 01/23/2013 | CN101874295B Method for manufacturing flexible semiconductor device and multilayer film used therein |
| 01/23/2013 | CN101872129B Lithographic apparatus and device manufacturing method |
| 01/23/2013 | CN101853851B Capacitive element, manufacturing method of the same, solid-state imaging device, and imaging apparatus |
| 01/23/2013 | CN101849284B Structure for reducing warp of substrate |
| 01/23/2013 | CN101840207B Method and apparatus for advanced process control |
| 01/23/2013 | CN101819971B Thin film transistor for liquid crystal display |
| 01/23/2013 | CN101819925B Chemical vapor deposition device |
| 01/23/2013 | CN101813236B Gas transmission device and transmission method |
| 01/23/2013 | CN101807534B Molding system for optical device |
| 01/23/2013 | CN101800227B Thin film transistor array substrate and manufacturing method thereof |
| 01/23/2013 | CN101777487B Gas-tight module and exhaust method therefor |
| 01/23/2013 | CN101764052B Method for bonding two substrates |
| 01/23/2013 | CN101754591B Bonding tool, electronic component mounting apparatus and electronic component mounting method |
| 01/23/2013 | CN101740601B Resistive memory device and method of fabricating the same |
| 01/23/2013 | CN101728421B Organic el display and method of manufacturing the same |
| 01/23/2013 | CN101728413B Light emitting display and method of manufacturing the same |
| 01/23/2013 | CN101728358B Wiring structure and method for fabricating the same |
| 01/23/2013 | CN101728318B Semiconductor device and method for manufacturing the same |
| 01/23/2013 | CN101719506B Voltage-withstanding stable semiconductor device structure |
| 01/23/2013 | CN101681847B Pad layout structure of semiconductor chip |
| 01/23/2013 | CN101665927B Film deposition apparatus, substrate processor, film deposition method |
| 01/23/2013 | CN101663737B Method and apparatus for wafer electroless plating |
| 01/23/2013 | CN101651174B Semiconductor substrate for use in epitaxy of semiconductor optoelectronic element and method for manufacturing same |
| 01/23/2013 | CN101643648B Composition for etching silicon oxide layer, method for etching semiconductor device using the same, and composition for etching semiconductor device |
| 01/23/2013 | CN101635251B Rinsing wafers using composition-tunable rinse water in chemical mechanical polish |
| 01/23/2013 | CN101630660B Method for improving irradiation resistance of CMOS transistor, SMOS transistor and integrated circuit |
| 01/23/2013 | CN101626020B Low clamp voltage ESD device and method therefor |
| 01/23/2013 | CN101622912B Plasma processing apparatus and method for using plasma processing apparatus |
| 01/23/2013 | CN101610864B Process for producing silver powder |
| 01/23/2013 | CN101606232B Pulsed ultra-high aspect ratio dielectric etch |
| 01/23/2013 | CN101604623B Thermal processing apparatus and thermal processing method for object to be processed |
| 01/23/2013 | CN101596988B Adhesive film attaching mechanism |
| 01/23/2013 | CN101577258B Electronic component and resin packaging method for electronic component |
| 01/23/2013 | CN101552248B A semiconductor device and a manufacturing method thereof |
| 01/23/2013 | CN101536169B Method and structure for thick layer transfer using a linear accelerator |
| 01/23/2013 | CN101518949B Adhesive film position detector and adhesive film joining apparatus |
| 01/23/2013 | CN101499434B Checking system |
| 01/23/2013 | CN101490821B Subresolution silicon features and methods for forming the same |
| 01/23/2013 | CN101459109B Method for preparing shallow groove isolation structure |