| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/30/2013 | CN102906868A Apparatus and method for electrostatic discharge (esd) reduction |
| 01/30/2013 | CN102906867A Printed circuit board including a dam for underfills, and method for manufacturing same |
| 01/30/2013 | CN102906866A Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC) |
| 01/30/2013 | CN102906865A Inter-low-permittivity layer insulating film, and method for forming inter-low-permittivity layer insulating film |
| 01/30/2013 | CN102906864A 等离子体蚀刻方法 The plasma etching method |
| 01/30/2013 | CN102906863A Etching solution, and method for processing surface of silicon substrate |
| 01/30/2013 | CN102906862A Native devices having improved device characteristics and methods for fabrication |
| 01/30/2013 | CN102906861A Large-area deposition device for gas-mixing prevention |
| 01/30/2013 | CN102906860A Planarizing etch hardmask to increase pattern density and aspect ratio |
| 01/30/2013 | CN102906859A Engineering boron-rich films lithographic mask applications |
| 01/30/2013 | CN102906858A Resist removal device and resist removal method |
| 01/30/2013 | CN102906857A Group III nitride composite substrate |
| 01/30/2013 | CN102906856A Reduction of particle contamination produced by moving mechanisms in a process tool |
| 01/30/2013 | CN102906855A Airflow management for low particulate count in a process tool |
| 01/30/2013 | CN102906545A Interferometric encoder systems |
| 01/30/2013 | CN102906304A Silicon dioxide layer deposited with BDEAS |
| 01/30/2013 | CN102906198A Curable composition, hardened material, and method for using curable composition |
| 01/30/2013 | CN102906026A Titanium oxide particles, process for producing same, magnetic memory, optical information recording medium, and charge accumulation type memory |
| 01/30/2013 | CN102905996A Handling system for handling articles |
| 01/30/2013 | CN102905405A Heating device and plasma processing equipment utilizing same |
| 01/30/2013 | CN102904055A Micro structure of metamaterial and preparation method thereof |
| 01/30/2013 | CN102903786A Novel ultra-shallow junction crystalline silicon solar cell |
| 01/30/2013 | CN102903762A Schottky diode and preparation method thereof |
| 01/30/2013 | CN102903759A Manufacturing method for thin film transistor and display device |
| 01/30/2013 | CN102903757A Method for forming SOI MOSFET (Silicon On Insulator Metal-Oxide-Semiconductor Field Effect Transistor) body contact by using side wall process |
| 01/30/2013 | CN102903756A Field effect transistor with diamond metal-insulator-semiconductor structure and preparation method thereof |
| 01/30/2013 | CN102903753A Semiconductor devices including variable resistance material and methods of fabricating the same |
| 01/30/2013 | CN102903752A High-voltage element and manufacturing method thereof |
| 01/30/2013 | CN102903751A Semiconductor element and manufacture method thereof |
| 01/30/2013 | CN102903750A Semiconductor field effect transistor structure and production method thereof |
| 01/30/2013 | CN102903749A Semiconductor device structure and production method thereof |
| 01/30/2013 | CN102903748A Lateral double-diffused metal oxide semiconductor (DMOS) and manufacturing method thereof |
| 01/30/2013 | CN102903747A All-single-walled carbon nanotube field effect transistor and preparation method thereof |
| 01/30/2013 | CN102903745A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/30/2013 | CN102903744A Semiconductor structure and its forming method |
| 01/30/2013 | CN102903743A Power semiconductor device structure adopting metal silicide and manufacturing method of power semiconductor device structure |
| 01/30/2013 | CN102903742A Metal gate electrode of a field effect transistor |
| 01/30/2013 | CN102903741A Semiconductor device and method of manufacturing the same |
| 01/30/2013 | CN102903738A III-series nitride semiconductor device and manufacturing method thereof |
| 01/30/2013 | CN102903737A Semiconductor device and manufacturing method of semiconductor device |
| 01/30/2013 | CN102903736A 二极管及其制作方法 Diode and manufacturing method thereof |
| 01/30/2013 | CN102903728A Organic light-emitting diode display and manufacturing method thereof |
| 01/30/2013 | CN102903717A Semiconductor integrated circuit having capacitor for providing stable power and method of manufacturing the same |
| 01/30/2013 | CN102903701A Semiconductor device and method for manufacturing a semiconductor |
| 01/30/2013 | CN102903699A Copper interconnecting structure and preparation method thereof |
| 01/30/2013 | CN102903696A Self-aligning conductive bump structure and method of making the same |
| 01/30/2013 | CN102903694A Power semiconductor chip having two metal layers on one face |
| 01/30/2013 | CN102903693A Power device package module and manufacturing method thereof |
| 01/30/2013 | CN102903692A Stacked power semiconductor device with double-layer lead frame and production method thereof |
| 01/30/2013 | CN102903691A Semiconductor devices, packaging methods and structures |
| 01/30/2013 | CN102903684A Semiconductor chip, chip, semiconductor package with chip and manufacturing method thereof |
| 01/30/2013 | CN102903683A Structure of package substrate and manufacturing method of package substrate |
| 01/30/2013 | CN102903682A Semiconductor device, semiconductor module structure configured by vertically stacking semiconductor devices, and manufacturing method thereof |
| 01/30/2013 | CN102903680A Semiconductor package and method of fabricating the same |
| 01/30/2013 | CN102903679A Incision fixing fixture |
| 01/30/2013 | CN102903678A Manufacturing method of pixel structure |
| 01/30/2013 | CN102903677A Method for wiring motherboard-aged organic light emitting diode (OLED) display |
| 01/30/2013 | CN102903676A Array substrate and manufacture method thereof, and liquid crystal display device |
| 01/30/2013 | CN102903675A TFT (Thin Film Transistor) array substrate, manufacturing method and display device |
| 01/30/2013 | CN102903674A Display panel and production method thereof |
| 01/30/2013 | CN102903673A Method for manufacturing wafer-level through silicon via (TSV) |
| 01/30/2013 | CN102903672A Manufacture method of through hole structure |
| 01/30/2013 | CN102903671A Method for forming novel chip back-side TSV (through silicon via) structure |
| 01/30/2013 | CN102903670A Low-cost TSV (through silicon via) three-dimensional integration process method |
| 01/30/2013 | CN102903669A Scheme for planarizing through-silicon vias |
| 01/30/2013 | CN102903668A 半导体元件及其制造方法 Semiconductor device and manufacturing method |
| 01/30/2013 | CN102903667A Method for forming semiconductor device |
| 01/30/2013 | CN102903666A Manufacturing method of semiconductor device |
| 01/30/2013 | CN102903665A Manufacturing method of semiconductor device |
| 01/30/2013 | CN102903664A Method for transferring monocrystalline semiconductor layer onto support substrate |
| 01/30/2013 | CN102903663A Semiconductor devices having encapsulated isolation regions and related fabrication methods |
| 01/30/2013 | CN102903662A Isolation layer etching method |
| 01/30/2013 | CN102903661A Wafer tail end executor |
| 01/30/2013 | CN102903660A 装载装置 Loading device |
| 01/30/2013 | CN102903659A Semiconductor processing device and application method thereof |
| 01/30/2013 | CN102903658A Substrate processing apparatus, substrate holding apparatus and method of holding substrate |
| 01/30/2013 | CN102903657A Heat treatment apparatus and method of transferring substrates to the same |
| 01/30/2013 | CN102903656A Photomask basket |
| 01/30/2013 | CN102903655A Vacuum control system |
| 01/30/2013 | CN102903654A Temperature control of fast substrate support |
| 01/30/2013 | CN102903653A Unloading device and unloading method for high-temperature grown wafer |
| 01/30/2013 | CN102903652A Substrate processing device and method |
| 01/30/2013 | CN102903651A Temperature control unit and system, substrate placing base, processing unit and processing method |
| 01/30/2013 | CN102903650A Probing apparatus for semiconductor device |
| 01/30/2013 | CN102903649A Method for selecting photoresist thickness of ion implantation |
| 01/30/2013 | CN102903648A Crystal curing press head of radio frequency identification back-off packaging device |
| 01/30/2013 | CN102903647A Chip soldering apparatus |
| 01/30/2013 | CN102903646A Chip welding method |
| 01/30/2013 | CN102903645A Plane type semiconductor element and method for manufacturing same |
| 01/30/2013 | CN102903644A Method for determining amount of ball placement for camera module |
| 01/30/2013 | CN102903643A Electronic component packaging device |
| 01/30/2013 | CN102903642A Chip scale packaging method capable of encapsulating bottom and periphery of chip |
| 01/30/2013 | CN102903641A Method for reducing partial contact resistance and parasitic capacitance of SOI (Silicon on Insulator) PD (Partially-Depleted) MOSFET (Metal-Oxide -Semiconductor Field Effect Transistor) |
| 01/30/2013 | CN102903640A Body contact forming method by utilizing SOI (silicon on insulator) MOSFET (metal oxide semiconductor field effect transistor) of sacrificial layer |
| 01/30/2013 | CN102903639A MOS (Metal Oxide Semiconductor) transistor, substrate provided with stress layers and formation method of substrate provided with stress layer |
| 01/30/2013 | CN102903638A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/30/2013 | CN102903637A Method for manufacturing semiconductor device |
| 01/30/2013 | CN102903636A Manufacturing method of MOS (metal oxide semiconductor) transistor |
| 01/30/2013 | CN102903635A Manufacturing method of MOS (metal oxide semiconductor) transistor |
| 01/30/2013 | CN102903634A Back-face vacuum annealing process for IGBT (Insulated Gate Bipolar Translator) single crystal wafer |