| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/16/2013 | CN202678301U Wafer level chip scale package and integrated circuit package for small, high capacity bare die |
| 01/16/2013 | CN202678300U Wafer clamping device by utilizing spring pinch cock |
| 01/16/2013 | CN202678299U Vertical furnace loading carrier |
| 01/16/2013 | CN202678298U Vertical type quartz cage boat |
| 01/16/2013 | CN202678297U Quartz mouse cage boat |
| 01/16/2013 | CN202678296U 石英桨 Quartz paddle |
| 01/16/2013 | CN202678295U 玻璃存放篮 Glass store basket |
| 01/16/2013 | CN202678294U Solar quartz silicon wafer diffusion boat |
| 01/16/2013 | CN202678293U Automatic marking device and equipment for solar thin-film battery |
| 01/16/2013 | CN202678292U 半导体处理设备 Semiconductor processing equipment |
| 01/16/2013 | CN202678291U Furnace tube aeration torch |
| 01/16/2013 | CN202678290U Sheet bonding machine |
| 01/16/2013 | CN202678289U Vacuum oven for processing HMDS |
| 01/16/2013 | CN202678288U Surface defect detecting device of crystalline silicon polished wafer |
| 01/16/2013 | CN202678287U Window pressing plate for welding half-etching lead wire frame of lead wire |
| 01/16/2013 | CN202678286U Positioning structure of semi-conductor chip cantilever package |
| 01/16/2013 | CN202677059U Double-side photoetching structure of ceramic wafer |
| 01/16/2013 | CN202675888U Fixing part, furnace door sealing device and oxidation diffusion furnace |
| 01/16/2013 | CN202675836U Oven with magnetic door self-locking function |
| 01/16/2013 | CN202671682U Nickel plating machine |
| 01/16/2013 | CN202671657U Plasma corrosion resistant component |
| 01/16/2013 | CN202667189U Silicon chip cleaning device |
| 01/16/2013 | CN1966594B Polishing composition including an inhibitor of tungsten etching |
| 01/16/2013 | CN1870293B Semiconductor device and method for fabricating the same |
| 01/16/2013 | CN1783501B Plane display |
| 01/16/2013 | CN1685485B Substrate processing apparatus |
| 01/16/2013 | CN1652350B Thin film transistor and method of manufacturing the same |
| 01/16/2013 | CN102884871A A pre-lamination core and method for making a pre-lamination core for electronic cards and tags |
| 01/16/2013 | CN102884870A Selective patterning for low cost through vias |
| 01/16/2013 | CN102884644A Process for production of nitride semiconductor element, nitride semiconductor light-emitting element, and light-emitting device |
| 01/16/2013 | CN102884643A III-nitride light-emitting device grown on a relaxed layer |
| 01/16/2013 | CN102884634A Semiconductor device, active matrix substrate, and display device |
| 01/16/2013 | CN102884633A Circuit board and display device |
| 01/16/2013 | CN102884632A Thin film transistor, contact structure, substrate, display device, and processes for producing same |
| 01/16/2013 | CN102884623A Microelectronic package with terminals on dielectric mass |
| 01/16/2013 | CN102884617A 半导体装置 Semiconductor device |
| 01/16/2013 | CN102884616A Device for holding wafer shaped articles |
| 01/16/2013 | CN102884615A Bonding wire |
| 01/16/2013 | CN102884614A Method for producing thin film transistor device, thin film transistor device, and display device |
| 01/16/2013 | CN102884613A Dynamically or adaptively tracking spectrum features for endpoint detection |
| 01/16/2013 | CN102884612A Pressure controlled polishing platen |
| 01/16/2013 | CN102884611A Non-contact detection of surface fluid droplets |
| 01/16/2013 | CN102884610A Confined process volume PECVD chamber |
| 01/16/2013 | CN102884609A Inspecting apparatus and inspecting method |
| 01/16/2013 | CN102884589A Nanoink composition |
| 01/16/2013 | CN102884479A Negative photoresist composition, and method for patterning device |
| 01/16/2013 | CN102884224A Stage heater and method for producing shaft |
| 01/16/2013 | CN102883973A Thin wafer shipper |
| 01/16/2013 | CN102883828A Ultrasonic cleaning apparatus and ultrasonic cleaning method |
| 01/16/2013 | CN102881989A Terahertz frequency band spiral mixing antenna |
| 01/16/2013 | CN102881988A Terahertz frequency band logarithm periodical mixing antenna |
| 01/16/2013 | CN102881987A Terahertz double-slit mixing antenna |
| 01/16/2013 | CN102881783A Method for cutting light emitting diode chip through deep etching |
| 01/16/2013 | CN102881782A Segmenting method of optical device substrate |
| 01/16/2013 | CN102881725A Metal oxide semiconductor (MOS) tube, manufacture method thereof and application of MOS tube in battery protection circuit |
| 01/16/2013 | CN102881724A Multi-grid transistor and manufacturing method thereof |
| 01/16/2013 | CN102881723A Semiconductor device structure and fabrication method of semiconductor device structure |
| 01/16/2013 | CN102881722A Source-field-plate heterojunction field-effect transistor and manufacturing method thereof |
| 01/16/2013 | CN102881721A Mixed-structure field effect transistor and manufacturing method thereof |
| 01/16/2013 | CN102881720A Taiwan semiconductor mfg |
| 01/16/2013 | CN102881719A Junction barrier schottky diode with enforced upper contact structure and method for robust packaging |
| 01/16/2013 | CN102881717A Protection ring structure of high-voltage device and manufacturing method of protection ring structure |
| 01/16/2013 | CN102881714A Power device and method for manufacturing same |
| 01/16/2013 | CN102881711A Active organic light emitting diode (OLED) |
| 01/16/2013 | CN102881695A Thin film transistor array substrate, organic light-emitting display device including the same, and method of manufacturing the organic light-emitting display device |
| 01/16/2013 | CN102881694A Semiconductor device and manufacturing method therefor |
| 01/16/2013 | CN102881693A Storage device and manufacturing method thereof |
| 01/16/2013 | CN102881691A P-type OTP (one time programmable) device and preparing method therefore |
| 01/16/2013 | CN102881690A 动态随机存取存储器及其制造方法 Dynamic random access memory and manufacturing method thereof |
| 01/16/2013 | CN102881689A Array substrate and manufacturing method thereof and LCD panel |
| 01/16/2013 | CN102881688A Array substrate, display panel and array substrate manufacturing method |
| 01/16/2013 | CN102881677A Alloy copper diffusion barrier layer for copper interconnection and manufacturing method thereof |
| 01/16/2013 | CN102881675A Structure and method for high performance interconnect |
| 01/16/2013 | CN102881674A Metal-insulator-metal (MIM) capacitor and manufacturing method thereof |
| 01/16/2013 | CN102881673A Copper damascene structure and manufacturing method thereof |
| 01/16/2013 | CN102881671A Single-chip front-mounted etching-first package-followed island-exposed package structure and manufacturing method thereof |
| 01/16/2013 | CN102881670A Multi-chip positive packaging structure for embedding basic island by first packaging and second etching, and manufacturing method for multi-chip positive packaging structure |
| 01/16/2013 | CN102881666A Wafer level packaging device |
| 01/16/2013 | CN102881665A System and method for wafer level packaging |
| 01/16/2013 | CN102881664A Multi-chip inversely-mounted package-first etching-followed island-free package structure and manufacturing method thereof |
| 01/16/2013 | CN102881659A Semiconductor device and method of manufacturing the same |
| 01/16/2013 | CN102881658A Method for fabricating memory device with buried digit lines and buried word lines |
| 01/16/2013 | CN102881657A CMOS (complementary metal oxide semiconductor) transistor and manufacturing method thereof |
| 01/16/2013 | CN102881656A Semiconductor device and fabrication method thereof |
| 01/16/2013 | CN102881655A Pixel structure and manufacturing method for the pixel structure |
| 01/16/2013 | CN102881654A Thin-film transistor array substrate and preparation method thereof and active matrix display device |
| 01/16/2013 | CN102881653A Thin film transistor and manufacturing method thereof |
| 01/16/2013 | CN102881652A Segmentation mask framework components manufactured by AMOLED panel manufacturing |
| 01/16/2013 | CN102881651A Method for improving electrical interconnection characteristic of carbon nano tube |
| 01/16/2013 | CN102881650A Double-damascene structure manufacturing method |
| 01/16/2013 | CN102881649A Method for manufacturing damascene structure |
| 01/16/2013 | CN102881648A Method for manufacturing metal interconnection structure |
| 01/16/2013 | CN102881647A Preparation method of copper metal covering layer |
| 01/16/2013 | CN102881646A Method for preparing copper metal covering layer |
| 01/16/2013 | CN102881645A Method for manufacturing through-hole prior copper through interconnection |
| 01/16/2013 | CN102881644A Method for packaging wafer level chip |
| 01/16/2013 | CN102881643A Method for manufacturing interconnection structure containing air gaps |
| 01/16/2013 | CN102881642A Method for forming rewiring pattern |
| 01/16/2013 | CN102881641A Method for improving etched via bottom critical dimension of 40 nm dual damascene structure |
| 01/16/2013 | CN102881640A Method for manufacturing dual damascene copper interconnection structure |