Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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07/28/1987 | US4683163 Vitreous semiconductor supporting structure and device realized with such a structure |
07/28/1987 | US4683147 Method of forming deposition film |
07/28/1987 | US4683146 From silicon hydride |
07/28/1987 | US4683145 From a silicon compound |
07/28/1987 | US4683144 Method for forming a deposited film |
07/28/1987 | US4683024 Device fabrication method using spin-on glass resins |
07/28/1987 | US4682928 Wafer transfer apparatus |
07/28/1987 | US4682927 Conveyor system |
07/28/1987 | US4682885 Illumination apparatus |
07/28/1987 | US4682615 Rinsing in acid processing of substrates |
07/28/1987 | US4682614 Wafer processing machine |
07/28/1987 | US4682566 Evacuated equipment |
07/28/1987 | US4682409 Fast bipolar transistor for integrated circuit structure and method for forming same |
07/28/1987 | US4682408 Semiconductors, silicon dioxide, silicon nitride, silanol, heat treatment, dopes, oxidation, masking |
07/28/1987 | US4682407 Means and method for stabilizing polycrystalline semiconductor layers |
07/28/1987 | US4682405 Methods for forming lateral and vertical DMOS transistors |
07/28/1987 | US4682404 MOSFET process using implantation through silicon |
07/28/1987 | US4682403 Method for interconnecting the active zones and gates of CMOS integrated circuits |
07/28/1987 | US4682402 Semiconductor device comprising polycrystalline silicon resistor element |
07/28/1987 | US4682396 Centering/positioning apparatus for wafer and vacuum chuck |
07/28/1987 | CA1224887A1 Production of semiconductor devices |
07/28/1987 | CA1224886A1 Semiconductor device and process for producing the same |
07/28/1987 | CA1224852A1 E beam stage with below-stage x-y drive |
07/28/1987 | CA1224839A1 X-ray lithography |
07/28/1987 | CA1224662A1 Correction of lithographic masks |
07/23/1987 | DE3701186A1 Integrated circuit device |
07/23/1987 | DE3701175A1 Output stage of an integrated semiconductor circuit |
07/23/1987 | DE3601829A1 Large-scale integrated electronic chip |
07/22/1987 | EP0229707A2 Method for forming deposited film |
07/22/1987 | EP0229687A2 Method of manufacturing wafers of semiconductor Material |
07/22/1987 | EP0229672A2 A heterojunction bipolar transistor having a base region of germanium |
07/22/1987 | EP0229633A2 Apparatus and method for laser-induced chemical vapor deposition |
07/22/1987 | EP0229629A2 Photosensitive resin composition |
07/22/1987 | EP0229574A1 Photovoltaic HgCdTe heterojunction detector, and method for its production |
07/22/1987 | EP0229518A2 Method for forming deposited film |
07/22/1987 | EP0229488A1 Etch resistant wafer boat and process |
07/22/1987 | EP0229427A1 Method of manufacturing a semiconductor device, in which a dopant is diffused from its oxide into a semiconductor body |
07/22/1987 | EP0229426A1 Method of manufacturing a semiconductor device, in which a metallization with a thick connection electrode is provided on a semiconductor body |
07/22/1987 | EP0229362A2 Semiconductor device and method of fabrication |
07/22/1987 | EP0229322A2 Method and apparatus for Czochralski single crystal growing |
07/22/1987 | EP0229263A2 Method of growing quaternary or pentanary compound semiconductor by MBE lattice-matched to substrate |
07/22/1987 | EP0229248A2 Progressive insertion placement of elements on an integrated system |
07/22/1987 | EP0229180A1 Process for manufacturing semiconductor devices |
07/22/1987 | EP0229104A1 Procedure for fabricating devices involving dry etching |
07/22/1987 | EP0229050A1 Chemical refill system. |
07/22/1987 | CN86108717A Method for forming electrode of iii-t semi-conducting elements |
07/22/1987 | CN86100187A Method resolving tin dioxide film |
07/21/1987 | US4682202 Master slice IC device |
07/21/1987 | US4682200 Semiconductor memory device with matched equivalent series resistances to the complementary data lines |
07/21/1987 | US4682197 Power transistor with spaced subtransistors having individual collectors |
07/21/1987 | US4681812 Reactively sputtered chrome silicon nitride resistors |
07/21/1987 | US4681799 Ultrathin polymeric imine films and process for making the same |
07/21/1987 | US4681795 Planarization of metal films for multilevel interconnects |
07/21/1987 | US4681778 Method and apparatus for making electrical connections utilizing a dielectric-like metal film |
07/21/1987 | US4681776 Improved method for double floating transport and processing of wafers |
07/21/1987 | US4681712 Molding process for plastics |
07/21/1987 | US4681666 Multilayer electrical interconnecting system |
07/21/1987 | US4681657 Preferential chemical etch for doped silicon |
07/21/1987 | US4681656 IC carrier system |
07/21/1987 | US4681655 Masking and etching an anodized aluminum support |
07/21/1987 | US4681654 Polyimide windows |
07/21/1987 | US4681653 Planarized dielectric deposited using plasma enhanced chemical vapor deposition |
07/21/1987 | US4681640 Germane, alkylgermanes, dimethylcadium, trimethylaluminum |
07/21/1987 | US4681453 Optoelectronic comparison apparatus for structures on plane surfaces or for planar structures |
07/21/1987 | US4681430 Method for focusing projection printer |
07/21/1987 | US4681221 Holder for plastic leaded chip carrier |
07/21/1987 | US4680893 Apparatus for polishing semiconductor wafers |
07/21/1987 | US4680855 Electronic device manufacturing methods |
07/21/1987 | US4680854 Forming low resistivity hillock free conductors in VLSI devices |
07/21/1987 | CA1224577A1 Variation and control of bond force |
07/21/1987 | CA1224576A1 Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making |
07/21/1987 | CA1224575A1 Heat sink mounting and method of making |
07/21/1987 | CA1224524A1 Chemically sensitive fet component |
07/16/1987 | WO1987004316A1 Ultra high density pad array chip carrier |
07/16/1987 | WO1987004300A1 Procedure for manufacturing a piezoresistive resistance element and apparatus applying said procedure, and pick-up manufactured by the procedure, in particular a pressure pick-up or equivalent |
07/16/1987 | WO1987004265A1 Apparatus incorporating phase conjugate mirrors |
07/16/1987 | WO1987004090A1 Method and apparatus for depositing monomolecular layers on a substrate |
07/15/1987 | EP0228973A1 Process and means for seizing and conveying silicon wafers |
07/15/1987 | EP0228963A2 Linescan inspection system for circuit boards |
07/15/1987 | EP0228956A1 High-frequency power transistor |
07/15/1987 | EP0228901A2 Wafer transfer apparatus |
07/15/1987 | EP0228870A2 Method for forming deposited film |
07/15/1987 | EP0228865A2 Magnetron-enhanced plasma etching process |
07/15/1987 | EP0228863A2 Method of dividing a substrate into a plurality of substrate portions |
07/15/1987 | EP0228815A2 Field effect transistors |
07/15/1987 | EP0228791A2 Materials for use in forming electronic interconnect |
07/15/1987 | EP0228764A1 Semiconductor device having at least one field-effect transistor with controlled source drain current |
07/15/1987 | EP0228761A1 Semiconductor non-volatile memory |
07/15/1987 | EP0228748A1 Method of producing an integrated lateral transistor, and integrated circuit containing it |
07/15/1987 | EP0228735A1 Illuminating device for generating masks |
07/15/1987 | EP0228502A1 Electron beam test apparatus for electronic device and method for using the same |
07/15/1987 | CN86107669A High definition anodized sublayer boundary |
07/15/1987 | CN86103067A Vlsi local interconnect method and structure |
07/14/1987 | US4680810 Means for controlling a semiconductor device and communication system comprising the means |
07/14/1987 | US4680698 High density ROM in separate isolation well on single with chip |
07/14/1987 | US4680619 Memory cells |
07/14/1987 | US4680617 Encapsulated electronic circuit device, and method and apparatus for making same |
07/14/1987 | US4680615 Silicon semiconductor component with an edge contour made by an etching technique, and method for manufacturing this component |
07/14/1987 | US4680614 Planar void free isolation structure |
07/14/1987 | US4680612 Aluminum interconnect layer |