Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/1987
11/03/1987US4704302 Oxygen or nitrogen
11/03/1987US4704301 Method of making low resistance contacts
11/03/1987US4704188 Wet chemical etching of crxsiynz
11/03/1987US4704187 Etching, pressing
11/03/1987US4704186 Monocrystalline silicon on uniformly thick silicon dioxide
11/03/1987US4704020 Projection optical apparatus
11/03/1987US4703920 Manufacturing method for integrated circuit chip carriers and work holder for use in the method
11/03/1987US4703566 Coveyor for vapor phase reflow system
11/03/1987US4703554 Technique for fabricating a sidewall base contact with extrinsic base-on-insulator
11/03/1987US4703552 Fabricating a CMOS transistor having low threshold voltages using self-aligned silicide polysilicon gates and silicide interconnect regions
11/03/1987US4703551 Process for forming LDD MOS/CMOS structures
11/03/1987CA1228936A1 Semiconductor devices
11/03/1987CA1228935A1 Semiconductor device with polycrystalline silicon active region and method of fabrication thereof
10/1987
10/31/1987CN86208776U High efficient, rapid heating annealing equipment
10/29/1987DE3713992A1 Verfahren zur bildung einer mehrschichtenstruktur A method for forming a multilayer structure
10/28/1987EP0243273A2 Method for planarizing semiconductor substrates
10/28/1987EP0243231A1 Process for preparing III-V group single crystal semi-isolators by doping, and use of the semi-isolators so obtained
10/28/1987EP0243074A2 Process for forming deposited film
10/28/1987EP0243070A2 Semiconductor device of III-V compound
10/28/1987EP0243034A2 Programmable bonding pad
10/28/1987EP0243024A2 Metallized semiconductor device including an interface layer
10/28/1987EP0242997A2 Valve incorporating wafer handling arm
10/28/1987EP0242996A2 Wafer handling arm
10/28/1987EP0242933A1 Active matrix display without a parasitic transistor and method for its manufacture
10/28/1987EP0242898A1 Apparatus comprising a plane susceptor rotating in parallel to a reference plane and arround an axis perpendicular to this plane
10/28/1987EP0242893A1 Method of manufacturing a semiconductor device
10/28/1987EP0242746A1 Method of making an integrated circuit
10/28/1987EP0242744A2 Method of manufacturing an integrated circuit semiconductor device comprising a lithography step
10/28/1987EP0242721A2 Boot-strap type signal generating circuit
10/28/1987EP0242652A2 Electron tuned quantum well device
10/28/1987EP0242626A2 Method for mounting electronic components on a substrate
10/28/1987EP0242623A2 MOS semiconductor device and method of manufacturing the same
10/28/1987EP0242558A2 Screenable paste for use as a barrier layer on a substrate during maskless cladding
10/28/1987EP0242540A1 Method and structure for reducing resistance in integrated circuits
10/28/1987EP0242506A2 Sidewall spacers for cmos circuits stress relief/isolation and method for making
10/28/1987EP0242489A1 Process for separating a rod into segments, cutter grinding machine for carrying out this process, and its use
10/28/1987CN86102688A Inhibition of self-doped silicon epitaxy by strong corrosion with bromine and mixed source
10/27/1987US4703457 Register circuit used to load, hold, and dump digital logic signals
10/27/1987US4703454 CMOS static storage cell having noncrossing interconnection conductors
10/27/1987US4703436 Wafer level integration technique
10/27/1987US4703434 Apparatus for measuring overlay error
10/27/1987US4703393 Mounting structure of flat-lead package-type electronic component
10/27/1987US4703336 Amorphous semiconductor film containing additive; defect reduction
10/27/1987US4703302 Resistance ladder network
10/27/1987US4703288 Interconnection lines for wafer-scale-integrated assemblies
10/27/1987US4703260 Full chip integrated circuit tester
10/27/1987US4703252 Apparatus and methods for resistivity testing
10/27/1987US4703196 High voltage precharging circuit
10/27/1987US4703185 Arrangement for optical imaging of two subjects located in different object planes
10/27/1987US4703183 Ion implantation chamber purification method and apparatus
10/27/1987US4703180 Microwave discharge type ion source for ion injection devices
10/27/1987US4703166 System for maintaining the optical alignment between stationary and moving equipment in deep-UV lithography
10/27/1987US4702993 Treatment of planarizing layer in multilayer electron beam resist
10/27/1987US4702992 Hydroxy-substituted diphenylamine and a methylol or alkoxymethyl substituted melamine
10/27/1987US4702976 Hermetic terminal assembly and method of manufacturing same
10/27/1987US4702967 Multiple-layer, multiple-phase titanium/nitrogen adhesion/diffusion barrier layer structure for gold-base microcircuit interconnection
10/27/1987US4702937 Method for manufacturing a semiconductor device
10/27/1987US4702797 Forming region of first conductivity type with high concentration of impurity
10/27/1987US4702796 High density region of first conductivity type
10/27/1987US4702795 Trench etch process
10/27/1987US4702792 Applying polymer to substrate, patterning, applying conductive material
10/27/1987US4702781 Liquid phase epitaxial growth method
10/27/1987US4702365 Apparatus for removing individual wafer segments from a framed carrier
10/27/1987US4702003 Method of fabricating a freestanding semiconductor connection
10/27/1987US4702000 Technique for elimination of polysilicon stringers in direct moat field oxide structure
10/27/1987US4701999 Method of making sealed housings containing delicate structures
10/27/1987US4701998 Removal of damaged areas of silicon substrate by forming silicone dioxide; etching
10/27/1987US4701995 Method of making a nonplanar buried-heterostructure distributed-feedback laser
10/27/1987CA1228681A1 Method for the manufacture of gate electrodes formed of double layers of metal silicides having a high melting point and doped polycrystalline silicon
10/27/1987CA1228680A1 Semiconductor device wiring including tunnelling layer
10/27/1987CA1228679A1 Devices formed utilizing organic materials
10/27/1987CA1228525A1 Method for growing gaas single crystal by a floating zone technique
10/27/1987CA1228524A1 Method for growing a gaas single crystal by pulling from gaas melt
10/27/1987CA1228475A1 Thick film conductor compositions
10/22/1987WO1987006392A1 Semiconductor device including an epitaxial layer on a lattice-mismatched single crystal substrate
10/22/1987WO1987006391A1 Ion beam scanning method and apparatus
10/22/1987WO1987006389A1 Semiconductor dopant vaporizer
10/22/1987WO1987006350A1 Accelerometer proof mass interface
10/22/1987WO1987006275A1 Method for depositing materials containing tellurium
10/22/1987DE3710503A1 Semiconductor integrated circuit device
10/22/1987DE3613181A1 Process for producing trenches with adjustable steepness of the trench walls in semiconductor substrates consisting of silicon
10/21/1987EP0242291A1 Charge transfer shift register provided with a floating diode reading device
10/21/1987EP0242226A2 Glass-ceramic materials with low firing temperature
10/21/1987EP0242207A2 Process for forming deposited film
10/21/1987EP0242182A2 Process for forming deposited film
10/21/1987EP0242178A2 Laser beam generator for use with an X-ray lithography system
10/21/1987EP0242151A1 Method and apparatus for measuring linewidths by surface profiles
10/21/1987EP0242125A2 Oscillation circuit for a piezo-electric resonator and method of controlling same
10/21/1987EP0242084A1 Preparation of semiconductor devices
10/21/1987EP0242067A2 Wafer processing system
10/21/1987EP0242066A2 Wafer positioning system
10/21/1987EP0242065A2 Wafer processing chuck using slanted clamping pins
10/21/1987EP0242064A2 Vacuum latch
10/21/1987EP0241988A2 High mobility semiconductor devices
10/21/1987EP0241948A1 Semiconductor memory and method for fabricating the same
10/21/1987EP0241932A2 Temperature detector
10/21/1987EP0241873A2 Fabrication of semiconductor devices utilizing patterned metal layers
10/21/1987EP0241871A2 Integrated circuit for implementing active filters without external components
10/21/1987EP0241744A2 Liquid-phase epitaxial process, especially for manufacturing three-dimensional semiconductor structures
10/21/1987EP0241739A1 Method of modifying surfaces and application of the method in forming layered structures
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