Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/1987
11/11/1987EP0244840A2 method of manufacturing MES FET
11/11/1987EP0244835A2 Langmuir-Blodgett ultrathin membrane of polyfumurate
11/11/1987EP0244816A2 Mask pattern defect detection apparatus
11/11/1987EP0244772A1 Wafer cassette transfer mechanismand method
11/11/1987EP0244763A2 Positive-working photosensitive composition and photosensitive recording material prepared therefrom
11/11/1987EP0244762A2 Photosensitive positive composition and photosensitive registration material prepared therefrom
11/11/1987EP0244696A2 Method of fabricating a multilayered ceramic substrate having solid non-porous metal conductors
11/11/1987EP0244666A2 Balltape structure for tape automated bonding, multilayer packaging and universal chip interconnection
11/11/1987EP0244607A1 Method of producing optimized CMOS field effect transistors of the VLSI technique
11/11/1987EP0244605A2 Integrated circuit logic array unit for the construction of integrated circuits
11/11/1987EP0244530A2 Thin oxide fuse in an integrated circuit
11/11/1987EP0244504A2 X-ray source
11/11/1987EP0244496A1 Lithographic mask for ions, electrons or X-rays, and process for its production
11/11/1987EP0244477A1 Fill and spill for charge input to a ccd
11/11/1987EP0244462A1 Method for forming vertical interconnects in polyimide insulating layers
11/11/1987EP0244452A1 Subcollector for bipolar transistors
11/10/1987US4706157 Semiconductor intergrated circuit
11/10/1987US4706105 Semiconductor device and method of producing the same
11/10/1987US4706019 Electron beam test probe system for analyzing integrated circuits
11/10/1987US4706018 Noncontact dynamic tester for integrated circuits
11/10/1987US4706015 Method and circuit for reducing contact resistance of the potential probes of a four-point-probe in contact with a III-V compound semiconductor wafer
11/10/1987US4705966 Circuit for generating a substrate bias
11/10/1987US4705956 Electron image projector
11/10/1987US4705951 Wafer processing system
11/10/1987US4705950 Specimen-exchanging apparatus
11/10/1987US4705940 Focus detection in a projection optical system
11/10/1987US4705760 Preparation of a surface for deposition of a passinating layer
11/10/1987US4705700 Chemical vapor deposition method for the thin film of semiconductor
11/10/1987US4705698 Isolation of semiconductor contacts
11/10/1987US4705606 Thin-film electrical connections for integrated circuits
11/10/1987US4705599 Method for fabricating bipolar transistor in integrated circuit
11/10/1987US4705597 Photoresist tapering process
11/10/1987US4705596 Simultaneous plasma sculpturing and dual tapered aperture etch
11/10/1987US4705595 Method for microwave plasma processing
11/10/1987US4705593 Halogen free radicals
11/10/1987US4705591 Pulling processes and equipment for growing silicon crystals having high and controlled carbon content
11/10/1987US4705444 Apparatus for automated cassette handling
11/10/1987US4705322 Protection of inductive load switching transistors from inductive surge created overvoltage conditions
11/10/1987US4704785 Process for making a buried conductor by fusing two wafers
11/10/1987US4704784 Method of making thin film field effect transistors for a liquid crystal display device
11/10/1987US4704783 Method for passivating the back channel of amorphous silicon field effect transistors
11/10/1987CA1229180A1 Method of forming an insulator on a patterned conductive layer
11/05/1987WO1987006767A1 Surface mountable diode
11/05/1987WO1987006764A1 Process for manufacturing semiconductor devices
11/05/1987WO1987006763A1 Method for encapsulating integrated circuits
11/05/1987WO1987006762A1 Production of semiconductor devices
11/05/1987WO1987006725A2 Method and apparatus for spreading resin by centrifugation
11/05/1987WO1987006566A1 Automatic wafer loading method and apparatus
11/05/1987WO1987006561A1 Modular semiconductor wafer transport and processing system
11/05/1987DE3714305A1 Device and method for the scanning of surfaces
11/05/1987DE3714045A1 Handhabungsarm fuer halbleitersubstrate Tiller for semiconductor substrates
11/05/1987DE3614849A1 Method for producing a welded joint between the contact element of a semiconductor and an electrical connector
11/04/1987EP0244367A2 Mos type integrated semiconductor device with nonuniform thickness of gate oxide and process for fabricating it
11/04/1987EP0244366A2 Self-aligned process for fabricating small size DMOS cells and MOS devices obtained by means of said process
11/04/1987EP0244322A1 Encapsulation method for integrated circuits
11/04/1987EP0244304A1 Process for the selective dry-etchung of layers of III-V semiconductor materials, and transistor manufactured by this process
11/04/1987EP0244246A2 A method of making a dimensionally stable X-ray mask
11/04/1987EP0244202A2 Wafer transfer system
11/04/1987EP0244171A1 Bipolar transistor having an implanted extrinsic base region
11/04/1987EP0244140A2 A semiconductor device with periodic structure
11/04/1987EP0244137A2 Semiconductor wafer processing
11/04/1987EP0244081A1 Method for forming crystal and crystal article obtained by said method
11/04/1987EP0244070A2 Rapid curing, thermally stable adhesive
11/04/1987EP0244040A2 Method to separate non-crystalline objects, in particular thick-film substrates
11/04/1987EP0244019A1 Method of manufacturing a semiconductor device, in which a negative image is formed on a semiconductor substrate in a positive photolacquer
11/04/1987EP0243999A2 Fabrication process for EPROM cells with oxide-nitride-oxide dielectric
11/04/1987EP0243988A1 Method of manufacturing a semiconductor device
11/04/1987EP0243964A2 Photosensitive positive composition and photosensitive registration material prepared therefrom
11/04/1987EP0243953A2 Compound semiconductor device
11/04/1987EP0243858A2 Method and means for co-sintering ceramic/metal MLC substrates
11/04/1987EP0243850A2 Selective epitaxial layer field oxide (sel-fox) isolation
11/04/1987EP0243804A2 Schmitt integrated circuit with selectable thresholds.
11/04/1987EP0243723A2 A method for bonding a layer containing a refractory metal to a substrate
11/04/1987EP0243707A2 A method of establishing a conductive via path
11/04/1987EP0243639A2 System for automatic inspection of periodic patterns
11/04/1987EP0243638A2 Microweld apparatus with an improved electrode tip design
11/04/1987EP0243626A2 Method of making multilayered ceramic structures having an internal distribution of copper-based conductors
11/04/1987EP0243622A2 Shallow junction complementary vertical bipolar transistor pair
11/04/1987EP0243621A2 Bonding method and apparatus
11/04/1987EP0243609A1 Complementary semiconductor device structure and its production
11/04/1987EP0243520A1 Interferometric mask-wafer alignment
11/04/1987EP0243499A1 Electronic device having a power supply input circuit in which noise from static electricity is suppressed
11/04/1987EP0243416A1 Process for operating a gas inlet device for reactors.
11/04/1987EP0243392A1 A method of producing isolated silicon structures
11/04/1987EP0243378A1 Lattice-graded epilayers
11/04/1987CN87102640A Rapid curing, thermally stable adhesive
11/03/1987USH368 Vertical gradient of electrical resistance
11/03/1987US4704705 Two transistor DRAM cell and array
11/03/1987US4704678 Function set for a microcomputer
11/03/1987US4704526 Apparatus of regulating shape of focused ion beams
11/03/1987US4704525 Construction for positioning photosensor devices
11/03/1987US4704369 Method of severing a semiconductor device
11/03/1987US4704368 Method of making trench-incorporated monolithic semiconductor capacitor and high density dynamic memory cells including the capacitor
11/03/1987US4704367 Metal films on integrated circuits
11/03/1987US4704348 Adjustment of temperature and humidity to keep water content constant
11/03/1987US4704347 Method of manufacturing a semiconductor device, in which a photolacquer mask is formed by means of a two-layer lacquer system.
11/03/1987US4704346 Mercury as light-emitting discharge component
11/03/1987US4704320 Semiconductors, gap between ceramic base and conductor layer relieves stress
11/03/1987US4704319 Apparatus and method for fabricating modules comprising stacked circuit-carrying layers
11/03/1987US4704304 Method for repair of opens in thin film lines on a substrate
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