| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/08/1997 | US5646059 Process for fabricating non-volatile memory cells having improved voltage coupling ratio by utilizing liquid phase |
| 07/08/1997 | US5646058 Method for fabricating a self-aligned double-gate MOSFET by selective lateral epitaxy |
| 07/08/1997 | US5646057 Method for a MOS device manufacturing |
| 07/08/1997 | US5646056 Method of fabricating ultra-large-scale integration metal-oxide semiconductor field effect transistor |
| 07/08/1997 | US5646055 Method for making bipolar transistor |
| 07/08/1997 | US5646054 Method for manufacturing MOS transistor of high breakdown voltage |
| 07/08/1997 | US5646053 Vapor depositing a scavenger layer direct over semiconductor, etching to form shallow grooves, filling with a polish stop structure, annealing and polishing |
| 07/08/1997 | US5646052 Isolation region structure of semiconductor device and method for making |
| 07/08/1997 | US5646050 Increasing stabilized performance of amorphous silicon based devices produced by highly hydrogen diluted lower temperature plasma deposition |
| 07/08/1997 | US5645976 Capacitor apparatus and method of manufacture of same |
| 07/08/1997 | US5645947 Silicon-containing deposited film |
| 07/08/1997 | US5645943 Electrified object contact component |
| 07/08/1997 | US5645937 At least two diamond layers and at least one interlayer of brazing alloy containing at least one carbide-forming metal |
| 07/08/1997 | US5645921 Electrostatic chucking device |
| 07/08/1997 | US5645887 In large scale integrated circuits, heat treating platinum layer formed over silicon plug |
| 07/08/1997 | US5645864 Resin encapsulating molding die for manufacturing a semiconductor device |
| 07/08/1997 | US5645787 Sealing semiconductor chip by transfer molding |
| 07/08/1997 | US5645737 Wet clean for a surface having an exposed silicon/silica interface |
| 07/08/1997 | US5645736 Coating the surface a film forming binder with suspended particles, applying a wash to dissolve the film and release the particles for abrasion |
| 07/08/1997 | US5645707 Bonding method for chip-type electronic parts |
| 07/08/1997 | US5645684 Microelectromechanical systems, electronic circuits and mechanical devices integrated on the same chip |
| 07/08/1997 | US5645683 Etching method for etching a semiconductor substrate having a silicide layer and a polysilicon layer |
| 07/08/1997 | US5645675 Selective planarization apparatus |
| 07/08/1997 | US5645673 Lamination process for producing non-planar substrates |
| 07/08/1997 | US5645646 Susceptor for deposition apparatus |
| 07/08/1997 | US5645645 Method and apparatus for plasma treatment of a surface |
| 07/08/1997 | US5645474 Workpiece retaining device and method for producing the same |
| 07/08/1997 | US5645419 Heat treatment method and device |
| 07/08/1997 | US5645393 IC stocker, IC unloading and positioning apparatus, and IC feed system |
| 07/08/1997 | US5645391 Substrate transfer apparatus, and method of transferring substrates |
| 07/08/1997 | US5645123 Semiconductor device having temperature regulation means formed in circuit board |
| 07/08/1997 | US5644899 Method for packaging semiconductor components for shipment |
| 07/03/1997 | WO1997024021A1 Substrate for mounting electronic part and process for manufacturing the same |
| 07/03/1997 | WO1997023945A1 Low voltage electrostatic clamp for substrates such as dielectric substrates |
| 07/03/1997 | WO1997023910A1 Silicon bipolar junction transistor having reduced emitter line width |
| 07/03/1997 | WO1997023908A1 Bicmos semiconductor device comprising a silicon body with locos and oxide filled groove regions for insulation |
| 07/03/1997 | WO1997023907A1 Reduced pitch laser redundancy fuse bank structure |
| 07/03/1997 | WO1997023906A1 Semiconductor storage device and method for manufacturing the same |
| 07/03/1997 | WO1997023905A2 Method of producing a neuron mos transistor on the basis of a cmos process |
| 07/03/1997 | WO1997023904A1 Process for producing contacts on electrical components suitable for a flip-chip assembly |
| 07/03/1997 | WO1997023903A1 Method of placing contacts onto a substrate |
| 07/03/1997 | WO1997023902A2 Process for producing an mos transistor |
| 07/03/1997 | WO1997023901A1 Method of manufacturing a resurf semiconductor device, and a semiconductor device manufactured by such a method |
| 07/03/1997 | WO1997023900A1 Method of manufacturing a semiconductor device with a pn junction provided through epitaxy |
| 07/03/1997 | WO1997023899A1 Shape memory alloy lift pins for semiconductor processing equipment |
| 07/03/1997 | WO1997023898A1 Electrostatic clamp with lip seal for clamping substrates |
| 07/03/1997 | WO1997023886A1 Electrode structure and method of making for ferroelectric capacitor integrated on silicon |
| 07/03/1997 | WO1997023843A1 Process for producing a chip card for contactless operation |
| 07/03/1997 | WO1997023808A2 A mixed solvent system for positive photoresists |
| 07/03/1997 | WO1997023806A1 Active matrix substrate, production method of active matrix substrate, liquid crystal display device and electronic equipment |
| 07/03/1997 | WO1997020350A3 Semiconductor device with schottky contact and a process for the production thereof |
| 07/03/1997 | DE19654753A1 MOSFET manufacturing method |
| 07/03/1997 | DE19654738A1 Semiconductor memory manufacturing method for e.g. DRAM |
| 07/03/1997 | DE19654737A1 Semiconductor device for LSI devices |
| 07/03/1997 | DE19654717A1 ZnO-Dünnfilmelektrodenstruktur, welche eine mit Sauerstoff dicht gepackte Polykristalloxiddünnfilmschicht verwendet, und deren Herstellungsverfahren ZnO thin film electrode structure used with a close-packed oxygen Polykristalloxiddünnfilmschicht, and their method of preparation |
| 07/03/1997 | DE19654697A1 Substrat mit Silicium auf einem Isolator und Verfahren zu dessen Herstellung With silicon on insulator substrate and process for its preparation |
| 07/03/1997 | DE19654686A1 Triple trough in semiconductor component formation method for MOSFET manufacture |
| 07/03/1997 | DE19654561A1 Speicherzellenfeld Memory cell array |
| 07/03/1997 | DE19654280A1 Halbleitereinrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 07/03/1997 | DE19654163A1 Bilateral protective device for ESD protection of semiconductor circuit |
| 07/03/1997 | DE19653656A1 Halbleitereinrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 07/03/1997 | DE19653632A1 Substrat mit Silizium auf einem Isolator und Verfahren zur Herstellung desselben Of the same substrate of silicon on an insulator and methods for preparing |
| 07/03/1997 | DE19653614A1 Connection or interconnection formation method for semiconductor component |
| 07/03/1997 | DE19653493A1 Titanium silicide interconnection manufacturing method for semiconductor MOS transistor |
| 07/03/1997 | DE19653199A1 Verfahren zur Herstellung eines Substrates mit Silicium auf einem Isolator A process for producing a substrate with silicon on an insulator |
| 07/03/1997 | DE19651605A1 Epitaxial pinch-effect resistor manufacturing method using dopant implantation |
| 07/03/1997 | DE19650802A1 Semiconductor device, e.g. laser diode, for high frequency optical communication |
| 07/03/1997 | DE19629894A1 MOSFET manufacturing method |
| 07/03/1997 | DE19623156A1 Laminated coupling structure for semiconductor memory |
| 07/03/1997 | DE19618731A1 Semiconductor component manufacturing method for lightly doped drain MOSFET |
| 07/03/1997 | DE19617632A1 Non-volatile memory cell device, e.g. ROM cell |
| 07/03/1997 | DE19603654C1 Verfahren zum Löten eines Halbleiterkörpers auf eine Trägerplatte und Halbleiterkörper zur Durchführung des Verfahrens A method for soldering a semiconductor body on a support plate and the semiconductor body for performing the method |
| 07/03/1997 | DE19601055A1 Soldering area elements |
| 07/03/1997 | DE19548845A1 Czochralski single crystal pulling apparatus |
| 07/03/1997 | CA2241685A1 Electrode structure and method of making for ferroelectric capacitor integrated on silicon |
| 07/03/1997 | CA2241037A1 Method for the production of contacts of electrical components, said contacts being suitable for flip-chip mounting |
| 07/03/1997 | CA2240503A1 Process for producing a chip card for contactless operation |
| 07/02/1997 | EP0782254A1 Microelectronic device package and method |
| 07/02/1997 | EP0782224A1 Low profile optical subassembly |
| 07/02/1997 | EP0782202A2 Compound semiconductor epitaxial wafer |
| 07/02/1997 | EP0782201A1 MOS-technology power device integrated structure |
| 07/02/1997 | EP0782199A2 High voltage semiconductor device and method for manufacturing the same |
| 07/02/1997 | EP0782198A2 High-voltage bipolar transistor utilizing field-terminated bond-pad electrodes |
| 07/02/1997 | EP0782196A1 Method of fabricating EEPROM memory devices and EEPROM memory device so formed |
| 07/02/1997 | EP0782195A2 Dynamic random access memory having a stacked fin capacitor with reduced fin thickness |
| 07/02/1997 | EP0782194A2 A high voltage breakdown isolation semiconductor device and manufacturing process for making the device |
| 07/02/1997 | EP0782192A1 Electrostatic discharge structure of semiconductor device |
| 07/02/1997 | EP0782190A2 Semiconductor device comprising an inductor element |
| 07/02/1997 | EP0782189A2 Aluminium alloy for on-chip wiring applications |
| 07/02/1997 | EP0782188A2 High density gate array cell architecture |
| 07/02/1997 | EP0782186A2 Method to form a buried, implanted plate for DRAM trench storage capacitors |
| 07/02/1997 | EP0782185A2 Process of fabricating semiconductor device having isolating oxide rising out of groove |
| 07/02/1997 | EP0782184A1 Heat dissipating and supporting structure for a package |
| 07/02/1997 | EP0782183A2 Methods of fabrication of submicron features in semiconductor devices |
| 07/02/1997 | EP0782182A2 MOS transistor and manufacturing method of the same |
| 07/02/1997 | EP0782181A2 Method of manufacturing VDMOS with a termination structure |
| 07/02/1997 | EP0782179A2 Method of manufacturing semiconductor mirror wafers |
| 07/02/1997 | EP0782178A1 Solid phase epitaxial crystallization of amorphous silicon films on insulating substrates |
| 07/02/1997 | EP0782177A2 Improvements in or relating to semiconductors |
| 07/02/1997 | EP0782176A2 Deposited-film forming process and deposited-film forming apparatus |