Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/1998
05/05/1998US5747802 Automated non-visual method of locating periodically arranged sub-micron objects
05/05/1998US5747788 Solid state image sensor with reinforced fringe electric field at its charge transfer section
05/05/1998US5747780 Apparatus for conveying and processing a wafer in a physically contact-free state
05/05/1998US5747779 Method of fusing and programming fuse frame
05/05/1998US5747692 Sensor system for determining acceleration
05/05/1998US5747389 Crack resistant passivation layer
05/05/1998US5747388 Antireflection layer and process for lithographically structuring a layer
05/05/1998US5747387 Removal method of organic matter and system for the same
05/05/1998US5747386 Rotary coupling
05/05/1998US5747385 Method of planarizing interlayer dielectric
05/05/1998US5747384 Process of forming a refractory metal thin film
05/05/1998US5747383 Method for forming conductive lines and stacked vias
05/05/1998US5747382 Two-step planarization process using chemical-mechanical polishing and reactive-ion-etching
05/05/1998US5747381 Technique for the removal of residual spin-on-glass (SOG) after full SOG etchback
05/05/1998US5747380 Robust end-point detection for contact and via etching
05/05/1998US5747379 Method of fabricating seamless tungsten plug employing tungsten redeposition and etch back
05/05/1998US5747378 The phosphorus ions of phosphoric silicate glass can be diffused into substrate to form the source/drain regions by a high temperature during thermal annealing process
05/05/1998US5747377 Using hemispherical grain silicon as mask
05/05/1998US5747376 Method for fabricating isolation layer of semiconductor device
05/05/1998US5747375 Method of manufacturing a semiconductor integrated circuit device
05/05/1998US5747374 Methods of fabricating bipolar transistors having separately formed intrinsic base and link-up regions
05/05/1998US5747373 Double insulator featuring a lightly doped, a medium doped and a heavily doped source and drain region; configuration increases device performance and reliability
05/05/1998US5747372 Semiconductor device and method for fabricating same
05/05/1998US5747371 Method of manufacturing vertical MOSFET
05/05/1998US5747370 Method of manufacturing a non-volatile semiconductor device
05/05/1998US5747369 Forming silicon nitride or oxynitride or oxide etch stop layer over conductive layer, depositing photoresist layer, patterning photoresist to protect first plate, removing etch stop layer not protected by masking, removing phtoresist
05/05/1998US5747368 Process for manufacturing CMOS device
05/05/1998US5747367 Direct coupling affording lower parasitic resistance, higher performance and faster switching circuits of transitors of different levels and spaced by a dielectric
05/05/1998US5747364 Mirror chamfering or etching the periferal portions of the wafers after the non-wax polishing step
05/05/1998US5747362 Method of manufacturing a semiconductor device in which a layer of material is deposited on the surface of a semiconductor wafer from a process gas
05/05/1998US5747360 Method of metalizing a semiconductor wafer
05/05/1998US5747359 Method of patterning polysilicon layers on substrate
05/05/1998US5747358 Method of forming raised metallic contacts on electrical circuits
05/05/1998US5747357 Modified poly-buffered isolation
05/05/1998US5747356 Method for manufacturing ISRC MOSFET
05/05/1998US5747355 Method for producing a transistor using anodic oxidation
05/05/1998US5747354 Semiconductor device having an improved anti-radioactivity and method of fabricating the same
05/05/1998US5747222 Multi-layered circuit substrate and manufacturing method thereof
05/05/1998US5747221 Photolithography method and photolithography system for performing the method
05/05/1998US5747218 Naphthoquinonediazide sulfonic acid tetraester of polyhydroxypolyphenols
05/05/1998US5747202 Projection exposure method
05/05/1998US5747116 Method of forming an electrical contact to a silicon substrate
05/05/1998US5747101 Thermoplastic adhesive pastes on semiconductor wafer substrates
05/05/1998US5747095 Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages
05/05/1998US5746928 Postioning a dummy wafer on an elctrostatic wafer chuck, evacuating process chamber, applying radio frequency voltage of preferential wattage, turning off power, removing wafer, adhered debris and contamination
05/05/1998US5746884 Fluted via formation for superior metal step coverage
05/05/1998US5746883 Apparatus for bonding semiconductor wafers
05/05/1998US5746875 Gas injection slit nozzle for a plasma process reactor
05/05/1998US5746874 Forming cavities in semiconductor substrates
05/05/1998US5746868 Multilevel interconnections are connected through vias
05/05/1998US5746841 Process for passivating treatment of piping system for high-purity gas
05/05/1998US5746834 Method and apparatus for purging barrel reactors
05/05/1998US5746832 Apparatus for depositing particles onto a wafer
05/05/1998US5746829 Window-containing sealed containers for concentrating impurities in semiconductors by radiating a specified position with a laser beam at an energy level below that of the energy of vaporization of the crystal
05/05/1998US5746826 Using crystal growing technique
05/05/1998US5746652 Activated air showering system for clean room and method for controlling the same
05/05/1998US5746591 Semiconductor furnace for reducing particulates in a quartz tube and boat
05/05/1998US5746565 Robotic wafer handler
05/05/1998US5746562 Processing system and device manufacturing method using the same
05/05/1998US5746462 Flexible vacuum pick-up device
05/05/1998US5746460 End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
05/05/1998US5746434 Chamber interfacing O-rings and method for implementing same
05/05/1998US5746422 Clamping device
05/05/1998US5746319 Tray for integrated circuits
05/05/1998US5746267 Monolithic metal matrix composite
05/05/1998US5746233 Washing apparatus and method therefor
05/05/1998US5746008 Electronic substrate processing system using portable closed containers
05/05/1998US5745990 Titanium boride and titanium silicide contact barrier formation for integrated circuits
05/05/1998US5745986 Method of planarizing an array of plastically deformable contacts on an integrated circuit package to compensate for surface warpage
05/05/1998US5745985 Method of attaching a semiconductor microchip to a circuit board
05/05/1998US5745984 Method for making an electronic module
05/05/1998US5745946 Substrate processing system
05/05/1998CA2107869C Method and apparatus for fabricating high fin density heatsinks
05/05/1998CA1339852C Platinum and rhodium calalysis of low temperature formation multilayer ceramics
05/04/1998CA2216464A1 Thermal processor for semiconductor wafers
04/1998
04/30/1998WO1998018304A1 Method and device for positioning and retaining micro-building-blocks
04/30/1998WO1998018303A1 A system and method for packaging integrated circuits
04/30/1998WO1998018165A1 Memory storage cell and method of manufacturing a non-volatile storage cell
04/30/1998WO1998018164A1 Semiconductor device, method for manufacturing the same, circuit board, and flexible substrate
04/30/1998WO1998018162A1 Film carrier tape and semiconductor device, method for manufacturing them, and circuit board
04/30/1998WO1998018161A1 Semiconductor device, method of its manufacture, circuit substrate, and film carrier tape
04/30/1998WO1998018159A1 Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
04/30/1998WO1998018158A1 Polysilicon plug sram load
04/30/1998WO1998018157A1 Two-stage kinematic mount
04/30/1998WO1998018156A1 Substrate treatment device
04/30/1998WO1998018155A1 Substrate treatment device
04/30/1998WO1998018154A1 Substrate treatment device
04/30/1998WO1998018153A1 Substrate treatment device
04/30/1998WO1998018152A2 Programmable integrated passive devices and methods therefor
04/30/1998WO1998018066A2 Method and system for assessing a measurement procedure and measurement-induced uncertainties on a batchwise manufacturing process of discrete products
04/30/1998WO1998017831A1 Method for modifying the structure of near-surface thin material layers
04/30/1998WO1998017483A1 Apparatus and method for recovering photoresist developers and strippers
04/30/1998WO1998006133A3 Process for manufacturing an infrared-emitting luminescent diode
04/30/1998DE19747773A1 Method of correcting lighting patterns
04/30/1998DE19746113A1 Voltage supply circuit with feedback voltage source
04/30/1998DE19745575A1 Terminal electrode structure with substrate containing several terminal points
04/30/1998DE19723262A1 Halbleiterschaltungsvorrichtung, die eine sicherungsprogrammierbare Bestanden/Durchgefallen- Identifizierungsschaltung aufweist, und Bestanden/Durchgefallen-Bestimmungsverfahren für dieselbe A semiconductor circuit device having a fuse programmable pass / Durchgefallen- identification circuit, and pass / fail determination method for the same
04/30/1998DE19717368A1 Wire bonding system for semiconductor component
04/30/1998DE19712561C1 Silicon carbide semiconductor device e.g. lateral or vertical MOSFET
04/30/1998DE19645146A1 Etch pit density detector for semiconductor wafer processing
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