| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/28/1998 | US5785757 Apparatus for fabricating a single-crystal |
| 07/28/1998 | US5785755 Growing layers of different compositions; tributylphosphine in standby step |
| 07/28/1998 | US5785584 Planarizing apparatus with deflectable polishing pad |
| 07/28/1998 | US5785236 Advanced copper interconnect system that is compatible with existing IC wire bonding technology |
| 07/28/1998 | US5785234 Method of surface-contacting electronic components |
| 07/28/1998 | US5785225 Frangible semiconductor wafer dicing apparatus which employs scribing and breaking |
| 07/28/1998 | US5785186 Substrate housing and docking system |
| 07/28/1998 | US5785155 Linear motion clamping unit |
| 07/28/1998 | US5785068 Substrate spin cleaning apparatus |
| 07/28/1998 | US5784925 Vacuum compatible linear motion device |
| 07/28/1998 | US5784802 Semiconductor processing systems |
| 07/28/1998 | US5784799 Vacuum processing apparatus for substate wafers |
| 07/28/1998 | US5784797 Carrierless centrifugal semiconductor processing system |
| 07/28/1998 | US5784782 Method for fabricating printed circuit boards with cavities |
| 07/28/1998 | US5784781 Manufacturing process for organic chip carrier |
| 07/28/1998 | US5784780 Method of mounting a flip-chip |
| 07/28/1998 | US5784779 Method for joining an electrical connection of a non-packaged IC component with a conductive strip on a substrate |
| 07/28/1998 | CA2107174C Epitaxial magnesium oxide as a buffer layer on (111) tetrahedral semiconductors |
| 07/28/1998 | CA2105270C Electro-optic sampling |
| 07/28/1998 | CA2075020C Method for preparing semiconductor member |
| 07/28/1998 | CA2059368C Method of producing semiconductor substrate |
| 07/28/1998 | CA2055675C Method for forming crystal article |
| 07/23/1998 | WO1998032200A1 Excimer laser with greater spectral bandwidth and beam stability |
| 07/23/1998 | WO1998032178A1 JUNCTION TERMINATION FOR SiC SCHOTTKY DIODE |
| 07/23/1998 | WO1998032177A1 A SCHOTTKY DIODE OF SiC AND A METHOD FOR PRODUCTION THEREOF |
| 07/23/1998 | WO1998032176A1 As/P HYBRID nLDD JUNCTION AND MEDIUM Vdd OPERATION FOR HIGH SPEED MICROPROCESSORS |
| 07/23/1998 | WO1998032175A1 Semiconductor device provided with a metallization with a barrier layer comprising at least titanium, tungsten, or nitrogen, and method of manufacturing same |
| 07/23/1998 | WO1998032170A1 Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment |
| 07/23/1998 | WO1998032169A1 Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections |
| 07/23/1998 | WO1998032168A1 Method for doping metallic connecting wire |
| 07/23/1998 | WO1998032167A1 Method for forming salient electrode, and method for wire bonding of semiconductor element |
| 07/23/1998 | WO1998032166A1 Method for producing a silicium capacitor |
| 07/23/1998 | WO1998032165A1 Method for controlling the temperature of a growing semiconductor layer |
| 07/23/1998 | WO1998032164A1 A method of producing thin silicon films |
| 07/23/1998 | WO1998032163A1 Gas phase silicon etching with bromine trifluoride |
| 07/23/1998 | WO1998032162A1 Pattern forming method |
| 07/23/1998 | WO1998032161A1 Dual arm linear hand-off wafer transfer assembly |
| 07/23/1998 | WO1998032160A1 Component taping method and apparatus |
| 07/23/1998 | WO1998032159A2 Mounting structure and mounting process from semiconductor devices |
| 07/23/1998 | WO1998032154A1 Capacitively coupled rf-plasma reactor |
| 07/23/1998 | WO1998032060A1 Fluid temperature control device and method therefor |
| 07/23/1998 | WO1998032054A1 Methods and apparatus for integrating optical and interferometric lithography to produce complex patterns |
| 07/23/1998 | WO1998031768A1 A composition for cleaning and etching electronic display and substrate |
| 07/23/1998 | WO1998031738A1 Thermosetting resin compositions |
| 07/23/1998 | WO1998020535A3 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias |
| 07/23/1998 | DE19757417A1 Integrated semiconductor circuitry on substrate for static RAM |
| 07/23/1998 | DE19756569A1 Forming laminated ceramic substrate with conductive contacts on one main surface |
| 07/23/1998 | DE19740534A1 Semiconductor device, especially DRAM, with multilevel connection structure |
| 07/23/1998 | DE19737837A1 DRAM with memory cell array in matrix of lines and columns for DRAM testing |
| 07/23/1998 | DE19725857A1 Read only memory structure and manufacturing method |
| 07/23/1998 | DE19723651A1 Read only memory structure |
| 07/23/1998 | DE19702125A1 Production of treatment gas used in printed circuit board assemblies |
| 07/23/1998 | DE19702124A1 Workpiece surface cleaning, activating, wetting and/or coating |
| 07/23/1998 | DE19701568C1 Structured layer formation for micro-engineered functional system |
| 07/23/1998 | CA2278174A1 A method of producing thin silicon films |
| 07/23/1998 | CA2278020A1 Method for doping metallic connecting wire |
| 07/23/1998 | CA2278006A1 Mounting structure and mounting process from semiconductor devices |
| 07/23/1998 | CA2227686A1 A method for the heat treatment of ii-vi semiconductors |
| 07/22/1998 | EP0854580A2 Digital to analogue converter |
| 07/22/1998 | EP0854577A2 Semiconductor integrated circuit |
| 07/22/1998 | EP0854519A1 SOI MOS field effect transistor |
| 07/22/1998 | EP0854517A2 A solid-state imaging device |
| 07/22/1998 | EP0854515A1 A floating gate cell for a semiconductor memory array and method of fabrication |
| 07/22/1998 | EP0854514A1 An asymmetric cell for a semiconductor memory array and a manufacturing method therefor |
| 07/22/1998 | EP0854513A2 Improvements in or relating to semiconductor device packaging |
| 07/22/1998 | EP0854512A2 Integrated device for the microwave band |
| 07/22/1998 | EP0854510A2 Mask removal for etching a DRAM capacitor trench |
| 07/22/1998 | EP0854509A1 Fabrication method for non-volatile memory with high-voltage and logic components |
| 07/22/1998 | EP0854508A2 Method of forming contact structure |
| 07/22/1998 | EP0854507A2 Precursor with (alkyloxy) (alkyl) silylolefin ligand to deposit copper and method for the same |
| 07/22/1998 | EP0854506A2 Electrically connecting member and electric circuit member |
| 07/22/1998 | EP0854505A2 Process of depositing a TiN based film during the fabrication of a semiconductor device |
| 07/22/1998 | EP0854504A1 Coating solutions for use in forming bismuth-based ferro-electric thin films, and ferro-electric thin films, ferro-electric capacitors and ferro-electric memories formed with said coating solutions, as well as processes for production thereof |
| 07/22/1998 | EP0854503A1 Coating solutions for use in forming bismuth-based ferro-electric thin films, and ferro-electric thin films, ferro-electric capacitors and ferro-electric memories formed with said coating solutions, as well as processes for production thereof |
| 07/22/1998 | EP0854502A2 Iodofluorocarbon gas for the etching of dielectric layers and the cleaning of process chambers |
| 07/22/1998 | EP0854501A2 Process for forming hole structures in a silicon substrate by electrochemical etching |
| 07/22/1998 | EP0854500A1 Method of manufacturing a bonding substrate |
| 07/22/1998 | EP0854499A2 Substrate transporting and processing system |
| 07/22/1998 | EP0854498A1 Ultra-clean transport carrier |
| 07/22/1998 | EP0854494A2 Dose control for use in an ion implanter |
| 07/22/1998 | EP0854430A2 A method for optimizing integrated circuit fabrication |
| 07/22/1998 | EP0854374A2 Illumination apparatus with a high laser damage threshold and pattern transfer apparatus comprising the same |
| 07/22/1998 | EP0854211A1 Method of manufacturing silicon monocrystal, and seed crystal used in the method |
| 07/22/1998 | EP0854205A1 Work surface treatment method and work surface treatment apparatus |
| 07/22/1998 | EP0854179A1 Circuit board adhesives for soldering environments |
| 07/22/1998 | EP0853840A1 A semi-conductor integrated circuit |
| 07/22/1998 | EP0853820A1 Nonvolatile reprogrammable interconnect cell with fn tunneling and programming method thereof |
| 07/22/1998 | EP0853819A1 Mos transistor with high output voltage endurance |
| 07/22/1998 | EP0853816A1 Connecting multiple microelectronic elements with lead deformation |
| 07/22/1998 | EP0853815A1 Formation of source/drain from doped glass |
| 07/22/1998 | EP0853814A1 An efficient and economical method of planarization of multilevel metallization structures in integrated circuits using cmp |
| 07/22/1998 | EP0853792A1 Method of producing a digital signal processor |
| 07/22/1998 | EP0853600A2 A method of biaxially aligning crystalline material |
| 07/22/1998 | EP0794847B1 Process for bonding wires to oxidation-sensitive metal substrates which can be soldered |
| 07/22/1998 | EP0739539B1 Process for filling contact holes |
| 07/22/1998 | EP0729394B1 Making quantum dot particles of uniform size |
| 07/22/1998 | EP0726925B1 Electrically conductive adhesives |
| 07/22/1998 | EP0634028B1 Method for forming a lithographic pattern in a process for manufacturing semiconductor devices |
| 07/22/1998 | EP0603360B1 Methods of forming a local interconnect and a high resistor polysilicon load |
| 07/22/1998 | EP0577667B1 Arc source macroparticle filter |