| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/24/2013 | CN103219290A Grid-dividing type flash memory and forming method thereof |
| 07/24/2013 | CN103219289A Flash memory with removal of floating-gate sharp corners and manufacturing method of flash memory |
| 07/24/2013 | CN103219288A Semiconductor device and forming method thereof |
| 07/24/2013 | CN103219287A Method for improving carrier mobility of complementary metal oxide semiconductor (CMOS) device |
| 07/24/2013 | CN103219286A LED (light emitting diode) display screen and manufacture method thereof |
| 07/24/2013 | CN103219285A Active matrix displays and other electronic devices having plastic substrates |
| 07/24/2013 | CN103219284A Thin film transistor (TFT) array substrate, manufacturing method and display device of TFT array substrate |
| 07/24/2013 | CN103219283A Array substrate, manufacturing method of array substrate and display device of array substrate |
| 07/24/2013 | CN103219282A Through silicon via (TSV) exposure process |
| 07/24/2013 | CN103219281A Through silicon via (TSV) back surface exposure process |
| 07/24/2013 | CN103219280A Method for manufacturing ductile circuit interconnection structure by utilization of electrostatic spinning technique and product thereof |
| 07/24/2013 | CN103219279A Semiconductor devices with copper interconnects and methods for fabricating same |
| 07/24/2013 | CN103219278A Metal filling process of silicon wafer through hole |
| 07/24/2013 | CN103219277A Integrated circuit and method of forming an integrated circuit |
| 07/24/2013 | CN103219276A Methods for fabricating semiconductor devices with reduced damage to shallow trench isolation (sti) regions |
| 07/24/2013 | CN103219275A Manufacturing method of silicon germanium on insulator (SGOI) or strained silicon on insulator (sSOI) with high relaxation and low defect density |
| 07/24/2013 | CN103219274A Silicon germanium on insulator (SGOI) or strained silicon on insulator (sSOI) preparation method based on quantum well structure |
| 07/24/2013 | CN103219273A Wet method etching and bearing device and method |
| 07/24/2013 | CN103219272A Methods of forming semiconductor devices |
| 07/24/2013 | CN103219271A Suction chuck and trasfering apparatus |
| 07/24/2013 | CN103219270A 机械手定位装置 Manipulator positioning device |
| 07/24/2013 | CN103219269A Wafer pre-locating device based on machine vision and method thereof |
| 07/24/2013 | CN103219268A Moving system |
| 07/24/2013 | CN103219267A Automatic conveying system for wafer testing |
| 07/24/2013 | CN103219266A Wafer waxing table |
| 07/24/2013 | CN103219265A Device and method for releasing a product substrate from a holder substrate |
| 07/24/2013 | CN103219264A Pulse train annealing method and apparatus |
| 07/24/2013 | CN103219263A Peeling device and method for producing electronic device |
| 07/24/2013 | CN103219262A System and method for processing substrate surface |
| 07/24/2013 | CN103219261A Substrate processing device and substrate processing method |
| 07/24/2013 | CN103219260A Etching device using extreme-edge gas pipeline |
| 07/24/2013 | CN103219259A Wafer processing jig |
| 07/24/2013 | CN103219258A Wafer defect sampling inspection system and method thereof |
| 07/24/2013 | CN103219257A Testing device of stack type wafer |
| 07/24/2013 | CN103219256A Rendering method for position measurement distribution image of epitaxy susceptor corresponding to light-emitting diode epitaxy wafer |
| 07/24/2013 | CN103219255A Ultrasonic welding chopper with multiple bonding wire grooves |
| 07/24/2013 | CN103219254A Method for forming metal pad |
| 07/24/2013 | CN103219253A Chip size packing structure and chip size packaging method |
| 07/24/2013 | CN103219252A Deflash method and apparatus for strip-shaped element |
| 07/24/2013 | CN103219251A Method for packaging large-size chip by using metal-based nano fiber composite heat dissipation material |
| 07/24/2013 | CN103219250A Preparation method of graphene radiating fins |
| 07/24/2013 | CN103219249A Manufacturing method of palladium-plated gold-plated double-plating bonding copper wire |
| 07/24/2013 | CN103219248A Manufacturing method of gold-plated bonding copper wire |
| 07/24/2013 | CN103219247A Manufacturing method of silver-plated bonding copper wire |
| 07/24/2013 | CN103219246A Manufacturing method of palladium-plated silver-plated double-plating bonding copper wire |
| 07/24/2013 | CN103219245A Manufacturing method of palladium-plated bonding copper wire |
| 07/24/2013 | CN103219244A Semiconductor substrate process, packaging method, packaging, and system-level packaging structure |
| 07/24/2013 | CN103219243A Manufacturing method of patterning metal lines |
| 07/24/2013 | CN103219242A Method for adjusting threshold voltage of multi-gate structure device |
| 07/24/2013 | CN103219241A Method of preparing groove discrete semiconductor device |
| 07/24/2013 | CN103219240A Manufacturing method of semi-conductor device |
| 07/24/2013 | CN103219239A Method for manufacturing AlGaN/GaN HEMT (High Electron Mobility Transistor) with high thermal stability |
| 07/24/2013 | CN103219238A Full-self-aligned insulated gate bipolar transistor device and manufacturing method thereof |
| 07/24/2013 | CN103219237A Manufacturing method of self-aligned insulated gate bipolar transistor |
| 07/24/2013 | CN103219236A Internal transparent collector insulated gate bipolar translator (IGBT) manufacturing technology with collector region carbon injection |
| 07/24/2013 | CN103219235A Method for improving electric leakage of transistor of high-voltage device |
| 07/24/2013 | CN103219234A Etching method and etching apparatus |
| 07/24/2013 | CN103219233A Method for flattening wafer |
| 07/24/2013 | CN103219232A Wet etching machine table device |
| 07/24/2013 | CN103219231A Methods of forming replacement gate structures for semiconductor devices |
| 07/24/2013 | CN103219230A Manufacturing method of low temperature polysilicon, low temperature polysilicon thin film and thin film transistor |
| 07/24/2013 | CN103219229A Quantitative judging method and feedback system for ELA (excimer laser annealing) heterogeneity |
| 07/24/2013 | CN103219228A Manufacturing method of polycrystalline silicon layer and polycrystalline silicon thin film transistor and manufacturing method thereof |
| 07/24/2013 | CN103219227A 等离子体清洗方法 Plasma cleaning method |
| 07/24/2013 | CN103219226A Method for reducing metal pollution on back of wafer during sedimentation of amorphous carbon film |
| 07/24/2013 | CN103219225A Barrier layer material for silicon-based ferroelectric capacitor integration and integrating method |
| 07/24/2013 | CN103219224A Wafer manufacturing process with environmental-friendly processing function |
| 07/24/2013 | CN103219223A Device and method for removing wafer residual hydrogen bromide |
| 07/24/2013 | CN103217846A Array substrate and display device |
| 07/24/2013 | CN103217843A Array substrate, manufacturing method thereof and liquid crystal panel |
| 07/24/2013 | CN103215650A Rapid thermal annealing apparatus |
| 07/24/2013 | CN103215568A Gas supply head and substrate processing apparatus |
| 07/24/2013 | CN103215567A Film deposition apparatus |
| 07/24/2013 | CN103215561A Plasma depositing and etching system |
| 07/24/2013 | CN103215549A Shielding design for metal gap filling |
| 07/24/2013 | CN103215535A Method for preparing protective coating layer for surface of plasma etched cavity |
| 07/24/2013 | CN103214972A Composition and method for planarizing surfaces |
| 07/24/2013 | CN103213371A Method for manufacturing electronic device and method for manufacturing glass laminate |
| 07/24/2013 | CN103213133A Robot system |
| 07/24/2013 | CN103213124A Robot system |
| 07/24/2013 | CN103212776A Electronic device, method of manufacturing, and electronic device manufacturing apparatus |
| 07/24/2013 | CN102812555B Semiconductor device and method for manufacturing the same |
| 07/24/2013 | CN102576191B Photosensitive resin composition and use thereof |
| 07/24/2013 | CN102468209B Method for forming buried layer of SiGe heterojunction bipolar transistor (HBT) |
| 07/24/2013 | CN102456726B 锗硅异质结双极晶体管 SiGe heterojunction bipolar transistor |
| 07/24/2013 | CN102456614B Realization method for metal source-substrate passage in radio-frequency LDMOS (laterally-diffused metal oxide semiconductor) apparatus |
| 07/24/2013 | CN102456541B Preparation method of SiGe monitoring piece and method for employing piece to carry out monitoring |
| 07/24/2013 | CN102437052B Method for forming silicides |
| 07/24/2013 | CN102420133B Method for manufacturing insulated gate bipolar transistor (IGBT) device |
| 07/24/2013 | CN102412311B PN junction variodenser in BiCMOS (bipolar complementary metal oxide semiconductor) process and manufacturing method thereof |
| 07/24/2013 | CN102412287B Silicon-germanium HBT (heterojunction bipolar transistor) device and fabrication method thereof |
| 07/24/2013 | CN102412283B Silicon-germanium HBT (heterojunction bipolar transistor) device and fabrication method thereof |
| 07/24/2013 | CN102412281B Silicon-germanium heterojunction bipolar transistor |
| 07/24/2013 | CN102412185B Method for decreasing resistance of source contact pin in radio-frequency LDMOS (Laterally Diffused Metal Oxide Semiconductor) device |
| 07/24/2013 | CN102412149B Production method of low-noise germanium-silicon heterojunction bipolar transistor |
| 07/24/2013 | CN102405438B Polarization film lamination apparatus, and LCD device production system equipped with same |
| 07/24/2013 | CN102403343B Vertical parasitic PNP device in BiCMOS (bipolar complementary metal oxide semiconductor) process and manufacturing method |
| 07/24/2013 | CN102403218B Etching method for contact holes |
| 07/24/2013 | CN102386219B Parasitic transversal type plug-and-ply (PNP) triode in silicon germanium (SiGe) heterojunction bipolar transistor (HBT) process and manufacturing method |
| 07/24/2013 | CN102376570B Manufacturing method of N-type radio frequency lateral double-diffused metal-oxide semiconductor (LDMOS) |