Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2013
07/24/2013CN102364671B Method for manufacturing silicon through hole
07/24/2013CN102347208B Method for reducing loading effect of thin film growth in furnace tube
07/24/2013CN102332451B Nano-wire stacked structure, formation method thereof and semiconductor layer patterning method
07/24/2013CN102290353B Sintering mold for controlled silicon chips and molybdenum pieces and using method of sintering mold
07/24/2013CN102280469B Epitaxial growth of III-V compound semiconductors on silicon surfaces
07/24/2013CN102272612B Testing apparatus
07/24/2013CN102263018B Method for improving loading effect of grid-electrode side wall growth of chip
07/24/2013CN102254879B Controlled silicon for large-size silicon chip employing plastic entity package and packaging process thereof
07/24/2013CN102254805B Method for adjusting work function of metal gate applied to N-channel metal oxide semiconductor (NMOS) device
07/24/2013CN102237289B Front opening unified pod with elliptical latch structure
07/24/2013CN102208406B Composition of pixel and preparation method thereof
07/24/2013CN102201428B Photonic device and manufacturing method thereof
07/24/2013CN102194680B Method for fabricating a gate structure
07/24/2013CN102194678B Method for etching grid
07/24/2013CN102187446B Electrostatic chuck, and method for manufacturing the chuck
07/24/2013CN102187437B Silicon etch with passivation using chemical vapor deposition
07/24/2013CN102174155B Polyorganosiloxane composition
07/24/2013CN102169851B Thin film transistor array substrate and manufacturing method thereof
07/24/2013CN102157493B 金属塞及其制造方法 Metal Slug and its manufacturing method
07/24/2013CN102157365B Method for thinning a wafer
07/24/2013CN102150191B 显示装置 Display device
07/24/2013CN102136477B Integrated circuits and methods for forming the same
07/24/2013CN102136431B Light emitting diode package and manufacturing method thereof
07/24/2013CN102130154B Silicon-controlled rectifier structure and manufacturing method thereof
07/24/2013CN102130123B Terminal structure for power MOS transistor and manufacturing method thereof
07/24/2013CN102124546B Carrier for dual-surface polishing device, and dual-surface polishing device and dual-surface polishing method using the same
07/24/2013CN102117761B Wet process method for improving chamfer smoothness on top of shallow trench isolation
07/24/2013CN102110654B Method for forming film structure on back of wafer
07/24/2013CN102097382B Method for manufacturing semiconductor device
07/24/2013CN102074502B Method of fabricating array substrate
07/24/2013CN102064178B Cell structure of one-time programmable memory (OTP) device and manufacturing method and operating method of cell structure
07/24/2013CN102054877B Silicon carbide semiconductor device
07/24/2013CN102034815B Insulated gate bipolar translator (IGBT) and manufacturing method thereof
07/24/2013CN102034774B A power-electronic arrangement
07/24/2013CN102017168B Apparatus for manufacturing thin film solar cell
07/24/2013CN102005393B Stripe overturning prevention device
07/24/2013CN101996995B Semiconductor device and method for manufacturing the same
07/24/2013CN101980935B Method and device for fixing and transporting impact-sensitive sheets in sputter feed systems
07/24/2013CN101971313B Wire loop and method of forming the wire loop
07/24/2013CN101969025B Method for forming self-aligned silicide area block film pattern
07/24/2013CN101960563B Microcrystalline silicon thin film transistor
07/24/2013CN101957530B TFT-LCD (Thin Film Transistor-Liquid Crystal Display) array baseplate and manufacturing method thereof
07/24/2013CN101957525B TFT-LCD array substrate and making method thereof
07/24/2013CN101933130B Defect inspection device and defect inspection method for silicon wafer
07/24/2013CN101924113B Image sensor and semiconductor manufacture technology
07/24/2013CN101908469B Processing apparatus
07/24/2013CN101883656B Ultrasonic vibration welder
07/24/2013CN101847604B Manufacturing method of semiconductor device
07/24/2013CN101821842B 半导体装置 Semiconductor device
07/24/2013CN101771021B Electric fuse structure and manufacture method thereof
07/24/2013CN101752381B OTP (one-time programmable) element structure and preparation method thereof
07/24/2013CN101740498B Semiconductor device with contact etching stop layer and forming method thereof
07/24/2013CN101681871B Device for coating a plurality of closest-packed substrates arranged on a susceptor
07/24/2013CN101665924B Film deposition apparatus and substrate processing apparatus
07/24/2013CN101656205B Integrated circuit metal gate structure and method of fabrication
07/24/2013CN101646954B Testing apparatus and electronic device
07/24/2013CN101636521B Magnetron sputtering apparatus
07/24/2013CN101609814B Method of forming semiconductor device and storage system
07/24/2013CN101582411B Semiconductor device and method for manufacturing the same
07/24/2013CN101556957B 半导体存储器器件及其制造方法 The semiconductor memory device and manufacturing method thereof
07/24/2013CN101540276B Plasma processing apparatus and method for manufacturing semiconductor device
07/24/2013CN101533857B 薄膜晶体管和显示器 A thin film transistor and a display
07/24/2013CN101510524B Method for manufacturing SOI substrate
07/24/2013CN101470360B Immersion lithographic apparatus and device manufacturing method
07/24/2013CN101447406B Loadlock designs and methods for using same
07/23/2013US8493296 Method of inspecting defect for electroluminescence display apparatus, defect inspection apparatus, and method of manufacturing electroluminescence display apparatus using defect inspection method and apparatus
07/23/2013US8492907 Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
07/23/2013US8492904 Semiconductor device and manufacturing method of the same
07/23/2013US8492900 Post passivation interconnection schemes on top of IC chip
07/23/2013US8492899 Method to electrodeposit nickel on silicon for forming controllable nickel silicide
07/23/2013US8492895 Semiconductor device with grounding conductor film formed on upper surface of dielectric film formed above integrated circuit
07/23/2013US8492888 Integrated circuit packaging system with stiffener and method of manufacture thereof
07/23/2013US8492887 Integrated circuit packaging system with leadframe and method of manufacture thereof
07/23/2013US8492880 Multilayered low k cap with conformal gap fill and UV stable compressive stress properties
07/23/2013US8492873 Integrated circuit guard ring structures
07/23/2013US8492870 Semiconductor package with interconnect layers
07/23/2013US8492869 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer
07/23/2013US8492868 Method, apparatus, and design structure for silicon-on-insulator high-bandwidth circuitry with reduced charge layer
07/23/2013US8492867 Semiconductor device including cell region and peripheral region having high breakdown voltage structure
07/23/2013US8492855 Micromechanical capacitive pressure transducer and production method
07/23/2013US8492852 Interface structure for channel mobility improvement in high-k metal gate stack
07/23/2013US8492851 Structures including an at least partially reoxidized oxide material
07/23/2013US8492849 High side semiconductor structure
07/23/2013US8492848 Application of cluster beam implantation for fabricating threshold voltage adjusted FETs
07/23/2013US8492847 Semiconductor device having insulating film with increased tensile stress and manufacturing method thereof
07/23/2013US8492846 Stress-generating shallow trench isolation structure having dual composition
07/23/2013US8492844 Fully depleted SOI device with buried doped layer
07/23/2013US8492830 Multiple channel fin-FET and its manufacturing method
07/23/2013US8492827 Vertical JFET limited silicon carbide metal-oxide semiconductor field effect transistors
07/23/2013US8492825 Nonvolatile semiconductor memory device and method of fabricating the same
07/23/2013US8492823 High performance tapered varactor
07/23/2013US8492819 FET eDRAM trench self-aligned to buried strap
07/23/2013US8492817 Highly scalable trench capacitor
07/23/2013US8492813 Semiconductor device and semiconductor device manufacturing method
07/23/2013US8492803 Field effect device with reduced thickness gate
07/23/2013US8492791 Optical semiconductor device
07/23/2013US8492786 Light emitting device package and lighting system
07/23/2013US8492779 Nitride semiconductor LED and fabrication method thereof
07/23/2013US8492768 Semiconductor device and method of fabricating the same
07/23/2013US8492767 TFT substrate and manufacturing method thereof