| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/24/2013 | CN203085503U Graphite boat correction device |
| 07/24/2013 | CN203085502U Simple quartz boat bearing apparatus |
| 07/24/2013 | CN203085501U Wafer boat bearing device |
| 07/24/2013 | CN203085500U Diffusion quartz boat |
| 07/24/2013 | CN203085499U Novel plasma etching machine and air inlet mechanism thereof |
| 07/24/2013 | CN203085498U Separating device |
| 07/24/2013 | CN203085497U Substrate carrying cavity and etching equipment |
| 07/24/2013 | CN203085496U Tool capable of quickly removing surface welding balls and surface-layer protection materials of chip |
| 07/24/2013 | CN203085495U A bonding machine platform device |
| 07/24/2013 | CN203085494U A leading wire position-limiting device of the wire feeding system of a bonding machine |
| 07/24/2013 | CN203085493U SOD123 packaged chip screening and mounting template |
| 07/24/2013 | CN203085492U Bottom filling device used for megapixel HgCdTe composite chip |
| 07/24/2013 | CN203085491U A low-temperature plasma cleaning device |
| 07/24/2013 | CN203080107U Etching and roasting equipment |
| 07/24/2013 | CN203077523U Device for removing flash of semiconductor device |
| 07/24/2013 | CN203077507U SOD123 packaging element assembly jig |
| 07/24/2013 | CN103222061A 布线构造 Wiring structure |
| 07/24/2013 | CN103222060A Method for manufacturing a mos-ield effect transistor |
| 07/24/2013 | CN103222057A Semiconductor device and method for manufacturing semiconductor device |
| 07/24/2013 | CN103222056A Bipolar non-punch-hrough power semiconductor device |
| 07/24/2013 | CN103222050A Crack arrest vias for ic devices |
| 07/24/2013 | CN103222044A Methods of forming electrical components and memory cells |
| 07/24/2013 | CN103222043A High conductivity electrostatic chuck |
| 07/24/2013 | CN103222042A Carrier for separated electronic components and method for visual inspection of separated electronic components |
| 07/24/2013 | CN103222041A Heating arrangement and method for heating substrates |
| 07/24/2013 | CN103222040A Adhesive composition, method for manufacturing semiconductor device, and semiconductor device |
| 07/24/2013 | CN103222039A Semiconductor element, semiconductor device, and method for manufacturing semiconductor element |
| 07/24/2013 | CN103222038A Vertical FET |
| 07/24/2013 | CN103222037A Thin-film transistor substrate, display device provided with same, and method for manufacturing thin-film transistor substrate |
| 07/24/2013 | CN103222036A Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate |
| 07/24/2013 | CN103222035A Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate |
| 07/24/2013 | CN103222034A Polishing pad comprising transmissive region |
| 07/24/2013 | CN103222033A Dual-bulb lamphead control methodology |
| 07/24/2013 | CN103222032A Sintered device |
| 07/24/2013 | CN103222028A Improved simultaneous multiple ion implantation process and apparatus semiconductor structure made using same |
| 07/24/2013 | CN103222027A Semiconductor structure made using improved pseudo-simultaneous multiple ion implantation process |
| 07/24/2013 | CN103221888A Resist underlayer film forming composition, and method for forming resist pattern using same |
| 07/24/2013 | CN103221834A Integrated circuit for and method of testing die -o -die bonding |
| 07/24/2013 | CN103221813A Measuring device and method for measuring layer thicknesses and defects in a wafer stack |
| 07/24/2013 | CN103221586A Methods of forming bulk III-itride materials on metal-nitride growth template layers, and structures formed by such methods |
| 07/24/2013 | CN103221503A Method for producing abrasive grains, method for producing slurry, and method for producing polishing liquid |
| 07/24/2013 | CN103221483A Resin composition, insulating film, film forming method, and electronic component |
| 07/24/2013 | CN103221482A Polymer composition for microelectronic assembly |
| 07/24/2013 | CN103221471A Semiconductor inks, films, coated substrates and methods of preparation |
| 07/24/2013 | CN103221332A Packaging to reduce stress on microelectromechanical systems |
| 07/24/2013 | CN103221331A Sealed packaging for microelectromechanical systems |
| 07/24/2013 | CN103221180A Superabrasive tools having substantially leveled particle tips and associated methods |
| 07/24/2013 | CN103219395A Multi-channel terminal structure used for semiconductor element and manufacturing method of multi-channel terminal structure |
| 07/24/2013 | CN103219392A Thin film transistor, array substrate, manufacturing method and display device |
| 07/24/2013 | CN103219391A Thin film transistor, manufacturing method thereof, array substrate and display device |
| 07/24/2013 | CN103219389A Thin film transistor and manufacturing method thereof and array substrate and display device |
| 07/24/2013 | CN103219387A Thin-film transistor and method for manufacturing same |
| 07/24/2013 | CN103219386A Transverse power component with high K insulating regions |
| 07/24/2013 | CN103219384A Anti-single particle radiation multi-grid device and preparation method thereof |
| 07/24/2013 | CN103219382A Semiconductor element, semiconductor device, and power converter |
| 07/24/2013 | CN103219381A Germanium (Ge) base tri-gate device and manufacturing method thereof |
| 07/24/2013 | CN103219380A Finfets and methods for forming the same |
| 07/24/2013 | CN103219379A High electron mobility device adopting grid first process and preparation method thereof |
| 07/24/2013 | CN103219378A Low parasitic resistance radio-frequency power device and preparation method thereof |
| 07/24/2013 | CN103219377A Radio-frequency power device for achieving asymmetrical autocollimation of source gates and drain gates and preparation method thereof |
| 07/24/2013 | CN103219376A Gallium nitride radio-frequency power device and preparation method thereof |
| 07/24/2013 | CN103219371A Trench gate type insulated gate bipolar translator (IGBT) with double-face diffusion residual layer and manufacturing method thereof |
| 07/24/2013 | CN103219369A Device with low parasitic resistance and high electron mobility and manufacturing method thereof |
| 07/24/2013 | CN103219368A Methods of forming a gate cap layer above a replacement gate structure and a semiconductor device that includes such a gate structure and cap layer |
| 07/24/2013 | CN103219367A Composite dummy gate with conformal polysilicon layer for FinFET device |
| 07/24/2013 | CN103219366A Fin-shaped field effect transistor structure and manufacturing method thereof |
| 07/24/2013 | CN103219364A Semiconductor device and method for manufacturing the same |
| 07/24/2013 | CN103219361A Semiconductor substrate and semiconductor substrate manufacturing method |
| 07/24/2013 | CN103219359A Organic electroluminescent array substrate and manufacturing method thereof, display device |
| 07/24/2013 | CN103219358A Organic light emitting display devices and methods of manufacturing organic light emitting display devices |
| 07/24/2013 | CN103219354A Organic light emitting device and manufacturing method thereof |
| 07/24/2013 | CN103219341A Array substrate, preparation method of array substrate and display device |
| 07/24/2013 | CN103219340A Halbleiterstruktur und verfahren zu deren herstellung |
| 07/24/2013 | CN103219337A Semiconductor device and method for manufacturing semiconductor device |
| 07/24/2013 | CN103219336A Array substrate, display device and preparation method of array substrate |
| 07/24/2013 | CN103219333A Enhancement type Flash chip, encapsulating method and instruction execution method |
| 07/24/2013 | CN103219325A Multi-dimensional integrated circuit structures and methods of forming the same |
| 07/24/2013 | CN103219324A Stackable semiconductor chip packaging structure and process thereof |
| 07/24/2013 | CN103219323A 半导体装置 Semiconductor device |
| 07/24/2013 | CN103219321A Composite copper diffusion blocking layer and preparation method thereof |
| 07/24/2013 | CN103219319A Array substrate and manufacturing method thereof and display device |
| 07/24/2013 | CN103219318A High-temperature-resistant MIM capacitor for microwave internal matching transistor and manufacturing method thereof |
| 07/24/2013 | CN103219317A Packaging integrated circuit by fabricating package module from successive build-up layers having circuit interconnections, and forming cavity on top-side of package module |
| 07/24/2013 | CN103219316A Package assembly and method of forming the same |
| 07/24/2013 | CN103219314A Electronic device and a method for fabricating an electronic device |
| 07/24/2013 | CN103219310A Mixed solder ball arrangement and forming method thereof |
| 07/24/2013 | CN103219309A Multi-chip fan out package and methods of forming the same |
| 07/24/2013 | CN103219307A Semiconductor packaging structure and method |
| 07/24/2013 | CN103219306A Encapsulating structure with electronic assembly in embedded mode and manufacturing method thereof |
| 07/24/2013 | CN103219305A Salient point bottom protection structure |
| 07/24/2013 | CN103219304A Semiconductor wafer level packaging structure and preparation method thereof |
| 07/24/2013 | CN103219303A Packaging structure and method of TSV (Through Silicon Vias) back leakage hole |
| 07/24/2013 | CN103219301A Power semiconductor module and method of manufacturing the same |
| 07/24/2013 | CN103219300A Heat dissipation base plate, thin-type heat dissipation module, and method for manufacturing same |
| 07/24/2013 | CN103219299A Integrated circuit package assembly and method of forming the same |
| 07/24/2013 | CN103219297A Carrier, semiconductor package and fabrication method thereof |
| 07/24/2013 | CN103219296A Multifunctional film for semiconductor encapsulation and manufacture method of multifunctional film |
| 07/24/2013 | CN103219293A Sawing underfill in packaging processes |
| 07/24/2013 | CN103219292A Monolithic integration of photonics and electronics in CMOS processes |
| 07/24/2013 | CN103219291A Method for preparing cavity type memory based on quantum dots |