| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/25/2013 | WO2013108300A1 Thin film transistor |
| 07/25/2013 | WO2013108120A1 Process for manufacturing a semiconductor substrate, and semiconductor substrate obtained |
| 07/25/2013 | WO2013108100A1 External auxiliary execution unit interface to off-chip auxiliary execution unit |
| 07/25/2013 | WO2013107766A1 Vacuum deposition system |
| 07/25/2013 | WO2013107698A1 Sample positioning device and method for operation thereof |
| 07/25/2013 | WO2013107508A1 Bipolar junction transistor with spacer layer and method of manufacturing the same |
| 07/25/2013 | WO2013107406A1 Methods and apparatus for a substrate core layer |
| 07/25/2013 | WO2013107205A1 Three-dimensional integrated circuit structure and material manufacturing method |
| 07/25/2013 | WO2013106949A1 Variable structured vacuum chamber for internal rarefied airflow simulation checking and pressure detection |
| 07/25/2013 | WO2013078136A4 Semiconductor substrate and method of forming |
| 07/25/2013 | WO2013071033A4 A system for use in the formation of semiconductor crystalline materials |
| 07/25/2013 | WO2013064906A3 Ultrathin wafer debonding systems |
| 07/25/2013 | WO2013049463A3 Double gate ion sensitive field effect transistor |
| 07/25/2013 | WO2012152672A4 Method for producing reconstituted wafers with support of the chips during their encapsulation |
| 07/25/2013 | WO2012127960A9 Semiconductor device and method for manufacturing same |
| 07/25/2013 | WO2012075306A3 Making semiconductor bodies from molten material using a free-standing interposer sheet |
| 07/25/2013 | US20130189854 Method for depositing a chlorine-free conformal sin film |
| 07/25/2013 | US20130189853 Low Temperature Deposition of Silicon-Containing Films |
| 07/25/2013 | US20130189852 Liquid processing apparatus, liquid processing method, and storage medium |
| 07/25/2013 | US20130189851 CVD Conformal Vacuum/Pumping Guiding Design |
| 07/25/2013 | US20130189850 Resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coating |
| 07/25/2013 | US20130189849 Particle reducing method and film deposition method |
| 07/25/2013 | US20130189848 Shielded lid heater assembly |
| 07/25/2013 | US20130189847 Plasma processing apparatus |
| 07/25/2013 | US20130189846 Methods of Forming Patterns |
| 07/25/2013 | US20130189845 Conformal amorphous carbon for spacer and spacer protection applications |
| 07/25/2013 | US20130189844 Method to increase the pattern density of integrated circuits using near-field EUV patterning technique |
| 07/25/2013 | US20130189843 Slurry for planarizing photoresist |
| 07/25/2013 | US20130189842 Chemical mechanical polishing (cmp) composition comprising a specific heteropolyacid |
| 07/25/2013 | US20130189841 Engineering dielectric films for cmp stop |
| 07/25/2013 | US20130189840 Methods for forming a contact metal layer in semiconductor devices |
| 07/25/2013 | US20130189839 Method to form silicide contact in trenches |
| 07/25/2013 | US20130189838 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
| 07/25/2013 | US20130189837 Selective formation of metallic films on metallic surfaces |
| 07/25/2013 | US20130189836 Photo-patternable dielectric materials curable to porous dielectric materials, formulations, precursors and methods of use thereof |
| 07/25/2013 | US20130189835 Method for cleaning a semiconductor device |
| 07/25/2013 | US20130189833 Method of Forming Self-Aligned Contacts for a Semiconductor Device |
| 07/25/2013 | US20130189832 Semiconductor device and manufacturing method thereof |
| 07/25/2013 | US20130189831 Silicon/germanium nanoparticle inks and methods of forming inks with desired printing properties |
| 07/25/2013 | US20130189830 Methods of Forming Semiconductor Devices |
| 07/25/2013 | US20130189829 Devices with crack stops |
| 07/25/2013 | US20130189827 Through wafer vias and method of making same |
| 07/25/2013 | US20130189826 Reduced Corner Leakage in SOI Structure and Method |
| 07/25/2013 | US20130189825 Method of producing insulation trenches in a semiconductor on insulator substrate |
| 07/25/2013 | US20130189823 Profile Engineered Thin Film Devices and Structures |
| 07/25/2013 | US20130189822 Methods of fabricating integrated circuits with the elimination of voids in interlayer dielectics |
| 07/25/2013 | US20130189821 Methods for fabricating semiconductor devices with reduced damage to shallow trench isolation (sti) regions |
| 07/25/2013 | US20130189818 Trench isolation and method of fabricating trench isolation |
| 07/25/2013 | US20130189814 Method for Fabricating Array-Molded Package-on-Package |
| 07/25/2013 | US20130189812 Coaxial plated through holes (pth) for robust electrical performance |
| 07/25/2013 | US20130189804 Method and system for template assisted wafer bonding using pedestals |
| 07/25/2013 | US20130189802 Substrate holder, lithographic apparatus, and device manufacturing method |
| 07/25/2013 | US20130189801 Advanced finishing control |
| 07/25/2013 | US20130189800 Plasma processing apparatus and plasma processing method |
| 07/25/2013 | US20130189799 Method of fabricating dual trench isolated epitaxial diode array |
| 07/25/2013 | US20130189533 Resist underlayer film forming composition for lithography containing polyether structure-containing resin |
| 07/25/2013 | US20130188904 Hybrid laser light sources for photonic integrated circuits |
| 07/25/2013 | US20130188903 Photonic device and methods of formation |
| 07/25/2013 | US20130188662 Semiconductor laser and method of manufacturing the same |
| 07/25/2013 | US20130188319 Electronic device and method of manufacturing the same |
| 07/25/2013 | US20130188164 Double dipole lithography method for semiconductor device fabrication |
| 07/25/2013 | US20130187986 Liquid jet head, liquid jet apparatus, and method of manufacturing liquid jet head |
| 07/25/2013 | US20130187546 Novel Coherent Multiple Side Electromagnets |
| 07/25/2013 | US20130187349 Scan head and scan arm using the same |
| 07/25/2013 | US20130187295 Sensor module, production method of a sensor module, and injection mold for encapsulating a sensor module |
| 07/25/2013 | US20130187293 Electronic device, method of manufacturing, and electronic device manufacturing apparatus |
| 07/25/2013 | US20130187292 Multi-Dimensional Integrated Circuit Structures and Methods of Forming the Same |
| 07/25/2013 | US20130187290 Three dimensional structure memory |
| 07/25/2013 | US20130187289 Semiconductor device structures and electronic devices including same hybrid conductive vias, and methods of fabrication |
| 07/25/2013 | US20130187285 Carrier, semiconductor package and fabrication method thereof |
| 07/25/2013 | US20130187284 Low Cost and High Performance Flip Chip Package |
| 07/25/2013 | US20130187283 Method of manufacturing a semiconductor device and semiconductor device |
| 07/25/2013 | US20130187282 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium |
| 07/25/2013 | US20130187281 Semiconductor device and method for manufacturing of same |
| 07/25/2013 | US20130187279 Semiconductor device structures including buried digit lines and related methods |
| 07/25/2013 | US20130187276 Microelectronic device having metal interconnection levels connected by programmable vias |
| 07/25/2013 | US20130187275 Semiconductor device and fabrication process thereof |
| 07/25/2013 | US20130187274 Semiconductor device having a nanotube layer and method for forming |
| 07/25/2013 | US20130187273 Semiconductor devices with copper interconnects and methods for fabricating same |
| 07/25/2013 | US20130187269 Package assembly and method of forming the same |
| 07/25/2013 | US20130187268 Semiconductor Packaging Structure and Method |
| 07/25/2013 | US20130187266 Integrated circuit package assembly and method of forming the same |
| 07/25/2013 | US20130187264 Low ohmic contacts |
| 07/25/2013 | US20130187263 Semiconductor stacked package and method of fabricating the same |
| 07/25/2013 | US20130187260 Packaged semiconductor devices, and related methods and systems |
| 07/25/2013 | US20130187259 Electronic Device and a Method for Fabricating an Electronic Device |
| 07/25/2013 | US20130187258 Sawing Underfill in Packaging Processes |
| 07/25/2013 | US20130187257 Semiconductor device and method for manufacturing the same |
| 07/25/2013 | US20130187256 Semiconductor device and method for manufacturing the same |
| 07/25/2013 | US20130187254 Semiconductor Chip and Methods for Producing the Same |
| 07/25/2013 | US20130187247 Multi-bit magnetic tunnel junction memory and method of forming same |
| 07/25/2013 | US20130187246 Backside integration of rf filters for rf front end modules and design structure |
| 07/25/2013 | US20130187241 Interfacial layer regrowth control in high-k gate structure for field effect transistor |
| 07/25/2013 | US20130187240 Semiconductor device and method for manufacturing the same |
| 07/25/2013 | US20130187237 Structure and method for transistor with line end extension |
| 07/25/2013 | US20130187236 Methods of Forming Replacement Gate Structures for Semiconductor Devices |
| 07/25/2013 | US20130187235 Composite dummy gate with conformal polysilicon layer for finfet device |
| 07/25/2013 | US20130187234 Structure and method for stress latching in non-planar semiconductor devices |
| 07/25/2013 | US20130187229 Semiconductor device with a low-k spacer and method of forming the same |
| 07/25/2013 | US20130187228 FinFET Semiconductor Devices with Improved Source/Drain Resistance and Methods of Making Same |